154 results about "Copper coating" patented technology

The invention provides a preparation method of a bipolar current collector based on a selective double-sided modified masking film. The preparation method comprises the following steps: depositing a Ni-Cr alloy layer on a single side surface of an aluminum substrate; one side of the masking film is etched to form a roughened surface, and the other side of the masking film is hydrophobic to form a hydrophobic surface; the roughened surface of the masking film and the surface, without the Ni-Cr alloy layer, of the aluminum matrix are pressed, and the edge is coated with curing glue; and placing the pressed and glued sample in an electroplating solution to electroplate a copper layer, finally cutting off an edge glue sealing area, and stripping the masking film. According to the preparation method, the masking film used for protecting the back surface of the aluminum substrate is subjected to double-sided differential treatment, the edge sealing technology is matched, and the Ni-Cr alloy is adopted for bottoming, so that the adhesive force between the copper plating layer and the aluminum substrate is improved, the risk of causing corrosion of a primary battery is reduced, the bipolar current collector which is firmly combined and has a pure interface can be prepared, and the service life of the bipolar current collector is prolonged. And a feasible solution is provided for realizing light-weight and high-performance current collectors for electronic devices such as lithium batteries and the like.

The invention relates to a method for realizing in-hole signal isolation based on chemical copper deposition resisting ink and a selective chemical copper deposition process, which comprises the following steps of: coating the chemical copper deposition resisting ink at preset hole opening positions on two sides of a PCB (Printed Circuit Board) core board to form chemical copper deposition resisting ink film layers; a palladium poisoning agent and a surface active agent for inhibiting palladium adsorption are added into the chemical copper deposition resisting ink; laminating the PCB core board to be separated with other boards to form a pretreated board; performing trepanning treatment on a preset trepanning position of the pretreatment plate to form a via hole; and performing chemical copper deposition treatment on the pre-treated board to form a copper layer on the side wall of the via hole of the pre-treated board, and removing the chemical copper deposition resistant ink film layer from the pre-treated board to form the PCB. Therefore, due to the fact that the palladium poisoning agent and the surface active agent for inhibiting palladium adsorption are added into the anti-electroless copper deposition printing ink, the formed anti-electroless copper deposition printing ink film layer is resistant to attack of chemical copper series liquid medicine, the problem of copper coating on a separation layer can be effectively reduced or eliminated, and in-hole signal separation can be effectively achieved.

The invention provides a method for inhibiting the formation of Kirkendall holes in an In-based brazing filler metal welding interface by adopting a vertical twin structure, which comprises the following steps of: respectively adhering a layer of vertical twin structure to the surfaces of an upper metal substrate to be welded and a lower metal substrate to be welded which are subjected to surface treatment in an electro-deposition manner, wherein the size of the vertical twin structure is 5 * 5 mm, the thickness of the vertical twin structure is 20-40 mu m, and the thickness of the vertical twin structure is 10 * 10 mm; the method comprises the following steps: carrying out a thermocompression bonding experiment on a pure copper coating with a vertical orientation nano twin crystal structure at set bonding temperature, pressure and time; according to the technical scheme, by means of the structural characteristic that the diffusion coefficient of the vertically-arranged twin boundaries in the nano twin structure is low, the diffusion rate of interface elements is reduced, flux balance is maintained, and the low impurity characteristic of the vertically-oriented nano twin film is utilized, so that formation of Kirkendall voids in the welding interface is limited. The method provided by the invention is simple and convenient to operate, and has great significance for improving the connection reliability of the In-based low-temperature bonding system.

The invention provides a preparation method and application of a pure copper coating, and relates to the field of surface functional coatings, and the preparation method comprises the following steps: preparing pure copper powder, and carrying out sand blasting treatment on the surface of an aluminum alloy substrate; the aluminum alloy substrate is fixed in a closed cold spraying chamber, and pure copper powder is loaded into helium cold spraying equipment in the closed cold spraying chamber; vacuumizing until the pressure in the closed cold spraying chamber is lower than a preset pressure threshold value and the oxygen content in the chamber is lower than a preset value; helium in a buffer tank is adopted as main gas and powder feeding gas, and a pure copper coating is formed on the surface of the aluminum alloy substrate through spraying of helium cold spraying equipment; and the helium circulation system is synchronously started to recover helium in the cavity, and the helium is compressed into the buffer tank after being filtered and cooled, so that helium circulation is realized. The method adopts the circulating helium atmosphere to avoid the problem that the impurity content of the coating is increased due to high-temperature oxidation of the copper coating, the oxygen content of the coating is remarkably reduced, and the particle interface bonding is improved, so that the electric conduction and heat conduction performance of the pure copper coating is improved, and the helium use cost is reduced.

The invention belongs to the technical field of high-power electronic component base materials, and discloses an embedded high-thermal-conductivity ceramic packaging substrate for a high-power scene and a preparation method of the embedded high-thermal-conductivity ceramic packaging substrate. ABF composite layers are arranged above and below a ceramic core plate in the ceramic packaging substrate; a high-thermal-conductivity base material is fixed in the ceramic substrate; interconnection holes are formed in the ceramic substrate, and electroplating copper film layers are arranged on the upper surface and the lower surface of the ceramic substrate and in the interconnection holes; a copper-clad plate layer is arranged on the outer side of the ABF layer, a copper-clad plate groove is formed in the copper-clad plate layer, a blind hole is formed in the copper-clad plate groove, and a copper column is arranged in the blind hole; a solder mask layer is arranged on the surface of the ABF layer on the outermost side, a surface treatment layer is arranged on the outer side of the solder mask layer, and blind holes with built-in copper columns are formed in the surface treatment layer. The preparation method comprises the following steps: forming a substrate groove in the surface of the ceramic substrate; embedding a high-thermal-conductivity base material; arranging an electroplating copper film coating layer; an ABF composite layer is arranged; arranging a solder mask layer; and arranging a surface treatment layer. The LED lamp is good in heat dissipation effect.

The invention discloses a copper-clad plate copper-clad quality detection method and system, and the method comprises the steps: applying an ultrasonic excitation signal with preset frequency and power to a to-be-detected copper-clad plate, and synchronously employing a high-speed camera to collect a dynamic micro-vibration response image sequence of the surface of the copper-clad plate under the excitation of ultrasonic waves; performing phase locking analysis on the dynamic micro-vibration response image sequence, and constructing a copper-clad plate dynamic response feature map; inputting the dynamic response feature map of the copper-clad plate into the trained defect identification model, and outputting a preliminary defect area distribution map; performing multi-scale morphological analysis and region connectivity verification on the preliminary defect region distribution map to generate an accurate positioning defect region map; and generating a comprehensive evaluation report of the copper coating quality according to a preset quality scoring rule on the basis of the accurately positioned defect area graph. According to the embodiment of the invention, the method can achieve the high-precision positioning and classification of the defects of the copper-clad plate, and provides an efficient and reliable automatic solution for the quality evaluation of the copper-clad plate.

The invention belongs to the technical field of electrolytic copper foils, and relates to a strippable carrier ultrathin copper foil and a preparation method thereof.The strippable carrier ultrathin copper foil comprises a carrier layer, a stripping layer and an ultrathin copper foil layer, the stripping layer comprises an inorganic stripping layer and an organic stripping layer, and the thickness of the ultrathin copper foil layer is 3-5 microns; and the ultrathin copper foil layer is prepared by adopting an alkaline copper plating process and an acidic copper plating process in sequence. According to the method, the compact and smooth copper plating layer is obtained through alkaline copper plating firstly, then acid copper plating is conducted, and the ultrathin copper layer which is few in pinhole and can be stably peeled off is prepared through the process that the two modes are combined.

The application discloses a high-strength alloy for an antenna and a preparation process thereof, and relates to the technical field of alloys.The application uses aluminum alloy as the antenna, and the aluminum alloy is light in weight and has good conductivity; in order to further improve the conductivity of the antenna, the antenna is more efficient in signal transmission; the application adopts electroplating technology to plate a copper layer on the surface of the aluminum alloy; and carbon nanotube-silicon dioxide compounds are added into the electroplating solution, so that the strength of the alloy for the antenna is enhanced.The carbon nanotube is high in strength, and the surface of the carbon nanotube is subjected to copper plating treatment, so that the conductivity of the antenna is improved; meanwhile, the copper plating treatment on the surface of the carbon nanotube can improve the bonding force between the carbon nanotube and the copper plating layer and improve the adhesion of the electroplating layer, so that the durability and reliability of the alloy for the antenna are enhanced.

A kind of plating experiment device and method for preparing high bonding force copper plating layer on aluminum-based heat sink surface, it relates to material processing technical field.Plasma chamber is provided with heater, motion control mechanism can carry out public self-rotating compound motion and is connected bias power supply, evaporation source includes crucible, electron gun, deflection coil and ion source, so that the inside of plasmaplasma chamber forms pure strong current ion flushing area and strong current ion enhanced electron beam evaporation plating area, vacuum and gas supply system connects plasmaplasma chamber and carries out vacuumizing, and respectively with plasmaplasma chamber and ion source connection supply reaction gas and working gas.By the spatial partition layout of plasmaplasma chamber cooperation motion control mechanism public self-rotating compound motion, workpiece is periodically alternated through two functional areas in film forming process, utilizes the ion beam mixing effect of high-energy ion to realize film densification and eliminate interface stress, ensure the bonding force and reliability of the deposited copper plating layer, multiple workpieces can be simultaneously loaded to improve production efficiency.

This invention provides a negative electrode current collector, its preparation method, a negative electrode sheet, and a lithium-ion battery. The negative electrode current collector includes a surface-treated substrate and copper plating layers disposed on opposite sides of the surface-treated substrate. The surface-treated substrate is made of aluminum foil, and its surface roughness Ra ≥ 0.5 μm; the resistivity of the copper plating layers is ≤ 2.0 × 10⁻⁶. ‑8 The bonding force between the copper plating layer and the surface-treated substrate is ≥15 N / cm (Ω·m). The negative electrode current collector of this invention combines the advantages of low cost, low density, high conductivity, and high stability, thereby improving the energy density, cycle stability, and fast-charging performance of lithium-ion batteries, and thus making it better suited for the large-scale application of high-energy-density lithium-ion batteries.

The application belongs to the technical field of rare earth permanent magnet materials, and particularly relates to a method for integrating hydrogen decrepitation of a rare earth permanent magnet alloy and atomic layer deposition of a copper coating layer. The method is characterized in that the hydrogen decrepitation process of a rare earth permanent magnet alloy ingot or cast piece and the atomic layer deposition process of a coating layer are integrated in the same reaction cavity; first, the rare earth permanent magnet alloy ingot or cast piece is placed in a vacuum reaction cavity, high-purity argon gas is washed multiple times, and then sufficient hydrogen gas is introduced to make the rare earth permanent magnet alloy ingot or cast piece absorb hydrogen and decrepitate into powder and sufficiently dehydrogenate; the hydrogen decrepitated powder is heated to 80-250 DEG C under vacuum for 1.5-4 hours, and a copper coating layer with a total thickness of 10-50 nm is deposited by using the atomic layer deposition method. The application can simplify process steps, improve the coating coverage rate of the coating layer on the surface of the rare earth permanent magnet powder, modify the surface of the magnetic powder, optimize the microstructure of the magnet during the sintering and heat treatment of the coated copper coating layer on the rare earth permanent magnet, and improve the magnetic performance.

[Object]To provide a copper clad laminate that is capable of achieving high adhesion between a low dielectric resin film and a copper plating layer and a good volume resistivity while suppressing a transmission loss when being applied to a flexible circuit board, and a method for producing the copper clad laminate.[Solving Means]A copper clad laminate of the present invention includes a low dielectric resin film having a relative permittivity of 3.5 or lower and a dissipation factor of 0.008 or lower at a frequency of 10 GHz, and an electroless copper plating layer laminated on at least one surface of the low dielectric resin film. A weighted average size of crystallites in the electroless copper plating layer is 25 to 300 nm, and an adhesion strength between the resin film and the electroless copper plating layer is 4.2 N / cm or more.

The invention discloses a preparation method of a steel-based alternating-current composite conductor, the structure of the steel-based alternating-current composite conductor is as follows from outside to inside: the first layer is a copper coating layer, the second layer is an aluminum coating layer, and the innermost layer is a steel core, and the steel-based alternating-current composite conductor has the beneficial effects that a composite material with relatively high strength, good plasticity and conductivity is obtained, and the required performance can be obtained through composite preparation, deformation and aging processes; the copper-aluminum alloy material has excellent conductivity of copper, also has the characteristic of light weight of aluminum, has high strength, high modulus and low relaxation of steel and good conductivity and atmospheric corrosion resistance of copper, achieves the purposes of excellent performance and low cost, and can be widely applied to the fields of power transmission, electronic equipment, communication systems, new energy automobiles, photovoltaic power generation and the like.

The invention belongs to the technical field of double-layer copper-plated conductors, and provides a double-layer copper-plated conductor precisely regulated and controlled automatic electroplating production line system which is characterized in that an inert gas transition cabin with the argon purity not lower than 99.999% and the pressure maintained to be 5-10 kPa is arranged between a first-layer plating tank and a second-layer plating tank, 5-10 nm precise etching is achieved through low-temperature plasma cleaning, and a second-layer plating tank is arranged between the first-layer plating tank and the second-layer plating tank; a roughened grain boundary structure is formed, an EBSD sensor is adopted to collect grain texture direction and size data of a bottom-layer copper coating, a crystal structure analytical model is constructed based on a CNN in combination with a lattice matching database, a crystal nucleus growth induction target is output, and real-time production parameters and parameter threshold ranges corresponding to the induction target are compared; dynamically regulating and controlling production parameters through a PID algorithm; epitaxial growth of the two copper plating layers is achieved, the interface internal stress is remarkably reduced, the bending life of the conductor is prolonged, the structural reliability of the conductor is improved, and the performance requirements of high-end equipment for high-frequency communication, flexible electronics and the like are met.

The invention relates to the technical field of semiconductor devices, in particular to a nickel-iron alloy copper-plated lead frame, a preparation method thereof and an integrated circuit packaging body. The invention discloses a nickel-iron alloy copper-plated lead frame, which comprises a lead frame base material and a composite copper plating layer coated on at least part of the surface of the lead frame base material, wherein the base material of the lead frame is made of Ni80Fe20 ferro-nickel alloy; the surface of the composite copper plating layer is subjected to brown oxidation treatment, and the thickness of the composite copper plating layer is 2-5 [mu] m. According to the ferro-nickel alloy copper-plated lead frame, the preparation method thereof and the integrated circuit packaging body, Ni80Fe20 ferro-nickel alloy is adopted as a base material, and the surface roughness, the binding force of a plastic packaging part and the adhesive force of a plating layer of the ferro-nickel alloy lead frame are synchronously improved through the synergistic effect of a composite copper plating layer and brown oxidation treatment, so that the service life of the ferro-nickel alloy lead frame is prolonged. And the use requirement of the integrated circuit packaging body on high reliability is met.

The application discloses a preparation process of a heat-conducting and electricity-conducting power module and relates to the technical field of semiconductors. The process comprises the following steps: 1, performing a first sand blasting treatment on a spraying area of an aluminum radiator; 2, spraying a first copper coating layer on the spraying area; 3, performing a second sand blasting treatment on the first copper coating layer; 4, spraying a second copper coating layer on the first copper coating layer; 5, emitting laser to irradiate the second copper coating layer, softening the surface of the second copper coating layer, spraying a third copper coating layer on the second copper coating layer, and obtaining a heat-conducting and electricity-conducting copper plating layer; 6, eliminating internal stress of the heat-conducting and electricity-conducting copper plating layer by using a directional high-frequency magnetic field; and 7, directly mounting a chip on the heat-conducting and electricity-conducting copper plating layer to obtain the heat-conducting and electricity-conducting power module. The process alternately performs sand blasting and cold spraying, and increases the processes of softening copper powder and eliminating stress, so that the internal stress of the copper plating layer and the porosity are eliminated, the bonding force between the copper plating layer and the aluminum radiator and between copper powder particles is increased.

The invention discloses a heat conduction substrate with low interface stress and a preparation method thereof, and the method comprises the steps: providing a ceramic substrate which comprises a silicon nitride substrate, an aluminum nitride substrate, a diamond substrate or a silicon carbide substrate, and is provided with a first surface and a second surface which are oppositely arranged; providing at least one copper composite board; performing a copper coating process to arrange the at least one copper composite plate on at least one surface of the ceramic substrate so as to form a ceramic copper-clad plate to realize heat conduction; the copper composite plate comprises a metal plate made of invar alloy or kovar alloy, a transition metal layer formed on the metal plate and a copper layer formed on the transition metal layer, a plurality of up-down through micropores are formed in the metal plate, and the micropores are filled with copper materials. By adopting the heat-conducting substrate, the interface stress of the ceramic substrate and the copper-clad layer in the heat-conducting substrate at high and low temperatures can be reduced, the stability of the heat-conducting substrate is improved, and the service life of the heat-conducting substrate is prolonged.

The invention relates to brazing filler metal for welding a copper-clad aluminum busbar, a preparation method and a welding method, and belongs to the technical field of copper-clad aluminum busbar composites.The brazing filler metal comprises a tin-zinc brazing filler metal layer on the core portion and a copper brazing filler metal layer on the outer layer; the tin-zinc brazing filler metal layer is made of a tin-zinc material, and the tin-zinc material is composed of, by weight, 13%-15% of Zn, 0.5%-1% of In, 0.6% of Sb, 1% of Bi and the balance Sn. The copper brazing filler metal layer is made of a copper coating material, and the copper coating material is composed of, by weight, 0.05% of Sn, 0.1% of Mn, 0.01% of Ag, 0.015% of P and the balance pure copper. The brazing filler metal is of an inner-layer and outer-layer structure, welding of core aluminum and welding of a copper layer can be met at the same time, and meanwhile a welded joint has good conductivity, corrosion resistance and other performance.

This invention provides a functional cyanide-free silver plating method and coating structure, belonging to the field of metal surface treatment technology. This invention adds a trivalent chromium plating layer between the cyanide-free copper plating layer and the cyanide-free silver plating layer prepared by existing technology. The trivalent chromium plating layer provides electrochemical protection to the underlying copper plating layer, and the resulting coating structure effectively prevents corrosive media from eroding towards the substrate. The trivalent chromium plating layer has excellent corrosion resistance, effectively resisting corrosion from corrosive media, overcoming the defect of copper rust easily appearing on the surface of parts plated directly on copper plating layers. Simultaneously, by controlling the composition of the plating solution and adding lanthanum chloride heptahydrate and praseodymium chloride heptahydrate, the two have a synergistic effect, further improving the corrosion resistance of the plated parts.

The invention discloses a production method of a novel lightweight photovoltaic solder strip. The welding strip comprises a rare earth microalloyed aluminum-based core material, a copper coating layer and a tin coating layer, the aluminum-based core material contains at least one rare earth element of Ce, La and Y; the periphery of the aluminum-based core material is coated with the copper coating layer, and a Cu-Al intermetallic compound layer is formed at an interface; the section of the welding strip is of a special-shaped structure, the width of a welding working face is larger than that of a non-welding working face, and the thickness of any position of the copper coating layer is not smaller than 8 micrometers. The production method comprises the steps of aluminum rod surface treatment, copper strip hot-pressing coating, multi-pass stretching and intermediate annealing, special-shaped rolling, diffusion annealing for interface layer thickness control, working face roughening and tin plating. Interface diffusion is inhibited through rare earth elements, the thickness of an intermetallic compound layer is accurately controlled, and high conductivity, excellent welding reliability and long-term heat-resistant cycle performance of the welding strip are guaranteed while remarkable light weight is achieved.

The purpose of the present invention is to provide a method for producing a plated product capable of efficiently forming an aluminum plating layer with high adhesion to a base material comprising magnesium or a magnesium alloy.　Therefore, a method for producing a plated product according to an embodiment of the present invention has a zinc layer formation step for forming a zinc layer on the surface of a base material comprising magnesium or a magnesium alloy, a copper plating layer formation step for performing copper plating treatment on the zinc layer and forming a copper plating layer on the zinc layer, and an aluminum plating layer formation step for performing aluminum plating treatment on the copper plating layer and forming an aluminum plating layer on the copper plating layer. The aluminum plating solution used in the aluminum plating layer formation step contains dimethyl sulfone, an aluminum halide, ammonium chloride, and tetramethylammonium chloride.

The invention discloses a preparation method of a high-purity aluminum oxide ceramic substrate for copper coating, and relates to a preparation method of an aluminum oxide ceramic substrate. From the perspective of improving the surface characteristics of the aluminum oxide ceramic substrate material to improve the adhesion binding force with the copper paste, the problems that the adhesion binding force between the copper paste and the aluminum oxide ceramic substrate is low and the reliability is insufficient cannot be solved by utilizing a simple process in the prior art are solved. The method comprises the following steps: 1, preparing fumed silica coated high-purity alumina powder; (2) preparing a ZnO-TiO2-CuO ternary composite powder body; (3) preparing a precursor; and 3, preparing the high-purity aluminum oxide ceramic substrate. The method is used for preparing the high-purity aluminum oxide ceramic substrate for copper coating.

This invention relates to a copper-plated TPU antibacterial film, comprising, in sequence, a transparent protective coating, a copper plating layer, a nanoscale metal transition layer, a flexible substrate layer, a pressure-sensitive adhesive layer, and a release film. The copper plating layer is made of pure copper or a copper alloy, specifically a copper-zinc alloy or a copper-tin alloy. The nanoscale metal transition layer is made of chromium, titanium, or a nickel-chromium alloy. The flexible substrate layer is made of TPU film. The release film is made of TPU, TPH, PET, or PP. This copper-plated TPU antibacterial film maintains the flexibility and good adhesion of the TPU flexible substrate layer while fully utilizing the antibacterial properties of the copper plating layer, making application and replacement very convenient.

The invention relates to the technical field of copper foil surface treatment, and discloses an electrolysis device for removing copper ions from dilute acid liquid and a processing method.The electrolysis device comprises a containing assembly forming a cavity, and the dilute acid liquid rich in copper ions is placed in the cavity; the electrolysis assembly is in contact with the dilute acid liquid, the electrified electrolysis assembly comprises at least one cathode plate, and the cathode plate provides electrons for copper ions to be reduced into metal copper; and the copper cleaning assembly is arranged in the cavity and comprises a scraper moving relative to the negative plate, and the top end of the scraper makes contact with the negative plate so as to clean the compact copper plating layer. The containing assembly and the electrolysis assembly are arranged to conduct electro-deposition treatment on dilute acid liquid rich in copper ions, the content of the copper ions is reduced, and the dilute acid liquid capable of spraying the conductive roller is formed; in the electrodeposition treatment process, a compact copper plating layer is formed on the side face of the cathode plate, the scraper moves relative to the side face of the cathode plate to scrape the compact copper plating layer, the contact area of the cathode plate and dilute acid liquid is guaranteed, and then the electrodeposition treatment efficiency of the electrolysis assembly on the dilute acid liquid is guaranteed.

The utility model discloses a nickel-free gold-substituted plating layer structure with polythiocyanate pre-plated copper, which comprises a steel substrate, and a polythiocyanate pre-plated copper layer, an acid copper plating layer, a cupronickel tin plating layer, a gold-substituted plating layer and a nano polymer protective film which are sequentially prepared on the steel substrate from inside to outside. According to the nickel-free gold-substituted plating layer structure for pre-plating copper with polythiocyanate, the binding force of the plating layer is tested by a thermal shock method according to GB / T 5270-2005 Electrodeposition and Chemical Deposition Layer Adhesive Strength Test Method for Metal Cover Layer on Metal Matrix, the plating layer does not blister or fall off, the binding force meets the standard requirement, and the plating layer can be used as a plating layer for plating copper with polythiocyanate, so that the nickel-free gold-substituted plating layer structure for pre-plating copper with polythiocyanate can be used as a plating layer for plating copper. According to an acetate fog test carried out for 72 hours according to GB / T 10125-2021 Artificial Atmosphere Corrosion Test Salt Spray Test, no corrosives are generated on the surface of a plated part, and a plated layer has good corrosion resistance.

The utility model discloses a cyanide-free plating imitation gold and electrophoretic coating plating layer structure which comprises a steel substrate, and a cyanide-free pre-plating copper layer, an acid copper plating layer, a nickel-copper alloy plating layer, a cyanide-free imitation gold plating layer and an electrophoretic varnish coating which are sequentially prepared on the steel substrate from inside to outside. According to the cyanide-free plating imitation gold and electrophoretic coating plating layer structure disclosed by the utility model, the binding force of the plating layer is tested by a thermal shock method according to GB / T 5270-2005 < GB / T 5270-2005 < GB / T > 5270-2005 < GB / T > 5270-2005 > < GB / T > 5270-2005 > < GB / T > 5270-2005 > < GB / T > 5270-2005 > < The acetate fog test is carried out for 168 hours according to GB / T 10125-2021 Artificial Atmosphere Corrosion Test Salt Spray Test, no red corrosive substance is generated on the surface of a plated part, and the plating layer structure has good corrosion resistance.

A slotted conductive roller for an electroplating transmission assembly comprises a roller and shaft heads, the shaft heads comprise the first shaft head and the second shaft head, the first shaft head and the second shaft head are arranged at the two ends of the roller, a first shaft head face is arranged between the first shaft head and the roller, and a second shaft head face is arranged between the second shaft head and the roller. A plurality of conductive roller wheel lines are arranged on the outer surface of the roller, and the first shaft head and the second shaft head adopt stepped connecting rods with gradually reduced diameters or connecting rods with conical inclination or connecting rods with the same diameter as the roller; the grooved conductive roller is used for transmission and electric conduction, so that the hole breaking phenomenon of an electroplating film is remarkably reduced, the flatness of a film surface is extremely favorably kept, the problem of copper coating on the roller is prevented, the copper electroplating uniformity of a to-be-coated surface is improved, and the film surface is smooth and better in uniformity by changing the relative position of the conductive roller.

The present application belongs to the technical field of metal coating, and particularly relates to a carbon steel surface cladding gradient copper coating and a preparation method thereof. In order to improve the wear resistance of carbon steel, improve the bonding force between the coating and the carbon steel, and prolong the service life, the present application utilizes the super-speed laser cladding technology and the ultrasonic rolling technology to prepare a copper-based alloy composite wear-resistant coating with internal organization gradient on the surface of the carbon steel substrate. First, the copper-based alloy cladding powder is cladded as an inner layer on the surface of the carbon steel substrate, then the SiC ceramic reinforced copper-based wear-resistant powder is cladded as an outer layer on the inner layer, and the outer layer is subjected to ultrasonic rolling treatment, and finally the carbon steel surface cladding gradient copper coating is obtained after cleaning.

A method for manufacturing a wiring board includes, in the stated order: a step of forming a resist layer 3 on a metal layer 20 provided on a support 1; a step of forming a pattern, including an opening 3A through which the metal layer 20 is exposed, on the resist layer 3 by exposure and development of the resist layer 3; a step of forming a copper plating layer 21 on the metal layer 20 exposed within the opening 3A by electrolytic plating; a step of removing the resist layer 3; a step of filling at least a part of an opening void 21A opening at a surface of the copper plating layer 21; and a step of removing an exposed part of the metal layer 20 by etching.

The invention discloses a high-precision chip welding device and method, and the method comprises the steps: carrying out the partitioning of a to-be-welded array according to the distance between welding balls, the packaging size and the distribution of copper coatings, and defining the time overlap ratio at a liquid phase stage through the intersection of coplanar recovery, interface contact pressure and soldering flux activity; based on the zoning result, the volume distribution of the soldering paste and the solder resist opening ratio are adjusted, and differential soldering flux active intervals are formed; under the unified reflux heat history, the coplane recovery moment is aligned with the active interval through temperature rise and heat preservation time sequence traction by means of the partition heat response difference; in the coincidence interval, adjusting liquid bridge geometry and a backfill channel through a wetting boundary, controlling the contact pressure and maintaining the contact pressure in a threshold range; in the liquid-solid conversion stage, the partition cooling slope is set according to the solidification process difference, and the three elements are made to coincide until the solder is solidified. According to the method, the reliability and consistency of metallurgical connection of the welding spots can be improved.