The invention relates to a plastic film brush copper plating process. The process comprises the following steps: carrying out first copper plating treatment on a plastic film by adopting a physical vapor deposition method, preparing a first copper film on one surface of the plastic film, and preparing a second copper film on the other surface of the plastic film; second copper plating treatment is conducted on the first copper film and the second copper film in a brush copper plating mode, a third copper film is prepared on the first copper film, and a fourth copper film is prepared on the second copper film; the anode of the second copper plating treatment is a brush plating roller; and a copper plating solution adopted in the second copper plating treatment comprises water, copper sulfate, sulfuric acid, chloride ions, 1, 4-cyclohexanedione monoethylene ketal, phthalimide potassium salt and a polyol compound. According to the copper plating process, the plating speed is high, the copper film layer with fine, continuous and uniform crystals can be obtained, no adverse effect is generated on the original copper plating film layer, the binding force of the plated film layer is excellent, the film surface sheet resistance can meet the finished product requirement through one-time brush plating film forming, the plastic film is not punctured, and the copper plating process is suitable for amplification application.