The invention provides a
rare earth modified brushing
electroplating silver plating solution. The
rare earth modified brushing
electroplating silver plating solution comprises following components including, by
mass concentration, 10 g / L to 30 g / L of silver salt, 0.1 g / L to 2 g / L of modifying agent
rare earth cerous
nitrate, 50 g / L to 200 g / L of coordination agent
sulfosalicylic acid, 50 g / L to 200 g / L of
imidazole, 0.01 g / L to 1 g / L of protection agent
hexamethylenetetramine, 0.01 g / L to 1 g / L of addition agent N,N-
dimethylformamide, 1 g / L to 30 g / L of
polyethylene glycol, 10 g / L to 50 g / L of
ammonium hydroxide, 10 g / L to 40 g / L of stabilizing agent
ammonium acetate and 5 g / L to 30 g / L of
potassium pyrophosphate. The pH value of the solution is adjusted to range from 6.8 to 7.2 through dilute
nitric acid or dilute
sodium hydroxide. The invention further provides a preparing technology and use method of the rare earth modified brushing
electroplating silver plating solution. The harmfulless silver salt, a rare earth modification agent, a coordination agent, a protection agent and the like are mixed for forming the solution, the solution is a neutral
cyanide-free silver plating solution, raw materials are easily obtained, and the preparing technology is simple. A product is applied to a
copper or
copper alloy surface to be subject to brushing electroplating, the method is simple and easy to operate, and a plating is stable.