224 results about "Copper coating" patented technology

The invention provides a preparation method of a bipolar current collector based on a selective double-sided modified masking film. The preparation method comprises the following steps: depositing a Ni-Cr alloy layer on a single side surface of an aluminum substrate; one side of the masking film is etched to form a roughened surface, and the other side of the masking film is hydrophobic to form a hydrophobic surface; the roughened surface of the masking film and the surface, without the Ni-Cr alloy layer, of the aluminum matrix are pressed, and the edge is coated with curing glue; and placing the pressed and glued sample in an electroplating solution to electroplate a copper layer, finally cutting off an edge glue sealing area, and stripping the masking film. According to the preparation method, the masking film used for protecting the back surface of the aluminum substrate is subjected to double-sided differential treatment, the edge sealing technology is matched, and the Ni-Cr alloy is adopted for bottoming, so that the adhesive force between the copper plating layer and the aluminum substrate is improved, the risk of causing corrosion of a primary battery is reduced, the bipolar current collector which is firmly combined and has a pure interface can be prepared, and the service life of the bipolar current collector is prolonged. And a feasible solution is provided for realizing light-weight and high-performance current collectors for electronic devices such as lithium batteries and the like.

The present invention provides a power semiconductor module having a double-sided heat dissipation, and a power semiconductor packaging assembly. The power semiconductor module comprises a first substrate and a second substrate; the first substrate and the second substrate each comprise a connecting copper layer, an insulating dielectric layer, and an outer copper coating layer which are attached; the connecting copper layer of the first substrate is arranged opposite to the connecting copper layer of the second substrate; upper bridge arm chips are arranged on the connecting copper layer of the first substrate; the connecting copper layer of the first substrate is connected to welding spot surfaces of the upper bridge arm chips; the connecting copper layer of the second substrate is connected to the upper surfaces of the upper bridge arm chips; lower bridge arm chips are arranged on the connecting copper layer of the second substrate; the connecting copper layer of the second substrate is connected to welding spot surfaces of the lower bridge arm chips; the connecting copper layer of the first substrate is connected to the upper surfaces of the lower bridge arm chips; and signal terminals and power terminals are respectively arranged on two sides between the connecting copper layer of the first substrate and the connecting copper layer of the second substrate. The use of the technical solution can reduce the size of the power semiconductor module and the size of the power semiconductor packaging assembly, and achieve double-sided heat dissipation.

The present invention belongs to the fields of electrical and electronic engineering and advanced nonferrous metal additive manufacturing. Specifically, it relates to a method for preparing copper alloy-tungsten-copper composite electrical contacts using laser additive manufacturing. The method uses coaxial powder feeding laser cladding to prepare a nickel or nickel alloy coating as an intermediate layer on a copper alloy substrate. This is followed by laser cladding to prepare a tungsten-copper coating. The composite electrical contact consists, in sequence, of a pure copper or copper alloy substrate layer, a pure nickel or nickel alloy coating, and a tungsten-copper coating. The resulting electrical contact has high electrical and thermal conductivity and good resistance to arc erosion. Using laser cladding technology to prepare copper alloy-tungsten-copper electrical contacts can effectively reduce production costs, improve production efficiency, and facilitate subsequent maintenance and repair, making it environmentally friendly.

The invention discloses a graphene reinforced Al-Cu composite material and a preparation method and application thereof, and belongs to the technical field of metal matrix composite materials and preparation thereof. The problems that in an existing graphene reinforced aluminum matrix composite, graphene is poor in dispersity in an aluminum matrix, and harmful interface reaction is serious at the high temperature are solved. According to the preparation method, the surface of aluminum powder is plated with nano-copper particles through chemical plating, the potential of the aluminum powder in a water medium is regulated and controlled through a copper plating layer on the surface, the surface of the aluminum powder is provided with positive charges, graphene can be evenly dispersed in a matrix through electrostatic self-assembly, and meanwhile the surface copper plating layer is used for inhibiting interface reaction and hindering generation of a brittle phase. In addition, by adding the metal copper, the solid solution and second phase strengthening effects can be achieved, and the mechanical property of the composite material is further improved.

The invention discloses a Kovar alloy electroplating method. The method comprises the steps that a Kovar alloy base material is pretreated; the pretreated kovar alloy base material is immersed in an acidic copper sulfate plating solution for electrolytic copper plating, so that a copper plating layer is formed on the surface of the kovar alloy base material; immersing the kovar alloy on which the copper plating layer is formed into a chemical nickel plating solution so as to form a nickel plating layer on the surface of the copper plating layer; and immersing the kovar alloy base material on which the nickel plating layer is formed into a nanogold seed crystal solution so as to form a soft gold plating layer on the surface of the nickel plating layer. The coating quality of the kovar alloy can be improved.

The invention relates to a method for realizing in-hole signal isolation based on chemical copper deposition resisting ink and a selective chemical copper deposition process, which comprises the following steps of: coating the chemical copper deposition resisting ink at preset hole opening positions on two sides of a PCB (Printed Circuit Board) core board to form chemical copper deposition resisting ink film layers; a palladium poisoning agent and a surface active agent for inhibiting palladium adsorption are added into the chemical copper deposition resisting ink; laminating the PCB core board to be separated with other boards to form a pretreated board; performing trepanning treatment on a preset trepanning position of the pretreatment plate to form a via hole; and performing chemical copper deposition treatment on the pre-treated board to form a copper layer on the side wall of the via hole of the pre-treated board, and removing the chemical copper deposition resistant ink film layer from the pre-treated board to form the PCB. Therefore, due to the fact that the palladium poisoning agent and the surface active agent for inhibiting palladium adsorption are added into the anti-electroless copper deposition printing ink, the formed anti-electroless copper deposition printing ink film layer is resistant to attack of chemical copper series liquid medicine, the problem of copper coating on a separation layer can be effectively reduced or eliminated, and in-hole signal separation can be effectively achieved.

The invention provides a method for inhibiting the formation of Kirkendall holes in an In-based brazing filler metal welding interface by adopting a vertical twin structure, which comprises the following steps of: respectively adhering a layer of vertical twin structure to the surfaces of an upper metal substrate to be welded and a lower metal substrate to be welded which are subjected to surface treatment in an electro-deposition manner, wherein the size of the vertical twin structure is 5 * 5 mm, the thickness of the vertical twin structure is 20-40 mu m, and the thickness of the vertical twin structure is 10 * 10 mm; the method comprises the following steps: carrying out a thermocompression bonding experiment on a pure copper coating with a vertical orientation nano twin crystal structure at set bonding temperature, pressure and time; according to the technical scheme, by means of the structural characteristic that the diffusion coefficient of the vertically-arranged twin boundaries in the nano twin structure is low, the diffusion rate of interface elements is reduced, flux balance is maintained, and the low impurity characteristic of the vertically-oriented nano twin film is utilized, so that formation of Kirkendall voids in the welding interface is limited. The method provided by the invention is simple and convenient to operate, and has great significance for improving the connection reliability of the In-based low-temperature bonding system.

The invention relates to the technical field of wafer packaging, and particularly discloses wafer-level packaging copper interconnection electroplating liquid and a wafer-level packaging interconnection electroplating process. According to the application, the growth of copper at an orifice is inhibited by utilizing the synergistic effect among the components such as the ammonium pyrrolidine dithiocarbamate, the chloride ions, the copper salt and the polyethylene glycol, and the thickness of a copper plating layer on the surface of the cathode is reduced by adding the anthraquinone sulfonate; and the thickness of the plating layer in the center of the through hole is increased through the synergistic effect of anthraquinone sulfonate, the leveling agent, the accelerator, the brightening agent and the inhibitor, so that the through hole can be effectively filled under the high current density, the good deep plating capacity is achieved, and the product quality can be fully improved.

The invention discloses a high bias transition carbon fiber composite material vacuum coating method, and relates to a carbon fiber composite material vacuum coating technology. The invention aims to solve the problems of high-voltage breakdown of resin and etching damage of carbon fibers caused by high-bias-voltage transition deposition of vacuum coating on the surface of the existing carbon fiber resin-based composite material. The method comprises the following steps: 1, fixing the carbon fiber composite material on the electric insulator; 2, bias voltage self-glow plasma cleaning; 3, depositing a transition layer; and 4, depositing a working coating. On the basis of an initial non-conductive mode of an electric insulator, during plasma pretreatment, the problems of electric breakdown of non-conductive resin and etching damage of conductive and low-sputtering-resistance carbon fibers are effectively solved, and non-homogeneous conductive and low-sputtering-resistance material surface bias self-glow plasma cleaning is achieved; according to the invention, the aluminum and copper coatings with compact structures are deposited by adopting HiPIMS, so that the electromagnetic wave absorption and multiple emission absorption effects are improved, and the overall electromagnetic shielding performance of the material is enhanced.

The invention provides a preparation method and application of a pure copper coating, and relates to the field of surface functional coatings, and the preparation method comprises the following steps: preparing pure copper powder, and carrying out sand blasting treatment on the surface of an aluminum alloy substrate; the aluminum alloy substrate is fixed in a closed cold spraying chamber, and pure copper powder is loaded into helium cold spraying equipment in the closed cold spraying chamber; vacuumizing until the pressure in the closed cold spraying chamber is lower than a preset pressure threshold value and the oxygen content in the chamber is lower than a preset value; helium in a buffer tank is adopted as main gas and powder feeding gas, and a pure copper coating is formed on the surface of the aluminum alloy substrate through spraying of helium cold spraying equipment; and the helium circulation system is synchronously started to recover helium in the cavity, and the helium is compressed into the buffer tank after being filtered and cooled, so that helium circulation is realized. The method adopts the circulating helium atmosphere to avoid the problem that the impurity content of the coating is increased due to high-temperature oxidation of the copper coating, the oxygen content of the coating is remarkably reduced, and the particle interface bonding is improved, so that the electric conduction and heat conduction performance of the pure copper coating is improved, and the helium use cost is reduced.

The invention belongs to the technical field of high-power electronic component base materials, and discloses an embedded high-thermal-conductivity ceramic packaging substrate for a high-power scene and a preparation method of the embedded high-thermal-conductivity ceramic packaging substrate. ABF composite layers are arranged above and below a ceramic core plate in the ceramic packaging substrate; a high-thermal-conductivity base material is fixed in the ceramic substrate; interconnection holes are formed in the ceramic substrate, and electroplating copper film layers are arranged on the upper surface and the lower surface of the ceramic substrate and in the interconnection holes; a copper-clad plate layer is arranged on the outer side of the ABF layer, a copper-clad plate groove is formed in the copper-clad plate layer, a blind hole is formed in the copper-clad plate groove, and a copper column is arranged in the blind hole; a solder mask layer is arranged on the surface of the ABF layer on the outermost side, a surface treatment layer is arranged on the outer side of the solder mask layer, and blind holes with built-in copper columns are formed in the surface treatment layer. The preparation method comprises the following steps: forming a substrate groove in the surface of the ceramic substrate; embedding a high-thermal-conductivity base material; arranging an electroplating copper film coating layer; an ABF composite layer is arranged; arranging a solder mask layer; and arranging a surface treatment layer. The LED lamp is good in heat dissipation effect.

The invention relates to a metal plated carbon fiber which comprises a carbon fiber layer, a copper or nickel plating layer is arranged on the carbon fiber layer, and an aluminum plating layer is arranged on the copper or nickel plating layer. The invention also relates to a manufacturing method of the metal-plated carbon fiber, which comprises the following steps: S1, plating copper or nickel on the surface of the carbon fiber by magnetron sputtering: in the plating process of the copper plating layer, setting the magnetron sputtering power to be 150-300W, the argon flow to be 30-80sccm and the sputtering time to be 5-15 minutes; in the sputtering process of the nickel plating layer, the magnetron sputtering power is set to be 300-350 W, the gas ratio is set to be that the ratio of argon to nitrogen is (3.5-4.5): 1, the gas flow is 40-80 sccm, and the sputtering time is 10-20 minutes; and S2, controlled sputtering aluminum plating is conducted, specifically, in the sputtering process of the aluminum plating layer, the power is set to be 250-350 W, the flow of argon or nitrogen is 40-80 sccm, and the sputtering time is 15-25 minutes. According to the method, the stability of the composite material is enhanced, the thermal conductivity and thermal stability are improved, the mechanical property is improved, and the coating thickness can be adjusted.

The invention discloses a copper-clad plate copper-clad quality detection method and system, and the method comprises the steps: applying an ultrasonic excitation signal with preset frequency and power to a to-be-detected copper-clad plate, and synchronously employing a high-speed camera to collect a dynamic micro-vibration response image sequence of the surface of the copper-clad plate under the excitation of ultrasonic waves; performing phase locking analysis on the dynamic micro-vibration response image sequence, and constructing a copper-clad plate dynamic response feature map; inputting the dynamic response feature map of the copper-clad plate into the trained defect identification model, and outputting a preliminary defect area distribution map; performing multi-scale morphological analysis and region connectivity verification on the preliminary defect region distribution map to generate an accurate positioning defect region map; and generating a comprehensive evaluation report of the copper coating quality according to a preset quality scoring rule on the basis of the accurately positioned defect area graph. According to the embodiment of the invention, the method can achieve the high-precision positioning and classification of the defects of the copper-clad plate, and provides an efficient and reliable automatic solution for the quality evaluation of the copper-clad plate.

The invention provides a copper-doped and coated sodium electric precursor as well as a preparation method and application thereof. The preparation method comprises the following steps: carrying out first coprecipitation reaction on a mixed metal salt solution, a precipitator solution and a complexing agent solution; the mixed metal salt solution comprises nickel ions, iron ions, manganese ions and copper ions; after the first coprecipitation reaction is finished, the pH value of the system is increased, a copper coating preparation stage is started, a second coprecipitation reaction continues to be carried out, after the second coprecipitation reaction is finished, the mixed metal salt solution is replaced with a copper salt solution, the pH value of the system is reduced, a third coprecipitation reaction continues to be carried out, and the copper-doped and coated sodium electric precursor is obtained. According to the preparation method, micro particles are introduced in the coating preparation stage, Cu < 2 + > is brought into a particle system in the stage that large particles adsorb the micro particles to grow, uniform coating is achieved, and finally the precursor which is uniform in element distribution, uniform in structure distribution, high in tap density, high in specific surface area and free of hardening is obtained.

The electronic expansion valve comprises a valve body and a coil component, the valve body comprises a valve seat, a valve needle, a vertical connecting pipe and a transverse connecting pipe, the valve seat is provided with a first inner hole and a second inner hole, a valve port is formed in the upper end of the second inner hole, the valve needle penetrates through the first inner hole to be matched with the valve port, and the coil component is arranged on the valve seat. The valve seat is provided with a first interface part and a second interface part, the vertical connecting pipe and the valve seat are welded and fixed at the first interface part, the transverse connecting pipe and the valve seat are welded and fixed at the second interface part, the valve seat and the valve needle are made of stainless steel materials, and the vertical connecting pipe and the transverse connecting pipe are made of copper materials; a first copper plating layer is arranged on the inner surface, used for being welded to the vertical connecting pipe, of the first connector part, and a second copper plating layer is arranged on the inner surface, used for being welded to the transverse connecting pipe, of the second connector part. The welding manufacturability and the sealing effect of the valve seat and the connecting pipe are improved, meanwhile, the economical efficiency of welding flux selection is improved, and the effect of improving the leakage performance of the valve body at low cost is achieved.

The invention belongs to the technical field of electrolytic copper foils, and relates to a strippable carrier ultrathin copper foil and a preparation method thereof.The strippable carrier ultrathin copper foil comprises a carrier layer, a stripping layer and an ultrathin copper foil layer, the stripping layer comprises an inorganic stripping layer and an organic stripping layer, and the thickness of the ultrathin copper foil layer is 3-5 microns; and the ultrathin copper foil layer is prepared by adopting an alkaline copper plating process and an acidic copper plating process in sequence. According to the method, the compact and smooth copper plating layer is obtained through alkaline copper plating firstly, then acid copper plating is conducted, and the ultrathin copper layer which is few in pinhole and can be stably peeled off is prepared through the process that the two modes are combined.

The invention belongs to the technical field of wire product processing, and particularly relates to a high-temperature-resistant low-carbon steel hot-rolled wire rod for cold rolling and a preparation method thereof. The hot-rolled wire rod comprises the following chemical components in percentage by weight: 0.15 to 0.20 percent of C, less than or equal to 0.35 percent of Si, 0.20 to 0.50 percent of Mn, less than or equal to 0.020 percent of P, less than or equal to 0.005 percent of S, 0.010 to 0.015 percent of V, 0.030 to 0.040 percent of Ti, less than or equal to 0.10 percent of Cr, Ni and Cu, 0.010 to 0.014 percent of N and the balance of iron and inevitable impurities. Through the chemical component design of the steel, the preparation process flow of KR, converter, LF refining, RH refining, continuous casting, cogging and wire rod rolling is adopted, and the controlled rolling and controlled cooling process of the wire rod is optimized, so that the high-temperature resistance of the steel is effectively improved, and the cracking problem occurring in the machining process of drawing, copper coating and cold rolling of the wire rod is solved; and the requirement of downstream users for producing high-voltage grounding wires is met.

The application discloses a high-strength alloy for an antenna and a preparation process thereof, and relates to the technical field of alloys.The application uses aluminum alloy as the antenna, and the aluminum alloy is light in weight and has good conductivity; in order to further improve the conductivity of the antenna, the antenna is more efficient in signal transmission; the application adopts electroplating technology to plate a copper layer on the surface of the aluminum alloy; and carbon nanotube-silicon dioxide compounds are added into the electroplating solution, so that the strength of the alloy for the antenna is enhanced.The carbon nanotube is high in strength, and the surface of the carbon nanotube is subjected to copper plating treatment, so that the conductivity of the antenna is improved; meanwhile, the copper plating treatment on the surface of the carbon nanotube can improve the bonding force between the carbon nanotube and the copper plating layer and improve the adhesion of the electroplating layer, so that the durability and reliability of the alloy for the antenna are enhanced.

A kind of plating experiment device and method for preparing high bonding force copper plating layer on aluminum-based heat sink surface, it relates to material processing technical field.Plasma chamber is provided with heater, motion control mechanism can carry out public self-rotating compound motion and is connected bias power supply, evaporation source includes crucible, electron gun, deflection coil and ion source, so that the inside of plasmaplasma chamber forms pure strong current ion flushing area and strong current ion enhanced electron beam evaporation plating area, vacuum and gas supply system connects plasmaplasma chamber and carries out vacuumizing, and respectively with plasmaplasma chamber and ion source connection supply reaction gas and working gas.By the spatial partition layout of plasmaplasma chamber cooperation motion control mechanism public self-rotating compound motion, workpiece is periodically alternated through two functional areas in film forming process, utilizes the ion beam mixing effect of high-energy ion to realize film densification and eliminate interface stress, ensure the bonding force and reliability of the deposited copper plating layer, multiple workpieces can be simultaneously loaded to improve production efficiency.

This invention provides a negative electrode current collector, its preparation method, a negative electrode sheet, and a lithium-ion battery. The negative electrode current collector includes a surface-treated substrate and copper plating layers disposed on opposite sides of the surface-treated substrate. The surface-treated substrate is made of aluminum foil, and its surface roughness Ra ≥ 0.5 μm; the resistivity of the copper plating layers is ≤ 2.0 × 10⁻⁶. ‑8 The bonding force between the copper plating layer and the surface-treated substrate is ≥15 N / cm (Ω·m). The negative electrode current collector of this invention combines the advantages of low cost, low density, high conductivity, and high stability, thereby improving the energy density, cycle stability, and fast-charging performance of lithium-ion batteries, and thus making it better suited for the large-scale application of high-energy-density lithium-ion batteries.

The invention discloses a copper electroplating solution and application thereof. The invention relates to a copper electroplating solution, which comprises the following raw materials: 20-250g / L of copper sulfate; 4-98g / L of sulfuric acid; the concentration of chloride ions is 50 to 300 mg / L; 0.5 g / L to 10 g / L of a displacement agent; 0.2-15 g / L of an accelerator; 2 to 20 mg / L of a leveling agent; 5-50 mg / L of a stress regulator; wherein the stress regulator comprises one or a combination of more of thiourea, boric acid, nickel salt and cobalt salt. The copper electroplating liquid can be used for rapidly electroplating and preparing a copper plating layer under the condition of high current density, and meanwhile, the obtained copper plating layer has remarkably lower internal stress, good adhesive force and better appearance, and is suitable for being applied to electrode preparation of solar cells.

The application belongs to the technical field of rare earth permanent magnet materials, and particularly relates to a method for integrating hydrogen decrepitation of a rare earth permanent magnet alloy and atomic layer deposition of a copper coating layer. The method is characterized in that the hydrogen decrepitation process of a rare earth permanent magnet alloy ingot or cast piece and the atomic layer deposition process of a coating layer are integrated in the same reaction cavity; first, the rare earth permanent magnet alloy ingot or cast piece is placed in a vacuum reaction cavity, high-purity argon gas is washed multiple times, and then sufficient hydrogen gas is introduced to make the rare earth permanent magnet alloy ingot or cast piece absorb hydrogen and decrepitate into powder and sufficiently dehydrogenate; the hydrogen decrepitated powder is heated to 80-250 DEG C under vacuum for 1.5-4 hours, and a copper coating layer with a total thickness of 10-50 nm is deposited by using the atomic layer deposition method. The application can simplify process steps, improve the coating coverage rate of the coating layer on the surface of the rare earth permanent magnet powder, modify the surface of the magnetic powder, optimize the microstructure of the magnet during the sintering and heat treatment of the coated copper coating layer on the rare earth permanent magnet, and improve the magnetic performance.

[Object]To provide a copper clad laminate that is capable of achieving high adhesion between a low dielectric resin film and a copper plating layer and a good volume resistivity while suppressing a transmission loss when being applied to a flexible circuit board, and a method for producing the copper clad laminate.[Solving Means]A copper clad laminate of the present invention includes a low dielectric resin film having a relative permittivity of 3.5 or lower and a dissipation factor of 0.008 or lower at a frequency of 10 GHz, and an electroless copper plating layer laminated on at least one surface of the low dielectric resin film. A weighted average size of crystallites in the electroless copper plating layer is 25 to 300 nm, and an adhesion strength between the resin film and the electroless copper plating layer is 4.2 N / cm or more.

The invention discloses a preparation method of a steel-based alternating-current composite conductor, the structure of the steel-based alternating-current composite conductor is as follows from outside to inside: the first layer is a copper coating layer, the second layer is an aluminum coating layer, and the innermost layer is a steel core, and the steel-based alternating-current composite conductor has the beneficial effects that a composite material with relatively high strength, good plasticity and conductivity is obtained, and the required performance can be obtained through composite preparation, deformation and aging processes; the copper-aluminum alloy material has excellent conductivity of copper, also has the characteristic of light weight of aluminum, has high strength, high modulus and low relaxation of steel and good conductivity and atmospheric corrosion resistance of copper, achieves the purposes of excellent performance and low cost, and can be widely applied to the fields of power transmission, electronic equipment, communication systems, new energy automobiles, photovoltaic power generation and the like.

The utility model discloses a terminal, a power transmission piece, an electric connection assembly and an electric connection device. The terminal comprises a connecting end which is in a flat plate shape and is provided with two opposite surfaces in the thickness direction of the connecting end. A copper coating is formed on one surface of the connecting end of the terminal through a cold coating process, and the copper coating is used for being in electric contact with a copper terminal so as to achieve electric connection between the terminal and the copper terminal. According to the utility model, the manufacturing cost can be reduced.

The present invention discloses a preparation method of an electromagnetic shielding material and the electromagnetic shielding material, which comprises the following steps: sequentially performing electroless nickel plating and electroless copper plating on a plant fiber fabric to obtain a fabric with double-layer coating; coating a polydimethylsiloxane solution on both the front and back sides of the fabric with double-layer coating, and drying to obtain the electromagnetic shielding material; the inner layer of the fabric with double-layer coating is a nickel coating layer, and the outer layer is a copper coating layer. The electromagnetic shielding material of the present invention can effectively reduce the electromagnetic reflection loss, enhance the electromagnetic absorption loss, is beneficial to the absorption and conversion of electromagnetic energy, and avoids the secondary pollution of electromagnetic waves.

A composite copper foil and a production process therefor, relating to the technical field of copper foil manufacturing. The composite copper foil comprises a substrate (70) and copper plated layers (80) provided on two sides of the substrate. The production process comprises: first, placing a substrate (70) into an acid tank (11), such that the surface of the substrate (70) is slightly corroded and thus coarsened; then using a moving mechanism (20) to take out the substrate (70) and using a rinsing assembly (30) to rinse same; then the moving mechanism (20) feeding the substrate (70) into an alkaline tank (12) for oil removal and, by means of a negative-pressure fan, air-drying the substrate (70) that has undergone the oil removal; then attaching a reducing agent to the substrate (70) and, in a chemical plating mode, soaking the substrate (70) in a reaction tank (90) filled with an electrolyte, such that elemental copper in the electrolyte is attached to the substrate to form copper plated layers; then increasing the thickness of the copper plated layers in a horizontal plating mode; and finally, attaching a negative electrode material to the copper plated layers, so as to complete the manufacturing of the composite copper foil. The copper plated layers have uniform thickness, and the copper foil exhibit good corrosion resistance and thermal conductivity.

The invention belongs to the technical field of double-layer copper-plated conductors, and provides a double-layer copper-plated conductor precisely regulated and controlled automatic electroplating production line system which is characterized in that an inert gas transition cabin with the argon purity not lower than 99.999% and the pressure maintained to be 5-10 kPa is arranged between a first-layer plating tank and a second-layer plating tank, 5-10 nm precise etching is achieved through low-temperature plasma cleaning, and a second-layer plating tank is arranged between the first-layer plating tank and the second-layer plating tank; a roughened grain boundary structure is formed, an EBSD sensor is adopted to collect grain texture direction and size data of a bottom-layer copper coating, a crystal structure analytical model is constructed based on a CNN in combination with a lattice matching database, a crystal nucleus growth induction target is output, and real-time production parameters and parameter threshold ranges corresponding to the induction target are compared; dynamically regulating and controlling production parameters through a PID algorithm; epitaxial growth of the two copper plating layers is achieved, the interface internal stress is remarkably reduced, the bending life of the conductor is prolonged, the structural reliability of the conductor is improved, and the performance requirements of high-end equipment for high-frequency communication, flexible electronics and the like are met.

The invention relates to the technical field of semiconductor devices, in particular to a nickel-iron alloy copper-plated lead frame, a preparation method thereof and an integrated circuit packaging body. The invention discloses a nickel-iron alloy copper-plated lead frame, which comprises a lead frame base material and a composite copper plating layer coated on at least part of the surface of the lead frame base material, wherein the base material of the lead frame is made of Ni80Fe20 ferro-nickel alloy; the surface of the composite copper plating layer is subjected to brown oxidation treatment, and the thickness of the composite copper plating layer is 2-5 [mu] m. According to the ferro-nickel alloy copper-plated lead frame, the preparation method thereof and the integrated circuit packaging body, Ni80Fe20 ferro-nickel alloy is adopted as a base material, and the surface roughness, the binding force of a plastic packaging part and the adhesive force of a plating layer of the ferro-nickel alloy lead frame are synchronously improved through the synergistic effect of a composite copper plating layer and brown oxidation treatment, so that the service life of the ferro-nickel alloy lead frame is prolonged. And the use requirement of the integrated circuit packaging body on high reliability is met.

The application discloses a preparation process of a heat-conducting and electricity-conducting power module and relates to the technical field of semiconductors. The process comprises the following steps: 1, performing a first sand blasting treatment on a spraying area of an aluminum radiator; 2, spraying a first copper coating layer on the spraying area; 3, performing a second sand blasting treatment on the first copper coating layer; 4, spraying a second copper coating layer on the first copper coating layer; 5, emitting laser to irradiate the second copper coating layer, softening the surface of the second copper coating layer, spraying a third copper coating layer on the second copper coating layer, and obtaining a heat-conducting and electricity-conducting copper plating layer; 6, eliminating internal stress of the heat-conducting and electricity-conducting copper plating layer by using a directional high-frequency magnetic field; and 7, directly mounting a chip on the heat-conducting and electricity-conducting copper plating layer to obtain the heat-conducting and electricity-conducting power module. The process alternately performs sand blasting and cold spraying, and increases the processes of softening copper powder and eliminating stress, so that the internal stress of the copper plating layer and the porosity are eliminated, the bonding force between the copper plating layer and the aluminum radiator and between copper powder particles is increased.