Spherical copper coating tungsten composite powder, preparation method and application thereof

A composite powder and copper-coated technology, which is applied in the field of preparation of copper-tungsten composite powder and spherical copper-coated tungsten composite powder, can solve problems such as difficult large-scale production, complicated process, and cumbersome steps.

Active Publication Date: 2015-04-29
INST OF PROCESS ENG CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to solve the problems existing in the process of preparing tungsten-copper composite powder in the prior art, such as poor composition uniformity, complex process, cumber

Method used

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  • Spherical copper coating tungsten composite powder, preparation method and application thereof
  • Spherical copper coating tungsten composite powder, preparation method and application thereof
  • Spherical copper coating tungsten composite powder, preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0095] Example 1: Intermittent electroplating of copper-coated tungsten composite powder with pyrophosphate bath

[0096] (1) Common tungsten powder with an average particle size of 5-20 μm (such as figure 1 As shown) is spheroidized by radio frequency plasma spheroidization device, the main process parameters are: central gas (argon) flow rate 20-30L / min, side gas (argon gas) flow rate 90-120L / min, carrier gas (argon gas) The flow rate is 3.5L / min, the feeding rate is 5-10g / min, the reaction chamber pressure is 60-80KPa, and the operating power is 60-70KW. (2) the tungsten powder (such as figure 2 and image 3 shown) into the pyrophosphate copper plating solution, wherein the plating solution includes: copper pyrophosphate 60g / L, potassium pyrophosphate 320g / L, triammonium citrate 15g / L, potassium sodium tartrate 20g / L, ammonia water 3ml / L. Use citric acid and potassium hydroxide to adjust the pH value of the pyrophosphate copper plating solution to 8.3 to 8.5, and adju...

Embodiment 2

[0097] Example 2: Intermittent electroplating of copper-coated tungsten composite powder with pyrophosphate bath

[0098] (1) Ordinary tungsten powder with an average particle size of 1-10 μm is spheroidized by a radio frequency plasma spheroidization device. The main process parameters are: central gas (argon) flow rate 25-35L / min, edge gas (argon) The flow rate is 120-140L / min, the carrier gas (argon) flow rate is 4.5L / min, the feeding rate is 10-25g / min, the reaction chamber pressure is 90-100KPa, and the operating power is 40-60KW. (2) Join the tungsten powder processed through spheroidization in step (1) in the pyrophosphate copper plating bath, wherein the plating bath includes: copper pyrophosphate 60g / L, potassium pyrophosphate 320g / L, ammonium citrate 25g / L, ammonia water 3ml / L. Potassium hydroxide is used to adjust the pH value of the pyrophosphate copper plating solution to 8.5 to 8.8, and the temperature of the pyrophosphate copper plating solution is adjusted to...

Embodiment 3

[0099] Example 3: Intermittent electroplating of copper-coated tungsten composite powder with pyrophosphate bath

[0100] (1) Ordinary tungsten powder with an average particle size of 5-15 μm is spheroidized by a radio frequency plasma spheroidization device. The main process parameters are: central gas (argon) flow rate 20-30L / min, edge gas (argon) The flow rate is 90-120L / min, the carrier gas (argon) flow rate is 5L / min, the feeding rate is 5-10g / min, the reaction chamber pressure is 50-70KPa, and the operating power is 30-60KW. (2) Add the tungsten powder treated by spheroidization in the step (1) to the pyrophosphate copper plating bath, wherein the plating bath includes: copper pyrophosphate 60g / L, potassium pyrophosphate 320g / L, ammonium citrate 15g / L, potassium sodium tartrate 20g / L, ammonia water 2ml / L. Use citric acid and potassium hydroxide to adjust the pH value of the pyrophosphate copper plating solution to 8.0 to 8.4, and adjust the temperature of the pyrophosp...

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Abstract

The invention relates to a spherical copper coating tungsten composite powder, a preparation method and an application thereof. The copper coating tungsten composite powder is in a core-shell structure, the shell is a copper plating layer, the core is tungsten powder, and the weight ratio of the tungsten elements and copper elements of the copper coating tungsten composite powder ranges from 5 to 95 : 95 to 5; the spherical copper coating tungsten composite powder has the advantages of fine dispersion performance, high liquidity, even ingredients and high purity. The preparation method includes processing ordinary tungsten powder by a plasma spheroidizing technology, allowing the copper to deposit on the surface of the tungsten powder evenly by the intermittent copper electroplating process, and cleaning and drying the composite powder coated with copper. The spherical copper coating tungsten composite powder is prepared by combining the plasma spheroidizing and intermittent copper electroplating, the method is simple, reliable and easy to operate, the electroplating speed, the electroplated layer thickness and copper content range can be adjusted effectively, the copper-tungsten composite material comprehensive performances can be improved effectively, the expanded application prospect is provided, and the method can be applied to industrialized mass production.

Description

technical field [0001] The invention belongs to the technical field of materials and electroplating, and relates to a copper-tungsten composite powder, in particular to a spherical copper-coated tungsten composite powder, a preparation method and an application thereof. Background technique [0002] W-Cu composite material is a composite material composed of tungsten with high melting point and low thermal expansion coefficient and copper with high electrical conductivity and thermal conductivity. It has high density, high strength, high hardness and good ductility, good electrical conductivity and Thermal conductivity, low thermal expansion coefficient and other characteristics. Therefore, it can be widely used in various industries such as aerospace, national defense and military industry, electronic information, metallurgy and mechanical processing, and occupies a very important position in the national economy. [0003] With the development of modern science and technol...

Claims

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Application Information

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IPC IPC(8): B22F1/02C25D3/38C25D7/00
Inventor 李建强吴鹏周张健马炳倩
Owner INST OF PROCESS ENG CHINESE ACAD OF SCI
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