Method for preparing diamond enhanced copper based composite with high volume fraction

A copper-based composite material and diamond reinforced technology, applied in the field of metal-based composite materials, can solve the problems of poor wettability and insufficient bonding strength, and achieve the effects of improving thermal conductivity, avoiding interfacial thermal resistance and good performance.

Inactive Publication Date: 2011-05-25
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the problems of poor wettability and insufficient bonding strength between diamond and copper, the present invention provides a high-volume-fraction diamond-reinforced copper-based composite material with high thermal conductivity and a preparation method

Method used

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  • Method for preparing diamond enhanced copper based composite with high volume fraction
  • Method for preparing diamond enhanced copper based composite with high volume fraction
  • Method for preparing diamond enhanced copper based composite with high volume fraction

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] Diamonds with a particle size of 125 μm are selected for purification treatment, and a 1 μm thick Cr layer is plated on the diamond surface by vacuum evaporation, and then the Cr-plated diamonds are placed in the drum for copper element barrel plating to thicken, and the diamond after barrel plating The thickness of the copper coating on the surface is 20 μm, and the weight gain of the diamond is 169%; put the barrel-plated diamond into a plasma sintering furnace (SPS) for sintering to obtain a diamond-copper composite material; the sintering temperature is 925°C, and the sintering pressure is 50MPa , the heating rate is 30°C / min, the heat preservation is 10min, and the atmosphere is vacuum. The density of the diamond-copper composite material prepared by this process is 98%, and the thermal conductivity reaches 505W / (m·K).

Embodiment 2

[0015] The process conditions of this embodiment are the same as those of Example 1, except that the average particle size of the added diamond is changed, and the average particle size of the diamond used is 212 μm. The compactness of the prepared diamond-reinforced copper-based composite material is 95%, and the thermal conductivity is 475W / (m·K).

Embodiment 3

[0017] The process conditions of this embodiment are the same as those of Example 1, except that the average particle size of the added diamond is changed, and the average particle size of the diamond used is 75 μm. The compactness of the prepared diamond-reinforced copper-based composite material is 98%, and the thermal conductivity is 450W / (m·K).

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Abstract

The invention relates to a diamond enhanced copper based composite and a preparation method thereof, belonging to the metal based composite field. In the composite of the invention, the volume ratio of diamond to copper is 40-70:60-30 and the particle size of diamond is 38-212mu m. The preparation method comprises the following steps: plating a 0.1-2mu m of Cr layer on the surface of diamond through vacuum evaporation after the surface pretreatment of diamond; placing the diamond plated with Cr in a barrel to perform copper element barrel plating and thickening, wherein the copper coating on the surface of diamond is 7-20mu m in thickness and the weight of the obtained diamond is increased by 100%-170%; and directly placing the obtained diamond in a spark plasma sintering (SPS) furnace to prepare the diamond-copper composite. The method of the invention directly uses the thicker copper coating on the surface of diamond as base material, thus avoiding the problem that diamond is not mixed uniformly with copper powder so as to cause the additional interfacial thermal resistance; and all kinds of composites with different diamond contents can be obtained by changing the increased weight of diamond, thus the maneuverability is high and the technology is simple. The composite has higher thermal conductivity and can be used in the fields such as electronic packaging.

Description

technical field [0001] The invention belongs to the research field of metal-based composite materials, and relates to a method for preparing high-volume-fraction diamond-reinforced copper-based composite materials. Background technique [0002] With the rapid development of the electronics industry, the integration of integrated circuits is getting higher and higher, and the power of devices is increasing. The temperature rise caused by the large amount of heat generated by electronic components has become one of the important factors that affect the accuracy of devices and cause device failure. First, research on high-performance packaging materials and heat dissipation materials has become a must for the development of the electronics industry. The thermal conductivity of traditional metal-based electronic packaging materials (W-Cu, Mo-Cu) with metal particles W and Mo as reinforcing phases can no longer meet the higher requirements of modern high-power devices. SiCp-Al e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C1/05C22C26/00C22C9/00
Inventor 徐良曲选辉何新波董应虎
Owner UNIV OF SCI & TECH BEIJING
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