25 results about "Copper atom" patented technology

The invention belongs to the technical field of metal powder preparation, and particularly relates to a preparation method of copper powder. According to the method, the pH value of a reduction reaction system is precisely regulated and controlled to be within the range of 5.38-9.38, the dispersing agent is reasonably added in stages before and after pH regulation, and the copper powder with the small average particle size and the low variable coefficient is successfully prepared. From the perspective of the process principle, the accurate regulation and control of the pH value can influence the crystal growth kinetics of copper hydroxide by adjusting the proton concentration, and directionally induce the copper hydroxide to form a target crystal form with a regular structure and uniform morphology, thereby laying a foundation for uniform nucleation and growth of copper atoms in the subsequent reduction reaction; by adding the dispersing agent in stages, the steric hindrance effect and the interface adsorption effect of the dispersing agent can be synergistically exerted, copper hydroxide particles are effectively inhibited from being agglomerated in the early stage, copper particles are prevented from being agglomerated due to too high local concentration in the reduction process in the later stage, and the consistency of the particle size is further guaranteed.

The present application relates to the technical field of nano new material preparation, in particular to a kind of antibacterial flame-retardant multifunctional cuprous oxide / sb2o3 nano material and its preparation method.The method of the present application is characterized by using electrostatic adsorption principle, copper oxide is loaded to the surface of sb2o3, and copper atom will partially replace antimony atom, and Cu-O-Sb binding bond is formed by electron transfer, to prepare cuprous oxide / sb2o3 nano material.The cuprous oxide / sb2o3 nano material prepared by the method of the present application has high purity, good dispersibility, stable structure and excellent antibacterial performance, and the detection of escherichia coli and staphylococcus aureus antibacterial rate is all >99%, the flame-retardant effect is remarkable, and the combustion limited oxygen index is increased by about 25%, which can be applied to the fields of textiles, plastic products and coatings, and is suitable for large-scale industrial production and popularization.

The application provides a collector and a flotation process of copper sulfide ore. The collector comprises, in parts by weight, 100 parts of a sulfide urethane compound, 10-20 parts of (methyl) benzotriazole (sodium) and 10-20 parts of a cosolvent. In the flotation operation, the (methyl) benzotriazole (sodium) can be adsorbed and chelated with active copper atoms or copper ions on the surface of the copper sulfide ore, thereby forming a hydrophobic protective film on the surface of the copper sulfide ore, and further improving the hydrophobicity of the copper sulfide ore. The sulfide urethane compound has good selectivity for the copper sulfide. The cosolvent can promote the dissolution and dispersion of the sulfide urethane compound and the (methyl) benzotriazole (sodium) in the ore pulp. Compared with other ranges, limiting the amount of the above components in the above range is beneficial to the synergistic effect of the three, the collection capacity of the collector and the hydrophobicity of the copper sulfide ore, and further improving the copper recovery rate under the premise of ensuring the grade of copper concentrate.

This application discloses a copper nanocluster, its preparation method, and its application. The copper nanocluster comprises copper atom aggregates and a stabilizer coated on the surface of the copper atom aggregates; the stabilizer includes casein. The copper nanocluster of this application not only improves the mechanical properties and hydrophobic properties of materials, making waterborne polyurethane materials hydrophobic, but also endows waterborne polyurethane materials with excellent flame-retardant and antibacterial properties. Furthermore, it simplifies the production process, reduces product costs, and the materials used have the advantages of being green and renewable.

The invention relates to the technical field of catecholamine detection, in particular to a copper-doped carbon dot with similar catechol oxidase activity as well as a preparation method and application of the copper-doped carbon dot. The copper-doped carbon dot provided by the invention can be used as a nano-enzyme for specific catalytic oxidation of catecholamine, so that catecholamine is detected by a colorimetric method. Copper atoms in the copper-doped carbon dots are dispersed in a monatomic form, and a local coordination structure is Cu-N3O which is similar to metal active sites in natural enzyme; according to the structure, the electron transfer capability and the redox activity of a Cu center are remarkably enhanced, so that the structure shows efficient catalytic activity and substrate specificity in a catecholamine oxidation reaction.

The invention discloses an oxygen-deficient titanium dioxide supported copper atom photocatalyst and a preparation method and application thereof, and the preparation method comprises the following steps: firstly, carrying out heat treatment on commercial titanium dioxide in an inert atmosphere to prepare a titanium dioxide carrier with rich oxygen deficiencies; then, a soluble copper salt is used as a copper source, and copper species are anchored on the oxygen defect site of titanium dioxide in an atomic-scale dispersion form by using a replacement method of slow melting control of an ascorbic acid ice block; according to the invention, oxygen deficiency is used as a natural atom capture trap, and the photocatalyst with strong copper-titanium dioxide interface bonding and high copper species dispersity is successfully prepared through a slow-release reduction strategy. The photocatalyst is remarkably improved in the aspects of visible light response and photo-generated charge separation efficiency, and has a wide application prospect in the fields of photocatalytic decomposition of tetracycline antibiotics, degradation of sulfonamide organic pollutants and the like.

The invention provides a copper-based catalyst for a fuel cell cathode as well as a preparation method and application of the copper-based catalyst, and the preparation method comprises the following steps: preparing 3, 5-diamino-1, 2, 4-triazole copper complex powder; and carrying out pulse laser treatment on the 3, 5-diamino-1, 2, 4-triazole copper complex powder, so as to obtain the 3, 5-diamino-1, 2, 4-triazole copper complex powder. The analysis of ICP-MS, TGA and XPS shows that the pulsed laser treatment eliminates at least a portion of water molecules coordinated with adjacent copper atoms, which results in an increase in oxygen vacancies between adjacent copper atoms, enhancing the preference of "side-to-" O2 adsorption configurations, thus promoting the cleavage of O-O bonds during ORR. Therefore, the 3, 5-diamino-1, 2, 4-triazole copper complex treated by the pulse laser shows higher four-electron pathway selectivity than the 3, 5-diamino-1, 2, 4-triazole copper complex before treatment.

The application discloses a surface protection method of a Nd-Fe-B double-plating layer, which comprises the following steps: after a Nd-Fe-B part is subjected to mechanical treatment of surface physical defects and surface oil removal treatment, the Nd-Fe-B part is subjected to ultrasonic treatment in an acid pickling solution; then, a copper layer is deposited on the surface of the Nd-Fe-B part by a physical gas deposition method or a magnetron sputtering method, wherein part of copper atoms diffuse into a surface layer of the Nd-Fe-B part and are distributed in grain boundaries; and a nickel layer is electroplated on the copper layer deposited on the surface of the Nd-Fe-B part. The application optimizes boundary microstructure by depositing the copper layer, and on the other hand, the double-plating layer is preferentially selected to replace a three-layer plating layer structure, so that magnetic shielding generated by the plating layer is reduced; and the new surface protection with high corrosion resistance is realized, which does not affect surface adhesion and greatly reduces loss of magnetic performance or even does not cause loss of magnetic performance.

The invention discloses a simulation method for preparing an aluminum-tin-copper film through magnetron sputtering and a related device, and relates to the technical field of analogue simulation, the method comprises the following steps: simulating a process of bombarding an aluminum-tin-copper alloy target material by argon ions according to a preset energy range of the argon ions to obtain sputtering atom data; based on the sputtering atom data, simulating the process of moving aluminum atoms, tin atoms and copper atoms from a target surface to a matrix by utilizing a constructed target three-dimensional model of magnetron sputtering equipment to obtain data of the atoms reaching the matrix; preprocessing the copper substrate in the constructed simulation box to obtain a target molecular dynamics simulation system; and determining deposition parameters according to the atom arrival matrix data, and performing aluminum-tin-copper film deposition process simulation and relaxation treatment on the target molecular dynamics simulation system based on the deposition parameters to obtain a microstructure model of the aluminum-tin-copper film. The simulation method is provided for process development and optimization of magnetron sputtering preparation of the high-performance aluminum-tin-copper thin film.

The invention discloses a nickel alloy coated copper skeleton catalytic electrode and a preparation method thereof. The method comprises the following steps: sequentially carrying out solution atomic layer deposition nucleation and autocatalytic amplification deposition treatment on a three-dimensional porous foamy copper substrate to obtain a deposition sample coated with a non-noble metal coating; carrying out annealing thermal diffusion treatment on the deposition sample to obtain an annealed sample; in the annealing process, copper atoms in the three-dimensional porous foamy copper substrate are diffused to the non-noble metal plating layer, so that the non-noble metal plating layer is converted into a solid solution transition layer, and the concentration of the copper atoms in the solid solution transition layer is gradually reduced from inside to outside; and sequentially carrying out chemical dealloying and electrochemical selective dealloying treatment on the annealed sample, and dissolving a copper enrichment site in the solid solution transition layer to form a through nanopore channel, so as to obtain the nickel alloy coated copper skeleton catalytic electrode. The structure obtained through the method is good in stability, high-density grain boundaries and oxygen vacancies can be exposed on the surface of the material, the charge transfer efficiency and the active site density are remarkably improved, and the catalytic performance is improved.

The application provides a white light phosphor powder based on copper-iodine organic hybrid clusters and a preparation method thereof, and has a structure shown in formula I. The structure of the white light phosphor powder in the application is that Cu4I4 is used as an inorganic core, and copper atoms are coordinated with nitrogen and phosphorus atoms on ligands to form a stable and unique cluster structure. The light emitting mechanism of the cluster is charge transfer from the inorganic core to the ligand, and the simple core and the ligand cooperate with each other to form degenerate emission energy levels, so that white light emission with double wide peaks from 400 to 800 nm is realized. The light emitting quantum yield reaches 97.8%. The material also exhibits excellent stability, and the thermal decomposition temperature is as high as 265 DEG C. The material also has low thermal quenching, and still maintains more than 80% of the original light emitting quantum yield under the condition of 240 DEG C. The application also provides an application of the white light phosphor powder based on copper-iodine organic hybrid clusters. The white light phosphor powder is applied to the field of solid state lighting, and has significant advantages and application prospects.

The invention discloses a preparation method of antioxidant nano-copper particles based on an intermediate metastable state, which comprises the following two steps: firstly, reacting copper salt with a first reducing agent and a pH regulator for 10-40 minutes in a first organic solvent of 70-130 DEG C to obtain copper-based intermediate particles of 20-25 nm; and then dispersing the intermediate in deionized water, adding a second reducing agent, a pH regulator and a coating agent, reacting at 70-130 DEG C for 20-60 minutes, so that the coating agent and copper atoms are deposited and synchronously bonded in situ under an alkaline condition to form a continuous coating layer with the thickness of 4-10nm, and finally obtaining the antioxidant nano-copper particles with the particle size of 30-40nm and high sphericity through epitaxial growth control. According to the preparation method, nucleation and growth processes are accurately regulated and controlled under mild conditions, and the nano-copper particles which are uniform in particle size, high in sphericity degree and long-acting in oxidation resistance are directly prepared.

The present invention provides a metal component that suppresses unevenness in the luster of precious metals while maintaining high connection reliability of metal components achieved by using precious metals. [Solution] The base material 10 contains copper and has a plurality of crystal grains. The plating portion 20H1 provided on the surface SM of the base material 10 contains copper at a copper atom concentration lower than that of the base material 10, or substantially contains no copper. The plating portion 20H1 has a first layer 21, a second layer 22, a third layer 23, and a fourth layer 24. The first layer 21 is provided on the surface SM of the base material 10 and has a plurality of crystal grains epitaxially formed on a plurality of crystal grains of the base material 10. The second layer 22 contains nickel and has a plurality of crystal grains formed unoriented on each of the plurality of crystal grains of the first layer 21. The third layer 23 is provided on the second layer 22. The fourth layer 24 is provided on the third layer 23 and contains a precious metal.

The invention belongs to the technical field of metal coordination chemistry and optical materials, and particularly relates to a Cu (I) complex based on nitrogen-phosphine ligand mixed coordination and a preparation method and application thereof, the chemical formula of the complex is CuaXbAcBd, X = Cl, Br or I, A represents a phosphine-containing ligand, and B represents a nitrogen-containing ligand; a is the number of copper atoms participating in coordination, a is 1 or 2, b is the number of halogen atoms, b is 1 or 2, c is the number of phosphine-containing ligands participating in coordination, c is 1 or 2, d is the number of nitrogen-containing ligands participating in coordination, d is 1 or 2, and the copper (I) complex is a tetra-coordinated copper complex. The copper (I) complex is a pure-phase crystal, the size is controllable, the thermal decomposition temperature is higher than 120 degrees, and the copper (I) complex has good thermal stability; meanwhile, the copper (I) complex also has the property of efficient photoluminescence.

A container for storing a chemical fluid for manufacturing an electronic material, in which after an inspection solution charges the container and stored at 25° C. for 30 days, a sum of a concentration of particulate metal including an iron atom, a concentration of particulate metal including a copper atom, and a concentration of particulate metal including a zinc atom which are measured by a Single Particle ICP-MASS method in the inspection solution is 100 ppt or less.

This invention discloses a carbon-based copper single-atom catalyst modified with copper atom clusters and its preparation method. Cu-ACs / SAs uses 2-aminoterephthalic acid as a carbon-based precursor and is prepared by inducing Cu with ammonia water. 2+ It was prepared by self-assembly with 2-aminoterephthalic acid and combined with molten salt calcination. During the self-assembly process, ammonia water not only provided an alkaline environment to force the deprotonation of 2-aminoterephthalic acid, but also strengthened its reaction with Cu. 2+ The chemical coordination of the catalyst also promotes the formation of self-assembled compounds. Persulfate activation and pollutant degradation experiments show that Cu-ACs / SAs can efficiently activate persulfate and degrade organic pollutants under near-infrared light induction, exhibiting excellent stability and recyclability. The catalyst of this invention has a simple preparation process, significant catalytic effect, and high stability, demonstrating broad application potential.

The application discloses a kind of heat-conducting TPU films, the application increases the adsorption site of boron nitride surface by introducing amino group on the surface of boron nitride, which is conducive to subsequent adsorption of copper ions, then using hydrazine hydrate to reduce copper ions, copper nanoparticles are formed on the surface and interlayer of hexagonal boron nitride, forming a heat-conducting path, further improving the thermal conductivity of hexagonal boron nitride;Then the copper-loaded boron nitride is immersed in 2-mercaptobenzimidazole solution, the lone pair electrons of heteroatoms such as N and S in 2-mercaptobenzimidazole and the large pi bond of benzene ring can form coordination bond with copper atoms, forming an organic film on the surface of copper, improving the bonding force between copper-loaded boron nitride and TPU;At the same time, the mercapto group in 2-mercaptobenzimidazole can react with the double bond in vinyltriethoxysilane, enhancing the bonding force between the heat-conducting layer and the intermediate layer, and further improving the overall mechanical properties of the heat-conducting TPU film.

The invention relates to a method for producing a component (1), in particular a plug connector, which has at least one electrical contact portion, said electrical contact portion having at least one base material (2) and a silver layer (3) applied to the at least one base material (2), wherein at least one metal barrier layer (4) is applied at least partially to the silver layer (3), said metal barrier layer being configured to prevent the penetration of foreign substances, in particular oxygen atoms (9'), from the surroundings (5) into the silver layer (3) and / or to prevent the escape of base material (2), in particular copper atoms (9), at a surface (6) of the silver layer (3) facing the surroundings (5).

A container for storing a chemical fluid for manufacturing an electronic material, in which after an inspection solution charges the container and stored at 25° C. for 30 days, a sum of a concentration of particulate metal including an iron atom, a concentration of particulate metal including a copper atom, and a concentration of particulate metal including a zinc atom which are measured by a Single Particle ICP-MASS method in the inspection solution is 100 ppt or less.

According to the diffusion barrier layer for the copper interconnection structure and the preparation method of the diffusion barrier layer, the metal copper is integrated in the high-entropy alloy target material, the high-entropy alloy thin film is synchronously formed through the magnetron sputtering technology, the high-entropy alloy diffusion barrier layer and the copper seed layer can be formed at the same time by conducting the one-step annealing technology on the high-entropy alloy thin film, and therefore the high-entropy alloy diffusion barrier layer and the copper seed layer can be formed at the same time. Compared with the prior art, the preparation process is simple, the generation cost is reduced, the formed N-doped high-entropy alloy diffusion barrier layer is of a double-phase structure composed of an FCC phase and an amorphous phase, generation of microstructure defects is reduced, the compactness of the diffusion barrier layer is better, the diffusion difficulty of copper atoms is increased, and the performance of the diffusion barrier layer is improved. Therefore, the diffusion barrier performance of the diffusion barrier layer is improved, and in addition, the resistivity of the diffusion barrier layer can be further reduced by adding the amorphous phase.

The invention belongs to the technical field of electrocatalysis, and discloses a copper-based electrocatalyst for seawater electrolysis formaldehyde oxidation hydrogen production, a preparation method and application. The copper-based electrocatalyst for seawater electrolysis formaldehyde oxidation hydrogen production is an alloy composed of nickel and copper, the molar ratio of nickel atoms is 6%, the molar ratio of copper atoms is 94%, and the copper-based electrocatalyst is a Cu0. 94Ni0. 06 electrocatalyst. The Cu0. 94Ni0. 06 electrocatalyst disclosed by the invention has a dendritic morphology, a relatively large electrochemical active area and abundant active sites, and shows excellent performance of electro-catalyzing formaldehyde oxidation to produce hydrogen. The invention also provides a preparation method of the catalyst and application of the catalyst in seawater electrolysis formaldehyde oxidation hydrogen production.

The invention discloses a method for realizing a glass substrate by using a copper planting plunger hole. The method comprises the following steps: processing a via hole in a substrate layer through a glass drilling processing technology; the copper plunger is plugged into the via hole; leveling the surface of the base material layer and the hole edge of the via hole where the copper column is planted; forming seed layers on the upper and lower surfaces of the substrate layer; a photosensitive dry film is attached to the surface of the seed layer; forming a circuit pattern on the photosensitive dry film to form a polymerized dry film; removing the unpolymerized photosensitive dry film; depositing copper atoms on the seed layer to form a deposited copper atom layer; removing the polymerized dry film; and thinning the copper surface on which the copper atom layer is deposited by using an etching process to form a circuit pattern. According to the invention, the copper column is plugged into the via hole through the copper column planting machine, the via hole filling operation is realized, compared with the electroplating hole filling operation in the prior art, the limitation of the depth ratio of the via hole is broken through, and the hole filling operation of the deep via hole can be realized.

The invention provides a surface plating process for a high-current connector. The surface plating process comprises a copper plating layer, a low-stress nickel aminosulfonate layer, a pre-silver plating layer, a composite hard silver layer and a nano organic passivation layer which are sequentially formed on the surface of a base material, the internal stress of the low-stress nickel aminosulfonate layer is smaller than or equal to 35 MPa. The nickel aminosulfonate is adopted to replace traditional Watt nickel, the nickel aminosulfonate is matched with the stress relieving agent, the internal stress of the nickel layer can be controlled within 35 MPa, excellent flexibility and ductility are achieved, the problem of thermal cycle cracks caused by too large internal stress of the traditional nickel layer is solved, and diffusion of copper atoms of a base material to the silver layer is effectively prevented; through the synergistic effect of the copper plating layer, the low-stress nickel aminosulfonate layer, the pre-silver plating layer, the composite hard silver layer and the nano organic passivation layer, the five core problems of interlayer binding force, thermal cycle cracks, silver layer diffusion, mechanical wear and vulcanization corrosion are solved respectively, and the requirement for batch manufacturing of energy storage large-current connectors can be met.

The invention provides a preparation method of a negative plate, the negative plate and a lithium ion battery, and relates to the technical field of lithium ion batteries. The preparation method of the negative plate comprises the following steps: adding an organic ligand into an organic solution to form a first solution; adding a hydrogen peroxide solution into the first solution to form a second solution; and a copper foil is taken and placed in the second solution, the copper foil comprises copper atoms, and the copper atoms and the hydrogen peroxide solution are subjected to an oxidation-reduction reaction to generate bivalent copper ions Cu < 2 + >. Cu < 2 + > and an organic ligand are subjected to a coordination reaction to generate a Cu (at) MOF polycrystalline film. And taking a carbon material, and depositing on the outer surface of the Cu (at) MOF polycrystalline film to form a carbon layer. According to the negative plate prepared by the preparation method provided by the embodiment of the invention, the use of an adhesive can be avoided, so that more active sites in the Cu-coated MOF polycrystalline film are exposed, and the charge-discharge efficiency of the lithium ion battery is improved. And a carbon layer is deposited on the outer surface of the Cu (at) MOF polycrystalline film, so that the rate capability and the charge-discharge efficiency of the lithium ion battery are improved.

The invention discloses a preparation method of a two-dimensional copper-based inorganic-organic hybrid complex and a photoluminescence application of the two-dimensional copper-based inorganic-organic hybrid complex. The simplest formula of the hybrid complex is Cu2I (TPY), the TPY in the formula is a deprotonated 2-mercaptopyridine anion, and two copper atoms with different coordination environments exist in the complex. The Cu1 atom is a three-coordinate, a planar triangular configuration (Cu1S2N) is formed, and a one-dimensional Cu1-S chain is formed by sharing an S atom. The adjacent Cu1 atoms in the chains have a copper affinity effect, and the chains further form a Cu1-S layer. Cu2 atoms are tetracoordinated to form a tetrahedral configuration (Cu2I3S), and Cu2-I double chains are formed by sharing I atom edge connection. And the Cu1-S chain and the Cu2-I double chain are mutually connected and stacked through a Cu-S bond to form a two-dimensional Cu-I-S inorganic layer. The TPY organic ligand is bonded to the two sides of the Cu1-S layer through a Cu-N bond to form a hybridized two-dimensional layered structure. Cuprous iodide, 2-mercaptopyridine, acetonitrile and hydroiodic acid are selected as reaction raw materials, a hydrothermal method is adopted to obtain a single crystal of a complex Cu2I (TPY), and the single crystal has efficient photoluminescence performance and is used for optical anti-counterfeiting and information encryption.