86 results about "Copper coating" patented technology

The invention provides a preparation method of a bipolar current collector based on a selective double-sided modified masking film. The preparation method comprises the following steps: depositing a Ni-Cr alloy layer on a single side surface of an aluminum substrate; one side of the masking film is etched to form a roughened surface, and the other side of the masking film is hydrophobic to form a hydrophobic surface; the roughened surface of the masking film and the surface, without the Ni-Cr alloy layer, of the aluminum matrix are pressed, and the edge is coated with curing glue; and placing the pressed and glued sample in an electroplating solution to electroplate a copper layer, finally cutting off an edge glue sealing area, and stripping the masking film. According to the preparation method, the masking film used for protecting the back surface of the aluminum substrate is subjected to double-sided differential treatment, the edge sealing technology is matched, and the Ni-Cr alloy is adopted for bottoming, so that the adhesive force between the copper plating layer and the aluminum substrate is improved, the risk of causing corrosion of a primary battery is reduced, the bipolar current collector which is firmly combined and has a pure interface can be prepared, and the service life of the bipolar current collector is prolonged. And a feasible solution is provided for realizing light-weight and high-performance current collectors for electronic devices such as lithium batteries and the like.

The invention provides a method for inhibiting the formation of Kirkendall holes in an In-based brazing filler metal welding interface by adopting a vertical twin structure, which comprises the following steps of: respectively adhering a layer of vertical twin structure to the surfaces of an upper metal substrate to be welded and a lower metal substrate to be welded which are subjected to surface treatment in an electro-deposition manner, wherein the size of the vertical twin structure is 5 * 5 mm, the thickness of the vertical twin structure is 20-40 mu m, and the thickness of the vertical twin structure is 10 * 10 mm; the method comprises the following steps: carrying out a thermocompression bonding experiment on a pure copper coating with a vertical orientation nano twin crystal structure at set bonding temperature, pressure and time; according to the technical scheme, by means of the structural characteristic that the diffusion coefficient of the vertically-arranged twin boundaries in the nano twin structure is low, the diffusion rate of interface elements is reduced, flux balance is maintained, and the low impurity characteristic of the vertically-oriented nano twin film is utilized, so that formation of Kirkendall voids in the welding interface is limited. The method provided by the invention is simple and convenient to operate, and has great significance for improving the connection reliability of the In-based low-temperature bonding system.

The invention provides a preparation method and application of a pure copper coating, and relates to the field of surface functional coatings, and the preparation method comprises the following steps: preparing pure copper powder, and carrying out sand blasting treatment on the surface of an aluminum alloy substrate; the aluminum alloy substrate is fixed in a closed cold spraying chamber, and pure copper powder is loaded into helium cold spraying equipment in the closed cold spraying chamber; vacuumizing until the pressure in the closed cold spraying chamber is lower than a preset pressure threshold value and the oxygen content in the chamber is lower than a preset value; helium in a buffer tank is adopted as main gas and powder feeding gas, and a pure copper coating is formed on the surface of the aluminum alloy substrate through spraying of helium cold spraying equipment; and the helium circulation system is synchronously started to recover helium in the cavity, and the helium is compressed into the buffer tank after being filtered and cooled, so that helium circulation is realized. The method adopts the circulating helium atmosphere to avoid the problem that the impurity content of the coating is increased due to high-temperature oxidation of the copper coating, the oxygen content of the coating is remarkably reduced, and the particle interface bonding is improved, so that the electric conduction and heat conduction performance of the pure copper coating is improved, and the helium use cost is reduced.

The invention belongs to the technical field of high-power electronic component base materials, and discloses an embedded high-thermal-conductivity ceramic packaging substrate for a high-power scene and a preparation method of the embedded high-thermal-conductivity ceramic packaging substrate. ABF composite layers are arranged above and below a ceramic core plate in the ceramic packaging substrate; a high-thermal-conductivity base material is fixed in the ceramic substrate; interconnection holes are formed in the ceramic substrate, and electroplating copper film layers are arranged on the upper surface and the lower surface of the ceramic substrate and in the interconnection holes; a copper-clad plate layer is arranged on the outer side of the ABF layer, a copper-clad plate groove is formed in the copper-clad plate layer, a blind hole is formed in the copper-clad plate groove, and a copper column is arranged in the blind hole; a solder mask layer is arranged on the surface of the ABF layer on the outermost side, a surface treatment layer is arranged on the outer side of the solder mask layer, and blind holes with built-in copper columns are formed in the surface treatment layer. The preparation method comprises the following steps: forming a substrate groove in the surface of the ceramic substrate; embedding a high-thermal-conductivity base material; arranging an electroplating copper film coating layer; an ABF composite layer is arranged; arranging a solder mask layer; and arranging a surface treatment layer. The LED lamp is good in heat dissipation effect.

A kind of plating experiment device and method for preparing high bonding force copper plating layer on aluminum-based heat sink surface, it relates to material processing technical field.Plasma chamber is provided with heater, motion control mechanism can carry out public self-rotating compound motion and is connected bias power supply, evaporation source includes crucible, electron gun, deflection coil and ion source, so that the inside of plasmaplasma chamber forms pure strong current ion flushing area and strong current ion enhanced electron beam evaporation plating area, vacuum and gas supply system connects plasmaplasma chamber and carries out vacuumizing, and respectively with plasmaplasma chamber and ion source connection supply reaction gas and working gas.By the spatial partition layout of plasmaplasma chamber cooperation motion control mechanism public self-rotating compound motion, workpiece is periodically alternated through two functional areas in film forming process, utilizes the ion beam mixing effect of high-energy ion to realize film densification and eliminate interface stress, ensure the bonding force and reliability of the deposited copper plating layer, multiple workpieces can be simultaneously loaded to improve production efficiency.

This invention provides a negative electrode current collector, its preparation method, a negative electrode sheet, and a lithium-ion battery. The negative electrode current collector includes a surface-treated substrate and copper plating layers disposed on opposite sides of the surface-treated substrate. The surface-treated substrate is made of aluminum foil, and its surface roughness Ra ≥ 0.5 μm; the resistivity of the copper plating layers is ≤ 2.0 × 10⁻⁶. ‑8 The bonding force between the copper plating layer and the surface-treated substrate is ≥15 N / cm (Ω·m). The negative electrode current collector of this invention combines the advantages of low cost, low density, high conductivity, and high stability, thereby improving the energy density, cycle stability, and fast-charging performance of lithium-ion batteries, and thus making it better suited for the large-scale application of high-energy-density lithium-ion batteries.

The application belongs to the technical field of rare earth permanent magnet materials, and particularly relates to a method for integrating hydrogen decrepitation of a rare earth permanent magnet alloy and atomic layer deposition of a copper coating layer. The method is characterized in that the hydrogen decrepitation process of a rare earth permanent magnet alloy ingot or cast piece and the atomic layer deposition process of a coating layer are integrated in the same reaction cavity; first, the rare earth permanent magnet alloy ingot or cast piece is placed in a vacuum reaction cavity, high-purity argon gas is washed multiple times, and then sufficient hydrogen gas is introduced to make the rare earth permanent magnet alloy ingot or cast piece absorb hydrogen and decrepitate into powder and sufficiently dehydrogenate; the hydrogen decrepitated powder is heated to 80-250 DEG C under vacuum for 1.5-4 hours, and a copper coating layer with a total thickness of 10-50 nm is deposited by using the atomic layer deposition method. The application can simplify process steps, improve the coating coverage rate of the coating layer on the surface of the rare earth permanent magnet powder, modify the surface of the magnetic powder, optimize the microstructure of the magnet during the sintering and heat treatment of the coated copper coating layer on the rare earth permanent magnet, and improve the magnetic performance.

[Object]To provide a copper clad laminate that is capable of achieving high adhesion between a low dielectric resin film and a copper plating layer and a good volume resistivity while suppressing a transmission loss when being applied to a flexible circuit board, and a method for producing the copper clad laminate.[Solving Means]A copper clad laminate of the present invention includes a low dielectric resin film having a relative permittivity of 3.5 or lower and a dissipation factor of 0.008 or lower at a frequency of 10 GHz, and an electroless copper plating layer laminated on at least one surface of the low dielectric resin film. A weighted average size of crystallites in the electroless copper plating layer is 25 to 300 nm, and an adhesion strength between the resin film and the electroless copper plating layer is 4.2 N / cm or more.

The invention discloses a preparation method of a steel-based alternating-current composite conductor, the structure of the steel-based alternating-current composite conductor is as follows from outside to inside: the first layer is a copper coating layer, the second layer is an aluminum coating layer, and the innermost layer is a steel core, and the steel-based alternating-current composite conductor has the beneficial effects that a composite material with relatively high strength, good plasticity and conductivity is obtained, and the required performance can be obtained through composite preparation, deformation and aging processes; the copper-aluminum alloy material has excellent conductivity of copper, also has the characteristic of light weight of aluminum, has high strength, high modulus and low relaxation of steel and good conductivity and atmospheric corrosion resistance of copper, achieves the purposes of excellent performance and low cost, and can be widely applied to the fields of power transmission, electronic equipment, communication systems, new energy automobiles, photovoltaic power generation and the like.

The invention belongs to the technical field of double-layer copper-plated conductors, and provides a double-layer copper-plated conductor precisely regulated and controlled automatic electroplating production line system which is characterized in that an inert gas transition cabin with the argon purity not lower than 99.999% and the pressure maintained to be 5-10 kPa is arranged between a first-layer plating tank and a second-layer plating tank, 5-10 nm precise etching is achieved through low-temperature plasma cleaning, and a second-layer plating tank is arranged between the first-layer plating tank and the second-layer plating tank; a roughened grain boundary structure is formed, an EBSD sensor is adopted to collect grain texture direction and size data of a bottom-layer copper coating, a crystal structure analytical model is constructed based on a CNN in combination with a lattice matching database, a crystal nucleus growth induction target is output, and real-time production parameters and parameter threshold ranges corresponding to the induction target are compared; dynamically regulating and controlling production parameters through a PID algorithm; epitaxial growth of the two copper plating layers is achieved, the interface internal stress is remarkably reduced, the bending life of the conductor is prolonged, the structural reliability of the conductor is improved, and the performance requirements of high-end equipment for high-frequency communication, flexible electronics and the like are met.

The invention relates to the technical field of semiconductor devices, in particular to a nickel-iron alloy copper-plated lead frame, a preparation method thereof and an integrated circuit packaging body. The invention discloses a nickel-iron alloy copper-plated lead frame, which comprises a lead frame base material and a composite copper plating layer coated on at least part of the surface of the lead frame base material, wherein the base material of the lead frame is made of Ni80Fe20 ferro-nickel alloy; the surface of the composite copper plating layer is subjected to brown oxidation treatment, and the thickness of the composite copper plating layer is 2-5 [mu] m. According to the ferro-nickel alloy copper-plated lead frame, the preparation method thereof and the integrated circuit packaging body, Ni80Fe20 ferro-nickel alloy is adopted as a base material, and the surface roughness, the binding force of a plastic packaging part and the adhesive force of a plating layer of the ferro-nickel alloy lead frame are synchronously improved through the synergistic effect of a composite copper plating layer and brown oxidation treatment, so that the service life of the ferro-nickel alloy lead frame is prolonged. And the use requirement of the integrated circuit packaging body on high reliability is met.

This invention provides a functional cyanide-free silver plating method and coating structure, belonging to the field of metal surface treatment technology. This invention adds a trivalent chromium plating layer between the cyanide-free copper plating layer and the cyanide-free silver plating layer prepared by existing technology. The trivalent chromium plating layer provides electrochemical protection to the underlying copper plating layer, and the resulting coating structure effectively prevents corrosive media from eroding towards the substrate. The trivalent chromium plating layer has excellent corrosion resistance, effectively resisting corrosion from corrosive media, overcoming the defect of copper rust easily appearing on the surface of parts plated directly on copper plating layers. Simultaneously, by controlling the composition of the plating solution and adding lanthanum chloride heptahydrate and praseodymium chloride heptahydrate, the two have a synergistic effect, further improving the corrosion resistance of the plated parts.

The invention discloses a production method of a novel lightweight photovoltaic solder strip. The welding strip comprises a rare earth microalloyed aluminum-based core material, a copper coating layer and a tin coating layer, the aluminum-based core material contains at least one rare earth element of Ce, La and Y; the periphery of the aluminum-based core material is coated with the copper coating layer, and a Cu-Al intermetallic compound layer is formed at an interface; the section of the welding strip is of a special-shaped structure, the width of a welding working face is larger than that of a non-welding working face, and the thickness of any position of the copper coating layer is not smaller than 8 micrometers. The production method comprises the steps of aluminum rod surface treatment, copper strip hot-pressing coating, multi-pass stretching and intermediate annealing, special-shaped rolling, diffusion annealing for interface layer thickness control, working face roughening and tin plating. Interface diffusion is inhibited through rare earth elements, the thickness of an intermetallic compound layer is accurately controlled, and high conductivity, excellent welding reliability and long-term heat-resistant cycle performance of the welding strip are guaranteed while remarkable light weight is achieved.

The invention discloses a preparation method of a high-purity aluminum oxide ceramic substrate for copper coating, and relates to a preparation method of an aluminum oxide ceramic substrate. From the perspective of improving the surface characteristics of the aluminum oxide ceramic substrate material to improve the adhesion binding force with the copper paste, the problems that the adhesion binding force between the copper paste and the aluminum oxide ceramic substrate is low and the reliability is insufficient cannot be solved by utilizing a simple process in the prior art are solved. The method comprises the following steps: 1, preparing fumed silica coated high-purity alumina powder; (2) preparing a ZnO-TiO2-CuO ternary composite powder body; (3) preparing a precursor; and 3, preparing the high-purity aluminum oxide ceramic substrate. The method is used for preparing the high-purity aluminum oxide ceramic substrate for copper coating.

This invention relates to a copper-plated TPU antibacterial film, comprising, in sequence, a transparent protective coating, a copper plating layer, a nanoscale metal transition layer, a flexible substrate layer, a pressure-sensitive adhesive layer, and a release film. The copper plating layer is made of pure copper or a copper alloy, specifically a copper-zinc alloy or a copper-tin alloy. The nanoscale metal transition layer is made of chromium, titanium, or a nickel-chromium alloy. The flexible substrate layer is made of TPU film. The release film is made of TPU, TPH, PET, or PP. This copper-plated TPU antibacterial film maintains the flexibility and good adhesion of the TPU flexible substrate layer while fully utilizing the antibacterial properties of the copper plating layer, making application and replacement very convenient.

The utility model discloses a cyanide-free plating imitation gold and electrophoretic coating plating layer structure which comprises a steel substrate, and a cyanide-free pre-plating copper layer, an acid copper plating layer, a nickel-copper alloy plating layer, a cyanide-free imitation gold plating layer and an electrophoretic varnish coating which are sequentially prepared on the steel substrate from inside to outside. According to the cyanide-free plating imitation gold and electrophoretic coating plating layer structure disclosed by the utility model, the binding force of the plating layer is tested by a thermal shock method according to GB / T 5270-2005 < GB / T 5270-2005 < GB / T > 5270-2005 < GB / T > 5270-2005 > < GB / T > 5270-2005 > < GB / T > 5270-2005 > < GB / T > 5270-2005 > < The acetate fog test is carried out for 168 hours according to GB / T 10125-2021 Artificial Atmosphere Corrosion Test Salt Spray Test, no red corrosive substance is generated on the surface of a plated part, and the plating layer structure has good corrosion resistance.

A method for manufacturing a wiring board includes, in the stated order: a step of forming a resist layer 3 on a metal layer 20 provided on a support 1; a step of forming a pattern, including an opening 3A through which the metal layer 20 is exposed, on the resist layer 3 by exposure and development of the resist layer 3; a step of forming a copper plating layer 21 on the metal layer 20 exposed within the opening 3A by electrolytic plating; a step of removing the resist layer 3; a step of filling at least a part of an opening void 21A opening at a surface of the copper plating layer 21; and a step of removing an exposed part of the metal layer 20 by etching.

This invention provides a process, tooling, and hydraulic cylinder for preparing bimetallic cylinder bodies for continuous furnaces, relating to the field of hydraulic cylinder processing. Addressing the issue that current bimetallic cylinder body preparation processes are unsuitable for continuous furnace production, this invention utilizes a heat shield to separate the steel substrate and copper raw material. After entering the continuous furnace for heating, the copper raw material, located outside the heat shield, can rapidly heat up and melt, while the steel substrate heats up more slowly, remaining below the liquidus temperature of the copper. The molten copper-containing metal, after dripping onto the steel substrate, forms a temperature gradient under the relatively low temperature of the steel substrate, thus solidifying from bottom to top to form a high-density copper coating. No additional human intervention is required during the transport process, meeting the requirements for continuous furnace production of bimetallic cylinder bodies.

The utility model relates to the technical field of notebook computer rotating shafts, and discloses a notebook computer rotating shaft reinforcing structure which comprises a notebook computer body, a notebook computer rotating shaft dustproof protection shell is arranged in the notebook computer body, and a large-angle opening and closing mechanism is arranged in the rotating shaft shell. The large-angle opening and closing mechanism comprises a long support, a lower fixing sheet metal structural frame, an upper fixing sheet metal structural frame, a plurality of mounting holes, a rotating shaft rotating assembly, a rubber sealing ring, a dustproof plate, a sealing groove, a conductive copper coating, a nickel coating and a wear-resistant layer, and the rotating shaft rotating assembly is arranged in the inner wall of the notebook computer rotating shaft dustproof protection shell. According to the notebook computer rotating shaft reinforcing structure, the long support is fixedly installed on the left surface of the lower portion fixing metal plate structural frame, when the notebook computer rotating shaft reinforcing structure is used, the long support can be installed in the inner wall of a bottom plate of a notebook computer body through the installation holes, fixing points of a notebook computer rotating shaft are enhanced, and the whole structure is reinforced.

The invention provides a preparation method of an electroplating copper tungsten wire for a cold drawing process, which comprises the following steps: placing a tungsten wire in an alkaline cleaning solution for ultrasonic cleaning, washing after cleaning, then placing a copper plate with the mass purity not lower than 99.95% as an anode and the tungsten wire as a cathode in an electroplating solution for electroplating, and controlling the current density to be 1.6-2.2 A / dm < 2 > in the electroplating process, the temperature is kept at 20-30 DEG C, the electroplating time is 68 min, and the electroplating liquid is stirred at the rotating speed of 250-300 r / min; and finally, after electroplating is finished, the tungsten wire is placed in flowing deionized water with the electrical resistivity not lower than 15 M omega cm to be washed clean, after low-temperature drying, the electroplated copper tungsten wire is obtained, and the average thickness of an electroplated copper layer on the surface of the tungsten wire is 0.75-1.25 microns. The uniform, compact and firmly combined copper plating layer is formed before cold drawing of the tungsten filament, and is matched with specific cold drawing process parameters for use, so that the filament breakage rate of the small-diameter tungsten filament is remarkably reduced, the surface quality and the production efficiency are improved, and the method is suitable for industrial continuous preparation of the high-performance tungsten filament.

The invention provides a gas diffusion electrode based on a polytetrafluoroethylene membrane and a low-temperature and large-area preparation method and application thereof. The preparation method comprises the following steps: coating the surface of a polytetrafluoroethylene membrane with noble metal salt, putting the polytetrafluoroethylene membrane into a first reducing agent solution, and carrying out first soaking to obtain a noble metal-loaded polytetrafluoroethylene membrane; the precious metal loaded polytetrafluoroethylene film is placed in a copper salt solution for second soaking, meanwhile, a second reducing agent solution is added into the copper salt solution, and a copper plating layer is formed on the surface of the precious metal loaded polytetrafluoroethylene film; a catalyst layer is arranged on the surface of the side, away from the polytetrafluoroethylene film, of the copper plating layer, and the gas diffusion electrode based on the polytetrafluoroethylene film is obtained. According to the invention, the hydrophobic polytetrafluoroethylene membrane is used as a carrier, the large-area copper coating gas diffusion electrode with good uniformity and conductivity is prepared at a relatively low temperature, the electrocatalytic CO2 reduction conversion activity is high, the selectivity of C2 + products such as ethylene and ethanol is high, and the stability is good.

The invention belongs to the technical field of surface treatment, and discloses a method for predicting the thickness of a cyanide-free electro-coppering coating, which comprises the following steps: step 1, preparing a cyanide-free electro-coppering solution; 2, cyanide-free copper electroplating test parameters are designed, and a test is conducted; 3, the thickness of a cyanide-free copper electroplating coating is obtained according to a cyanide-free copper electroplating test; step 4, establishing a cyanide-free electroplating copper plating layer thickness model; and step 5, performing parameter optimization on the cyanide-free electro-coppering layer thickness model so as to predict the cyanide-free electro-coppering layer thickness according to the parameter-optimized cyanide-free electro-coppering layer thickness model.

A preparation method of a copper-coated diamond-tin-based alloy composite material comprises the following steps: weighing 50-90 wt% of tin-based alloy powder and the balance of copper-coated diamond powder, uniformly mixing the tin-based alloy powder and the copper-coated diamond powder, and carrying out vacuum sintering under 10-25 MPa and 160-200 DEG C to prepare the copper-coated diamond-tin-based alloy composite material, the composite material is composed of a tin-based alloy continuous matrix and a copper-coated diamond reinforced phase uniformly dispersed in the matrix, and a multi-stage interface structure is formed around diamond particles. The copper plating layer is combined with the diamond core; the continuous copper-tin intermetallic compound transition layer is generated by reaction of copper and tin; and the tin-based alloy matrix is arranged in sequence from inside to outside. According to the method, the process controllability is high, interface bonding of the diamond and the tin-based alloy matrix can be effectively improved, and the prepared composite material is expected to have high heat conductivity, low thermal expansion coefficient and good mechanical property and is suitable for heat management and packaging of high-power electronic devices.

The present application relates to a kind of imidazole-based surface treatment additives and its preparation method and application, belong to surface treatment technical field.To solve the problem of acid copper plating bright area current density range narrow and bright agent consumption fast, the present application provides a kind of preparation method of imidazole-based surface treatment additives, sodium hydroxide, imidazole or imidazole derivative, pyridine or pyridine derivative is dissolved in deionized water, epoxy chloropropane is added to the obtained mixed system, reaction until no epoxy chloropropane suspension is observed, and imidazole-based surface treatment additive is obtained.The imidazole-based plating additive prepared in the present application is applied to acidic sulphate copper plating, which can significantly improve the brightness of copper coating in low current density area, realize the mirror surface bright in the wide current density range of 0.1-10A / dm 2 , the glossiness is maintained at 480GU or more, and the consumption rate of sulfur-containing compound main brightener can also be significantly reduced, showing excellent application potential.

The invention discloses a diaphragm-free multi-layer current collector and application thereof in a solid-state lithium ion battery, and relates to the technical field of lithium ion battery materials, and the diaphragm-free multi-layer current collector is prepared by the following steps: performing plasma etching on a polyethylene glycol terephthalate layer, and evaporating aluminum plating layers on two sides to obtain a diaphragm-free multi-layer current collector; coating and rolling LFP bottom coating slurry, solid electrolyte layer slurry, positive electrode active material layer slurry and positive electrode ceramic insulating layer slurry on the surface of the aluminum plating layer in sequence to obtain a positive electrode multi-layer current collector; plasma etching is carried out on the polyethylene terephthalate layer, magnetron sputtering and water adding are carried out on the two sides to electroplate a copper plating layer, the surface of the copper plating layer is sequentially coated and rolled with a lithium supplementing layer, negative electrode active material layer slurry and negative electrode ceramic insulation layer slurry, and a negative electrode multi-layer current collector is obtained; and sequentially carrying out cutting, lamination winding, packaging, 2-3g / Ah liquid electrolyte injection, formation and aging on the positive electrode multi-layer current collector and the negative electrode multi-layer current collector to obtain the solid-state lithium ion battery.

Disclosed are an aluminum alloy busbar for a busbar duct having double copper-coated end portions, and a preparation method therefor, relating to the technical field of copper-aluminum composite eutectic plate production. An aluminum alloy busbar having double copper-coated end portions is produced by means of steps such as casting, heat treating, cutting, lateral rolling, longitudinal rolling, slitting and finished product annealing. Compared with the prior art, an aluminum alloy busbar having double copper-coated end portions is designed, and the end portion copper coating technique enables both ends to have a copper-aluminum eutectic structure at the same time, thereby significantly improving the mechanical properties and oxidation resistance of the copper-aluminum composite busbar, and significantly reducing the amount of copper. In addition, the peel strength of the copper-coated parts is high, the aluminum layer and the copper layer are not easily separated, and the performance is better, thereby improving the reliability of the copper-aluminum eutectic busbar. Lateral cold rolling extends the width of a copper-aluminum eutectic composite plate, solving the problem that current devices cannot produce large-size copper-aluminum eutectic composite material.

The invention belongs to the technical field of filter antenna manufacturing and surface treatment, and particularly relates to an integrated manufacturing method of a high-precision multi-cavity millimeter wave waveguide filter antenna. Firstly, a resin waveguide device is manufactured by adopting a photocuring (SLA) 3D printing method, and metallization is performed in combination with a chemical copper plating technology. Precise dimensional precision parts are obtained through high-precision non-metal printing, an optimized chemical plating process is combined, a compact, uniform and smooth copper plating layer with low surface roughness is formed, skin effect loss under the 28GHz frequency band is effectively reduced, and the performance of a filter is improved.

This invention discloses an aluminum-based graphene material and its preparation method, addressing the technical problems of poor interfacial wettability, easy agglomeration, secondary agglomeration during solidification, and difficulty in continuous production of graphene with an aluminum matrix. The method improves interfacial wettability by forming a nano-copper coating layer on the graphene surface through chemical copper plating. Simultaneous feeding using a combination of ultrasonic and electromagnetic field dispersion or jet deposition ensures uniform dispersion of copper-coated graphene powder within the molten aluminum. Rapid solidification is then achieved through a Castex continuous casting-extrusion or integrated jet deposition and continuous extrusion process, resulting in uniform distribution and densification of graphene within the aluminum matrix. This invention is primarily intended for use in high-conductivity, high-strength aluminum-based graphene materials required in fields such as new energy vehicles, 5G communications, and rail transportation.