Acid bright copper-plating electroplating process

An electroplating process and copper plating technology, applied in the field of acid bright copper electroplating electroplating process, can solve the problems of difficult processing, increased coating thickness, short service life, etc., and achieve the effect of smooth surface of workpiece and uniform coating

Inactive Publication Date: 2013-09-25
河南江河机械有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1. When the coating exceeds a certain thickness, the thickness of the coating increases too slowly per unit time, and the time is long, so it needs to be divided into multiple times;
[0006] 2. The bonding force between the copper layer and the metal substrate is poor, and the service life is short. When the subsequent process needs to be processed, the plating layer is separated from the substrate;
[0007] 3. The plating solution is unstable, and there will be copper plating on the surface of the plating layer, and the appearance is very rough, which will cause difficulties in the subsequent process.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Embodiment 1: a kind of acid bright copper plating electroplating process, comprises the preparation of copper plating solution, workpiece pretreatment and acid bright copper plating, and the concrete steps of this process are as follows:

[0033] (1) Preparation of copper plating solution

[0034] Raw material ratio of copper plating solution is 2 m 3 Based on deionized water, copper sulfate is 400kg, sulfuric acid is 160kg, activated carbon is 5kg, hydrochloric acid is 150g, brightener A is 15L and brightener B is 1.6L;

[0035] The specific configuration method is as follows:

[0036] a. Under stirring, mix 2 m 3 Deionized water injection 3 m 3 in the pre-used slot;

[0037] b. under stirring, add 160kg of sulfuric acid in step a, control the solution temperature in the pre-use tank at 33°C;

[0038] c. under stirring, add 400kg copper sulfate in step b, stir until completely dissolving;

[0039] d. Under stirring, sprinkle 5kg of activated carbon evenly into s...

Embodiment 2

[0046] Embodiment 2: a kind of acid bright copper plating electroplating process comprises the preparation of copper plating solution, workpiece pretreatment and acid bright copper plating, and the concrete steps of this process are as follows:

[0047] (1) Preparation of copper plating solution

[0048] Raw material ratio of copper plating solution is 2 m 3 Based on deionized water, copper sulfate is 360kg, sulfuric acid is 180kg, activated carbon is 6kg, hydrochloric acid is 120g, brightener A is 14L and brightener B is 1.5L;

[0049] The specific configuration method is as follows:

[0050] a. Under stirring, mix 2 m 3 Deionized water injection 3 m 3 in the pre-used slot;

[0051] b. under stirring, add 180kg of sulfuric acid in step a, control the solution temperature in the pre-use tank at 35°C;

[0052] c. under stirring, add 360kg copper sulfate in step b, stir until completely dissolving;

[0053] d. Under stirring, sprinkle 6kg of activated carbon evenly into step...

Embodiment 3

[0060] Embodiment 3: a kind of acid bright copper-plating electroplating process, comprises the preparation of copper-plating solution, workpiece pretreatment and acid bright copper-plating, and the concrete steps of this process are as follows:

[0061] (1) Preparation of copper plating solution

[0062] Raw material ratio of copper plating solution is 2 m 3 Based on deionized water, copper sulfate is 420kg, sulfuric acid is 160kg, activated carbon is 5kg, hydrochloric acid is 130g, brightener A is 16L and brightener B is 1.8L;

[0063] The specific configuration method is as follows:

[0064] a. Under stirring, mix 2 m 3 Deionized water injection 3 m 3 in the pre-used slot;

[0065] b. under stirring, add 160kg of sulfuric acid in step a, control the solution temperature in the pre-use tank at 36°C;

[0066] c. under stirring, add 420kg copper sulfate in step b, stir until completely dissolving;

[0067] d. Under stirring, sprinkle 5kg of activated carbon evenly into s...

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PUM

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Abstract

The invention relates to an acid bright copper-plating electroplating process. The process comprises the steps of preparation of a copper plating solution, workpiece pretreatment, acid bright copper plating and the like. The process can continuously plate multiple copper coatings which are some millimeters thick on the surface of a metal substrate without electroplating for several times; the process guarantees good binding force between electroplated cast copper and the substrate, and can bear external force from turning, milling, drawing, externally throwing and other machining; and a plating solution is good in stability and uniform in surface.

Description

technical field [0001] The invention belongs to the technical field of electroplating, and in particular relates to an acidic bright copper electroplating process. Background technique [0002] Acidic copper plating has high current efficiency (nearly 100%), simple composition, and can be fully bright and tough after adding a brightener. It is currently the most superior plating type in leveling and brightness. In addition, the price of metal copper is much lower than that of metal nickel, so it is widely used in our country. [0003] It is well known that the acid copper plating solution must contain chloride ions in a certain concentration range. But its effect on acid copper is subtle. According to theoretical research, when the content of chloride ions is low, the electronic configuration of the surface complexes formed by chloride ions and copper in the cathode area mainly exists in the form of dsp2 hybridization, and the stability of the complex ions is too strong, r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38
Inventor 蒋文中杨利东吴天东张念利闻国民
Owner 河南江河机械有限责任公司
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