677 results about "Copper coating" patented technology

PCT No. PCT/EP96/05140 Sec. 371 Date Apr. 23, 1998 Sec. 102(e) Date Apr. 23, 1998 PCT Filed Nov. 21, 1996 PCT Pub. No. WO97/19206 PCT Pub. Date May 29, 1997The invention relates to a method for the electrolytic deposition of metal coatings, in particular of copper coatings with certain physical-mechanical and optical properties and uniform coating thickness. According to known methods using soluble anodes and applying direct current, only uneven metal distribution can be attained on complex shaped workpieces. By using a pulse current or pulse voltage method, the problem of the coatings being of varying thickness at various places on the workpiece surfaces can indeed be reduced. However, the further problem of the geometric ratios being changed continuously during the depositing process by dissolving of the anodes is not resolved thus. This can be avoided by using insoluble anodes. In order to guarantee sufficient stability of the anodes and a bright coating even at those points on the workpiece surfaces, onto which the metal is deposited with high current density, it is essential to add compounds of an electrochemically reversible redox system to the depositing solution.

A plastic package for an image sensor or other electronic component which comprises a plastic body, preferably of LCP material, molded around a leadframe and defining a cavity in which the image sensor is to be disposed. A lid assembly is provided having a transparent glass lid retained in a plastic lid frame which is weldable or otherwise bondable to the plastic body of the package to enclose the image sensor mounted in the cavity. The leadframe is usually composed of copper or a copper alloy, or a ferrous alloy having a copper coating. An interfacial layer is formed on the surfaces of the leadframe at least in those portions which are in contact with the plastic body which serves to provide substantially improved adhesion between the leadframe and the plastic material to achieve a hermetic bond between the metal and plastic materials. The interfacial layer is composed of a cuprous oxide base layer formed on a surface of the leadframe, and a cupric oxide layer formed on the cuprous oxide layer. The cupric oxide outer layer has an acicular structure which provides an interlocking mechanism for adhesion to the plastic material molded thereto in forming the package.

The invention provides a dual-layer-coated nanometer silicon negative electrode material and a preparation method and an application thereof. The negative electrode material comprises silicon-based nanoparticles, a copper layer for coating the surfaces of the silicon-based nanoparticles, and a conductive protection layer for coating the surface of the copper layer. The nanometer copper has super-plastic extensibility and conductivity; in addition, the existing calculation already proves that lithium ions can penetrate through the nanometer copper, so that the copper coating layer can suppress volume expansion of the silicon-based nanoparticles and keep the silicon-based nanoparticles not cracked; therefore, direct contact between the silicon-based nanoparticles and an electrolyte can be avoided effectively, thereby forming a stable SEI and improving conductivity of an electrode; however, the nanometer copper is easily oxidized to form copper oxide and cuprous oxide to form an adverse SEI on the surface; and therefore, the surface of the nanometer copper is coated with the conductive protection layer so as to effectively suppress oxidization of the nanometer copper, thereby improving electrochemical performance.

A system comprises towed marine seismic equipment marine seismic equipment, adapted for towing through a body of water; and a coating of copper particles covering the marine seismic equipment to protect from marine growth. A method comprises towing marine seismic equipment having a coating of copper particles thereon to protect from marine growth.

The invention discloses a high-conductivity composite carbon fiber and a preparation method thereof, and belongs to composite carbon fibers and a preparation method thereof. The high-conductivity composite carbon fiber provided by the invention consists of carbon fibers as well as metal coatings and graphene coatings, which are sequentially adhered on the surfaces of the carbon fibers from bottom to top; the carbon fibers are carbon fiber yarns, carbon fiber bundles, carbon fiber cloth, carbon fiber paper or carbon fiber fabrics; the metal coatings are a metal copper coating, a metal nickel coating or a metal iridium coating; and the thicknesses of the metal coatings are 50-500nm. The composite carbon fiber prepared by the invention has excellent conductivity and heat conductivity, can conduct or dissipate lightning stroke energy rapidly, and improves the thunder stroke resistant capability of the carbon fiber material.

The invention discloses a novel metal-ceramic bond diamond grinding wheel having the high strength and form-holding property in metal bond grinding wheels and the high self-sharpening property in ceramic bond grinding wheels, and a production method thereof. The metal-ceramic bond diamond grinding wheel is produced by: 1, preparing powder mixture out of 60-70% of copper-plated diamond powder, 15-20% of (W, Ti)C powder, 5-10% of tin powder, and 5-15% of iron group powders; mixing according to the above components and ratio to obtain the powder mixture; 2, forming, namely pressing the powder mixture into blanks by pressure forming; 3, sintering, namely subjecting the blanks to inert atmosphere low-pressure sintering, heating the blanks to 850-1050DEG C during sintering, and holding the temperature for 10-30 minutes. The copper-plated diamond powder is composed of particles with average particle size of 5-80 micrometers, and the particles are composed of diamond cores and copper coatings covering the diamond cores. Inert atmosphere during sintering is 5-10Mpa.

The invention discloses a preparation technology of a gravure plate roller. The preparation technology comprises the following steps: preparing a printing plate base body; carrying out copper coating processing on a printing plate roller; preparing an original image file; electronically engraving and preparing a printing plate image; chroming the printing plate roller. When the printing plate roller is prepared, the utilization rate of steel products is high, the working allowance of steel is low, the preparation cost of the roller is reduced, the prepared plate roller accords with the operating requirement, and the service life is long.

The invention relates to a spherical copper coating tungsten composite powder, a preparation method and an application thereof. The copper coating tungsten composite powder is in a core-shell structure, the shell is a copper plating layer, the core is tungsten powder, and the weight ratio of the tungsten elements and copper elements of the copper coating tungsten composite powder ranges from 5 to 95 : 95 to 5; the spherical copper coating tungsten composite powder has the advantages of fine dispersion performance, high liquidity, even ingredients and high purity. The preparation method includes processing ordinary tungsten powder by a plasma spheroidizing technology, allowing the copper to deposit on the surface of the tungsten powder evenly by the intermittent copper electroplating process, and cleaning and drying the composite powder coated with copper. The spherical copper coating tungsten composite powder is prepared by combining the plasma spheroidizing and intermittent copper electroplating, the method is simple, reliable and easy to operate, the electroplating speed, the electroplated layer thickness and copper content range can be adjusted effectively, the copper-tungsten composite material comprehensive performances can be improved effectively, the expanded application prospect is provided, and the method can be applied to industrialized mass production.

The invention relates to a preparation method for a copper/zinc coating on the surface of glass fiber. The preparation method comprises the following steps: pretreating the surface of the glass fiber; chemically plating copper on the surface of the glass fiber; and electroplating zinc on the surface of the glass fiber. The glass fiber can conduct electricity by an electroless plating copper process; and the zinc coating is prepared on the surface of the glass fiber by an electroplating zinc process. By the process, the copper coating is successfully deposited on the glass fiber, the copper content reaches 10 to 80 percent, and the glass fiber is changed from insulation into conduction. The zinc is electroplated on the basis and the zinc content of the coating reaches 10 to 60 percent. The process is low in cost and easy to implement. The prepared zinc coating has excellent performance. The zinc coating with excellent performance is easy to prepare by improving the formula of plating solution. The preparation method for the copper/zinc coating on the surface of the glass fiber is suitable for large-scale production and can replace the conventional preparation process of the composite glass fiber material.

The invention provides a manufacturing process of a waveguide slot, which is suitable for the manufacturing field of a PCB board. In the manufacturing process provided by the invention, a tin coating which is disposed outside the bottom of a groove is burn off by laser while a copper coating inside the bottom of the groove is not removed due to the difference between the absorption rates of tine and copper to laser and the difference between the energy requirements for burning tin and copper with laser, so that the laser can be prevented from reaching to a core plate under the copper coating;then the copper coating inside the bottom of the groove is removed by etching, a tin coating disposed outside the side wall of the groove is removed by means of a common process method, a protection player is subsequently coated on a copper coating which is disposed inside the side wall of the groove, so that a waveguide slot of which the side walls are provided with metal layers (a copper coating and a protection layer) and the bottom does not have a metal layer. According to the invention, the manufacturing is simple, a liquid photoimageable (PLI) type printing ink step of the existing technology is replaced by a laser drilling step, the cost is relatively low, the position accuracy of the laser drilling machine is high, the quality of the waveguide slot can be ensured completely, so the volume production of the product can be carried out.

The invention relates to a copper-coating foil microwave dielectric plate with high dielectric constant and a preparation method thereof. The preparation method comprises the following steps of modifying the surface, and preparing modified ceramic powder or modified glass fiber; fully mixing 50 to 80wt% of modified ceramic powder, 2 to 10wt% of modified glass fiber, and 15 to 45wt% of PTFE (polytetrafluoroethylene) resin; adding 2 to 10wt% of surfactant into a mixture, and continuing to mix; adding 5 to 20wt% of flocculant, until precipitate is formed, and filtering; drying, and crushing into a bread crumb-shaped matter; adding 2 to 20wt% of plasticizer, and mixing to form a dough-shaped matter; putting onto a calendering machine, calendering, and forming, so as to obtain a raw base sheet; drying, sequentially overlapping the dried base sheets, hot pressing and sintering, and naturally cooling. The preparation method has the advantages that the dough-shaped matter after the mixing of the raw material has excellent fluidity and forming property; by adopting a calendaring roll to repeatedly calender, the uniformity of thickness and dielectric property is guaranteed; by adopting a calendering technology, the problem of molding technology size and uniformity are solved.

The invention discloses a tin/copper foam alloy cathode material for lithium ion cells and a preparation method thereof. In the invention, foam copper serving as a substrate is coated and plated with tin/copper alternate multilayer lamination structure; and then the tin/copper alloy cathode material is obtained by heat treatment. A tin coating is formed directly on the foam copper strip substrate, and a copper coating is formed on the outmost layer; in the multilayer lamination structure, each coating is 0.1 to 1.0 micrometer thick, and the thicknesses of all coatings are the same; the thickness ratio of each tin coating to each copper coating is 1:1.7-1:2.1; and the heat treatment temperature is 150 to 400 DEG C and the heat treatment time is 0.5 to 6 hours. The tin/copper foam alloy cathode material prepared by the method has a high charge-discharge specific capacity and high cycle performance; and the maximum primary discharge specific capacity is up to 610mAh/g, and after 50 circles, the specific capacity reduces only by 1 to 3 percent. In the invention, the preparation process is simple, and large-scale industrial production can be performed.

The invention discloses a method for preparing a micro-nano porous structure on a titanium or titanium alloy surface. The method is characterized in that the titanium or titanium alloy surface is subjected to surface copper plating, then heat treatment and dealloying, and particularly comprises the following steps: cleaning the titanium or titanium alloy surface; arranging a copper coating on the titanium or titanium alloy surface via surface electroplating or magnetron sputtering; performing heat treatment to diffuse copper atoms into the titanium or titanium alloy surface; dealloying by adoption of solid-phase method magnesium powder or liquid-phase method molten magnesium; and finally, cleaning and drying with acid and water to obtain titanium or titanium alloy with micro-nano pores in the surface. Compared with the prior art, the method is simple and easy, can overcome the shortcomings of the conventional powder sintering method, acid etching method, anodic oxidation method, spray method and the like, is suitable for small and large titanium or titanium alloy materials, can be used for easily preparing the micro-nano porous structure on the titanium or titanium alloy surface and is wide in applicability.

The cyanide-free alkaline copper dip plating process for die cast zinc part includes the following steps: dewaxing die cast zinc part, deoiling, soaking in alkaline immersion liquid at 15-60 deg.c and pH 7.5-13.0 for 5 sec to 15 min to form replacing copper layer. The alkaline immersion liquid contains two-valent copper ion, and one or several kinds of inorganic or organic complexing agent selected from pyrophosphoric acid, tartaric acid, citric acid, gluconic acid, EDTA and HEDP acid radical ion a in the concentration of 1-150 g/L. The process of the present invention may be used to replace cyanide copper plating to form copper coating with high adhesion force without cyanide pollution.

A kind of chemical solution used to copperize, the following are the weight percent of the major components of it: blue vitriod0.8-3, Fe vitriol 0-0.5, complex agent 3-6, sodium hypophosphorous acid 4-6, ammonia sulfate 0.5-1, sulfourea 0-0.01. The following is the procedure of the copper coating method with the above copper coating solution: to widen and activate the plastic board->to clean->to make it electric->to clean->to coat nickel-copper alloy on it by chemical method. The following are the content of the chemical method: the plastic pretreated according the above description will be immersed in the above chemical solution used to copperize, the pH of which has been adjusted to 10-13 by vitriol and stranger ammonia water, the working temperature of it is 20-70deg.C, the time to copperize is 5-20 minutes. The chemical solution used to copperize in this patent does not contain formaldehyde, it improve the working circumstance, and is easy to control, the cost of it is lower, and it own high economical benefit and society benefit.