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Copper-coating foil microwave dielectric plate with high dielectric constant and preparation method thereof

A high dielectric constant and microwave dielectric technology, applied in the field of high dielectric constant copper clad microwave dielectric board and its preparation, can solve the problems of small board size, limited application, poor dielectric performance and thickness uniformity, and achieve The effect of ensuring uniformity, uniform dielectric properties, and excellent formability

Active Publication Date: 2017-05-31
CHINA ELECTRONICS TECH GRP NO 46 RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the high dielectric constant dielectric substrate can be prepared by the molding process, there are the following problems: (1), the size of the plate is small, and the application is limited; (2), the dielectric properties and thickness uniformity are poor, and it can only be applied to the low-end field

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 2

[0074] 1. Surface modification;

[0075] Will Sm 0.5 Ca 0.5 TiO 3 Ceramic powder or fiber are put into PH=3.0 formic acid solution, add 1.0wt% aminoethylaminopropyltrimethoxyorganosilane coupling agent in the solution, the weight percent of aminoethylaminopropyltrimethoxyorganosilane is 1.0wt% of ceramic powder or fiber weight percentage, after stirring, put it in an oven, dry at 120°C for 4 hours, and then prepare modified ceramic powder or modified glass fiber by grinding and sieving.

[0076] 2. The first mechanical mixing;

[0077] will modify Sm 0.5 Ca 0.5 TiO 3 70wt% of ceramic powder, 5wt% of modified glass fiber and 25wt% of polytetrafluoroethylene were put into a high-speed mixer and stirred for 10h.

[0078] 3. The second mechanical mixing;

[0079] The first step, in order to improve the compatibility of modified ceramic powder and PTFE, add 5wt% sodium methylene bis-naphthalene sulfonate to the above mixture, the weight percentage of sodium methylene bis-na...

Embodiment 4

[0108] MgTiO 3 Put ceramic powder or glass fiber into formic acid solution with pH=4.0, add 2.0wt% heptadecafluorodecyltriethoxysilane coupling agent to the solution, the weight percentage of heptadecafluorodecyltriethoxysilane is ceramic 2.0wt% of the weight percentage of powder or glass fiber, put it in an oven after stirring, and dry it at 120°C for 4 hours, then grind and sieve to prepare modified ceramic powder or modified glass fiber.

[0109] 2. The first mechanical mixing;

[0110] Modified MgTiO 3 Put 65wt% powder, 5wt% modified glass fiber and 30wt% PTFE into a high-speed mixer and stir for 6h.

[0111] 3. The second mechanical mixing;

[0112] The first step, in order to improve the compatibility of ceramic powder and PTFE, add 8wt% TMN-10 to the above mixture, that is, the weight percentage of TMN-10 is modified MgTiO 3 8wt% of powder 65wt%, modified glass fiber 5wt% and PTFE30wt% mass percentage, continue to mix 8h;

[0113] Second step, add 15wt% isopropanol...

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Abstract

The invention relates to a copper-coating foil microwave dielectric plate with high dielectric constant and a preparation method thereof. The preparation method comprises the following steps of modifying the surface, and preparing modified ceramic powder or modified glass fiber; fully mixing 50 to 80wt% of modified ceramic powder, 2 to 10wt% of modified glass fiber, and 15 to 45wt% of PTFE (polytetrafluoroethylene) resin; adding 2 to 10wt% of surfactant into a mixture, and continuing to mix; adding 5 to 20wt% of flocculant, until precipitate is formed, and filtering; drying, and crushing into a bread crumb-shaped matter; adding 2 to 20wt% of plasticizer, and mixing to form a dough-shaped matter; putting onto a calendering machine, calendering, and forming, so as to obtain a raw base sheet; drying, sequentially overlapping the dried base sheets, hot pressing and sintering, and naturally cooling. The preparation method has the advantages that the dough-shaped matter after the mixing of the raw material has excellent fluidity and forming property; by adopting a calendaring roll to repeatedly calender, the uniformity of thickness and dielectric property is guaranteed; by adopting a calendering technology, the problem of molding technology size and uniformity are solved.

Description

technical field [0001] The invention relates to a high dielectric constant copper-clad microwave dielectric board and a preparation method thereof, belonging to the field of manufacturing high-dielectric constant (between 8.0 and 15.0) copper-clad microwave composite dielectric boards. Background technique [0002] With the rapid development of information technology, it is increasingly difficult for traditional materials to meet the requirements of lightweight electronic products, high-speed signal transmission, and high-frequency bandwidth. Due to its special molecular structure, PTFE resin has excellent and stable microwave properties, with a relative dielectric constant of about 2.1 and a dielectric loss of 10 –4 It can be used for a long time at 180~260 ℃. High dielectric constant microwave circuit boards (between 8.0 and 15.0) are characterized by high dielectric constant, which is conducive to reducing the size of the circuit board, and can be applied to plug-in ante...

Claims

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Application Information

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IPC IPC(8): C08L27/18C08K9/06C08K3/00C08K7/14
CPCC08K3/22C08K3/24C08K7/14C08K9/06C08K2003/2241C08L27/18
Inventor 张立欣王丽婧纪秀峰张伟张海涛庞子博武聪贾倩倩金霞
Owner CHINA ELECTRONICS TECH GRP NO 46 RES INST
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