Copper plating additive, copper plating solution and application thereof

A technology of copper plating solution and additive, applied in copper plating additive, copper plating solution and its application fields, can solve the problems such as the appearance of the coating is not bright enough, the coating is not uniform, and achieve the effects of low cost, fine grains, and increased thickness

Active Publication Date: 2022-05-27
JIANGYIN NANOPORE INNOVATIVE MATERIALS TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In recent decades, scholars from all over the world have done in-depth and long-term research on cyanide-free copper plating technology, and the cyanide-free electroplating copper technology has realized industrial production and achieved good social and economic effects. Brush copper plating also has defects such as uneven plating and insufficient bright appearance of the plating

Method used

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  • Copper plating additive, copper plating solution and application thereof
  • Copper plating additive, copper plating solution and application thereof
  • Copper plating additive, copper plating solution and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063] (1) In the present embodiment, the composition of the copper plating additive per liter is as follows:

[0064] 1,4-cyclohexanedione monoethylene glycol ketal 10g,

[0065] Phthalimide Potassium Salt 20g and

[0066] 3-amino-1,2-propanediol 30g.

[0067] (2) In the present embodiment, every liter of described copper plating solution is made up of water and following components:

[0068]

[0069]

[0070] (3) the preparation method of the copper plating solution described in the present embodiment is as follows:

[0071] 1) Prepare 1,4-cyclohexanedione monoethylene glycol ketal solution: dissolve 10 g of 1,4-cyclohexanedione monoethylene glycol ketal in 200 ml of deionized water, stir and dissolve until clear, and set aside;

[0072] 2) Preparation of phthalimide potassium salt: use an analytical balance to weigh 20 g for preparation, and set aside;

[0073] 3) Prepare 3-amino-1,2-propanediol solution: dissolve 30g of 3-amino-1,2-propanediol in 500ml of deioniz...

Embodiment 2

[0082](1) In the present embodiment, the composition of the copper plating additive per liter is as follows:

[0083] 1,4-cyclohexanedione monoethylene glycol ketal 6g,

[0084] Phthalimide Potassium Salt 12g and

[0085] 3-Amino-1,2-propanediol 18g.

[0086] (2) In the present embodiment, every liter of described copper plating solution is made up of water and following components:

[0087]

[0088] (3) the preparation method of the copper plating solution described in the present embodiment is as follows:

[0089] 1) Prepare 1,4-cyclohexanedione monoethylene glycol ketal solution: dissolve 6 g of 1,4-cyclohexanedione monoethylene glycol ketal in 200 ml of deionized water, stir and dissolve until clear, and set aside;

[0090] 2) Preparation of phthalimide potassium salt: use an analytical balance to weigh 12 g for preparation, and set aside;

[0091] 3) Prepare 3-amino-1,2-propanediol solution: dissolve 18g of 3-amino-1,2-propanediol in 500ml of deionized water, stir ...

Embodiment 3

[0100] (1) In the present embodiment, the composition of the copper plating additive per liter is as follows:

[0101] 1,4-cyclohexanedione monoethylene glycol ketal 7g,

[0102] Phthalimide Potassium Salt 14g and

[0103] 3-amino-1,2-propanediol 21g.

[0104] (2) In the present embodiment, every liter of described copper plating solution is made up of water and following components:

[0105]

[0106] (3) the preparation method of the copper plating solution described in the present embodiment is as follows:

[0107] 1) Prepare 1,4-cyclohexanedione monoethylene glycol ketal solution: dissolve 7 g of 1,4-cyclohexanedione monoethylene glycol ketal in 200 ml of deionized water, stir and dissolve until clear, and set aside;

[0108] 2) Preparation of phthalimide potassium salt: use an analytical balance to weigh 14 g for preparation, and set aside;

[0109] 3) Prepare 3-amino-1,2-propanediol solution: dissolve 21g of 3-amino-1,2-propanediol in 500ml of deionized water, stir...

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Abstract

The invention relates to a copper plating additive, a copper plating solution and application thereof. The copper plating additive comprises 1, 4-cyclohexanedione monoethylene ketal, a potassium phthalimide salt and an amino polyol compound. Wherein the 1, 4-cyclohexanedione monoethylene glycol ketal can obviously improve the brightness of a brush plating copper layer, the phthalimide potassium salt can effectively improve the dissolving efficiency of the 1, 4-cyclohexanedione monoethylene glycol ketal, meanwhile, the effects of refining grains, leveling and improving the uniformity and thickness of a plating layer are achieved, and the amino polyalcohol compound can greatly change the color tone of the copper layer; the color is brighter. In addition, the copper plating additive has the advantages of being environmentally friendly, non-toxic, low in cost and the like, and is suitable for large-scale industrial production. When the copper plating additive is added into a copper plating solution, the thickness, the brightness and the plumpness of a plating layer can be greatly improved by adding a very small amount of the copper plating additive, and the stability of the original copper plating solution and the performance of the original copper plating layer are not changed.

Description

technical field [0001] The invention relates to the technical field of copper plating, in particular to a copper plating additive, a copper plating solution and applications thereof. Background technique [0002] Brush plating, also known as metal pen plating, fast electroplating, brush plating, uses the electro-chemical method to use the plating pen soaked in the plating solution as the anode, so that the metal ions are discharged and crystallized on the surface of the negative electrode (workpiece) to form a metal coating. process. [0003] The brush copper plating process is mainly used in fields that require high electrical conductivity, such as electronic power and aerospace, and has extremely high practical value especially for partial plating and repair of plating. During the operation, the relative movement speed of the cathode and the anode is fast, so it is allowed to use a higher current density (several times to dozens of times higher than the current density us...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38C25D5/22
CPCC25D3/38C25D5/22Y02E60/10
Inventor 刘国春李学法张国平
Owner JIANGYIN NANOPORE INNOVATIVE MATERIALS TECH LTD
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