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A preparation method of gum-free flexible copper-coating plate

A technology of flexible copper clad laminates and glue molding, which is applied in the field of synthesis of polyimide matrix resin to achieve the effects of good flexibility, high folding resistance and good dimensional stability

Pending Publication Date: 2008-04-09
湖北省化学研究院
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the method of laminating polyimide obtained by combining chemical imidization and thermal imidization with copper foil to prepare adhesive-free 2L-FCCL has not yet been specifically reported.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Add 250 grams of N-methylpyrrolidone (NMP) into a 500 ml container, then add 15 grams (0.075 moles) of ODA and 5.65 grams (0.025 moles) of OTOL, stir and dissolve completely, then add 31 grams (0.100 moles) of ODPA, Into the protective gas N 2 , and continued to stir for 8 hours, and the intrinsic viscosity of the polyamic acid solution measured at this time was 1.2dl / g.

[0021] 40 ml of acetic anhydride and 30 ml of pyridine were added to the above polyamic acid solution, stirred at 50° C., and allowed to react for 8 hours to obtain a polyimide prepolymer solution.

[0022] Coat the above-mentioned polyimide prepolymer solution on a commercially available electrolytic copper foil with a thickness of 35 microns, and in N 2 Under protection, the temperature was raised stepwise at 50°C / 20 minutes, 100°C / 20 minutes, 150°C / 20 minutes, 200°C / 20 minutes, and the solvent was removed by heating. Then it was heated at 250°C for 60 minutes to further imidize it to obtain an ad...

Embodiment 2

[0024] Add 300 grams of NMP to a 500 ml container, then add 12 grams (0.06 moles) of ODA and 18.64 grams (0.04 moles) of TBAPP, stir and dissolve completely, then add 32.2 grams (0.10 moles) of BTDA, and fill with protective gas N 2 , and continued to stir for 12 hours, and the intrinsic viscosity of the polyamic acid solution measured at this time was 1.3dl / g.

[0025] 50 ml of trifluoroacetic anhydride and 25 ml of pyridine were added to the above polyamic acid solution, stirred at 50° C., and allowed to react for 8 hours to obtain a polyimide prepolymer solution.

[0026] Coat the above-mentioned polyimide prepolymer solution on a commercially available rolled copper foil with a thickness of 18 microns. 2 Under protection, the temperature was raised stepwise at 50°C / 20 minutes, 100°C / 20 minutes, 150°C / 20 minutes, 200°C / 20 minutes, and the solvent was removed by heating. Then heat at 260° C. for 40 minutes to further imidize it to obtain an adhesive-free polyimide copper cl...

Embodiment 3

[0028] Add 250 grams of N, N-dimethylformamide (DMF) into a 500 ml container, then add 14 grams (0.07 moles) of ODA and 6.78 grams (0.03 moles) of OTOL, stir to dissolve completely, then add 32.2 grams (0.10 moles) )BTDA, filled with protective gas N 2 , and continued to stir for 24 hours, and the intrinsic viscosity of the polyamic acid solution measured at this time was 1.3dl / g.

[0029] 40 ml of butyric anhydride and 30 ml of triethylamine were added to the above polyamic acid solution, stirred at 60° C., and allowed to react for 6 hours to obtain a polyimide prepolymer solution.

[0030] The above-mentioned polyimide prepolymer solution was coated on a commercially available electrolytic copper foil with a thickness of 12 microns, and the 2 Under protection, the temperature was raised stepwise at 50°C / 20 minutes, 100°C / 20 minutes, 150°C / 20 minutes, 200°C / 20 minutes, and the solvent was removed by heating. Then it was heated at 270°C for 30 minutes to further imidize it t...

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Abstract

The invention discloses a preparation method for a non-glue type flexible copper clad laminate. The invention has the method that monomer aromatic diamine is dissolved in non-protonic polar solvent, and aromatic tetracid dianhydride with the equal molar is added into the solution, thereby generating polyamic acid solution with 10 to 30 percent of the solid content in a polyamic way; dehydrating agent and catalyst are dropwise added into the solution, and the chemical imidization is performed at 10 to 80 DEG C, thereby obtaining polyimide precursor solution; the polyimide precursor solution is coated on the copper foil surface with the 60 to 70 micron thickness, and heated to remove the solvent, and the thermal imidization is further performed at 250 to 300 DEG C, thereby obtaining the non-glue type flexible copper clad laminate. The non-glue type flexible copper clad laminate of the invention has the excellent heat resistant performance, is suitable for the non-lead welding meeting the environmental protective requirement, has small crimpability, good dimensional stability, better mechanical strength, high peel strength, and high flexibility resistance, and simultaneously has lower thermal expansion coefficient, dielectric constant, and water absorption.

Description

technical field [0001] The invention relates to the synthesis of a polyimide matrix resin for an adhesive-free flexible copper-clad laminate and a preparation method for the adhesive-free flexible copper-clad laminate. technical background [0002] The short, small, light, thin, and beautiful demand trend of electronic information products has put forward higher requirements for the performance and production process of circuit boards. Flexible printed circuit board (FPC) has been widely used because of its lightness, thinness and good flexibility. [0003] Among the flexible copper-clad foil (FCCL) substrates used in flexible printed circuits, there are three-layer method (3L-FCCL) and two-layer method (2L-FCCL) substrates, of which the most common three-layer method substrate is the use of adhesives. Adhesive-type products formed by bonding and laminating polyimide film and copper foil, such as the adhesive prepared by using bismaleimide modified nitrile rubber as describ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05D7/14B05D3/00C09D179/08
Inventor 范和平付梅芳
Owner 湖北省化学研究院
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