PCT No. PCT / EP96 / 05140 Sec. 371 Date Apr. 23, 1998 Sec. 102(e) Date Apr. 23, 1998 PCT Filed Nov. 21, 1996 PCT Pub. No. WO97 / 19206 PCT Pub. Date May 29, 1997The invention relates to a method for the electrolytic deposition of
metal coatings, in particular of
copper coatings with certain physical-mechanical and optical properties and uniform
coating thickness. According to known methods using soluble anodes and applying
direct current, only uneven
metal distribution can be attained on complex shaped workpieces. By using a
pulse current or
pulse voltage method, the problem of the coatings being of
varying thickness at various places on the workpiece surfaces can indeed be reduced. However, the further problem of the geometric ratios being changed continuously during the depositing process by dissolving of the anodes is not resolved thus. This can be avoided by using insoluble anodes. In order to guarantee sufficient stability of the anodes and a bright
coating even at those points on the workpiece surfaces, onto which the
metal is deposited with
high current density, it is essential to add compounds of an electrochemically reversible
redox system to the depositing solution.