Patents
Literature
Patsnap Copilot is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Patsnap Copilot

713 results about "Potassium Pyrophosphate" patented technology

Tetrapotassium Pyrophosphate is a potassium salt of phosphoric acid widely used as buffering agent, emulsifier, dispersing agent and thickening agent in food production.

High-concentration major element liquid water-soluble fertilizer and preparation method thereof

The invention discloses a high-concentration major element liquid water-soluble fertilizer and a preparation method thereof. The fertilizer comprises the materials in parts by weight: 7-10 parts of dipotassium hydrogen phosphate, 18-20 parts of urea, 8-11 parts of potassium dihydrogen phosphate, 5-8 parts of potassium permangenate, 24-28 parts of potassium formate, 1-3 parts of EDTA-Zn, 0.5-2 parts of instant boron, and the balance water. The method comprises the steps: under the ordinary pressure and in a reaction kettle, firstly stirring potassium permangenate, potassium formate and potassium dihydrogen phosphate for 2 h according to the formula ratio under the condition of the temperature of 80 DEG C, adjusting the temperature to 45 DEG C, stirring for 0.5 h, then dissolving dipotassium hydrogen phosphate and urea in the solution according to the set formula, after the materials are dissolved completely, adding a proper amount of instant boron and EDTA-Zn, heating to dissolve, after reaction dissolution of the materials according to the formula ratio is completed, cooling to the room temperature, packaging, and thus obtaining the major element liquid water-soluble fertilizer product. The process is simple, the raw material cost is low, and the product is suitable for requirements of current dropper devices and can be widely popularized.
Owner:中化(临沂)作物营养有限公司

Antibacterial natural latex product based on quaternary ammonium salt antibacterial agent and preparation technology of antibacterial natural latex product

The invention discloses an antibacterial natural latex product based on a quaternary ammonium salt antibacterial agent and a preparation technology of the antibacterial natural latex product, and belongs to the technical field of latex materials. The antibacterial natural latex product is prepared from the following components by weight: 90 to 100 parts of natural latex, 1 to 9 parts of sulfur, 1 to 5 parts of a vulcanization accelerator, 1.5 to 2 parts of an anti-aging agent, 1 to 6 parts of zinc oxide, 0.5 to 2 parts of sodium fluosilicate, 1 to 3 parts of potassium castorate, 0.1 to 2 parts of potassium oleate, 0.5 to 1 part of potassium permanganate and 0.1 to 3 parts of the quaternary ammonium salt antibacterial agent. The antibacterial natural latex product is based on the antibacterial characteristic of a low-concentration quaternary ammonium salt compound. The adopted quaternary ammonium salt compound has the advantage of stable performance, and the compound is tightly combined with latex polymer molecules and cannot permeate the skin of people or an animal by changing the physicochemical property of material surface. The latex product prepared in the invention has the advantages of high antibacterial property, hygiene, high practicability and the like, and has a broad market prospect.
Owner:江苏金世缘乳胶制品股份有限公司 +1

Cyanogens-free gold plating solution and method for plating gold by adopting same

The invention provides cyanogens-free gold plating solution and a method for plating gold by adopting the cyanogens-free gold plating solution, relating to a plating solution and a gold electroplating method. The invention solves the problems that cyanide is toxic and the stability of sulphite gold plating solution is poor. The cyanogens-free gold plating solution of the invention is composed of coordinating agent, auric chloride, potassium carbonate, potassium pyrophosphate and compound additive. The gold plating method of the invention includes the following steps: sodium hydroxide is used for regulating the pH value of cyanogens-free gold plating solution, then constant current mode is adopted, and plating is carried out under the conditions that the distance of cathode and anode is 5-20cm and the temperature is 30-60 DEG C. The cyanogens-free gold plating solution of the invention contains no highly toxic substance, and the stability of plating solution is good, the plating solution is not muddy or changed in colour when being used in 30 days (including plating and ingredient compensation). Meanwhile 10ml plating solution is used for continuous plating and 0.15Ah of electric quantity passes through, and a coating in good surface state still can be obtained.
Owner:WUXI HAITE NEW MATERIAL RES INST

Potassium polyphosphate strawberry slow release fertilizer and production method thereof

The invention relates to potassium polyphosphate strawberry slow release fertilizer and a production method thereof. The potassium polyphosphate strawberry slow release fertilizer is prepared from the following raw materials in parts by weight: 50 to 60 parts of urea, 70 to 80 parts of potassium polyphosphate, 0.5 to 0.8 part of magnesium nitrate, 0.5 to 0.7 part of calcium nitrate, 1.8 to 2.2 parts of microelement, 8 to 10 parts of bone meal, 6 to 10 parts of ammonium humate, 10 to 15 parts of matured chicken manure, 2 to 4 parts of alcohol waste liquid, 10 to 15 parts of medicine powder and 15 to 20 parts of slow release agent. The potassium polyphosphate strawberry slow release fertilizer produced by the invention can be prepared according to fertilizer requiring characteristics of strawberry growth; the produced potassium polyphosphate strawberry slow release fertilizer has rich and balance nutrition, contains rich nutrients and medium-trace element and can quickly supplement nutrients required by strawberry in a long-acting mode; furthermore, nutritional ingredients in the fertilizer can be slowly released, so that fertilizer efficiency is long, utilization rate of the fertilizer is beneficial to being improved, and effects of increasing yield and revenue and improving strawberry quality are achieved.
Owner:广西东林食品化工有限公司

Pyrophosphate copper plating used as grounding electroplate liquid for cyanogen-free copper plating

The invention discloses a strike bath solution with pyrophosphate plating copper as the cyanide-free copper, which contains a make-up agent and rehydration salt; the make-up agent contains the following raw materials: potassium pyrophosphate, copper pyrophosphate, ammonium citrate, sorbol, sulfosalt, phenyl carboxylate, dextrin, alkyl thiourea and nitrogen heterocyclic; the rehydration salt is as supplementation of all raw materials in the make-up agent during the plating process; the invention does not contain harmful substances, such as cyanidum, heavey metal, etc and is in compliance with EU RoHS Directive (2002 / 95 / EC) with stable bath solution and wide cathode current density range, and the plating layer prepared by the invention is fine, even and in a semi-bright state; and the make-up is conducted with original solution, supplementation is conducted with single rehydration salt, which is convenient in operation and simple in management; the plating layer is well adhesive to the matrix, with good straggling capability and covering capability. The invention is applicable in pre-plating of iron materials, zinc alloys, aluminum alloys and copper alloys, as well as barrel plating and suspension plating, with the waste water easy to dispose, which will not bring the secondary pollution.
Owner:江门市瑞期精细化学工程有限公司

Co-deposition electroplating method with cyanogen-free Au-Sn alloy electrolyte

The invention relates to a co-deposition electroplating method for preparing Au-Sn alloy on an electroplating substrate and a cyanogen-free Au-Sn alloy electrolyte. The wave forms of electroplating current pulses are forward variable-amplitude pulses, namely that two different forward square wave pulses exist in one period, and the peak values and the conducting time of the electroplating current pulses respectively correspond to peak value current density and time which are required for generating Au5Sn and an Au-Sn alloy phase in a plating layer. In the electrolyte, sodium sulfite is adopted as a main complexing agent and ethylene diamine tetraacetic acid is adopted as an auxiliary complexing agent for the gold ion complexing agent, potassium pyrophosphate is used as a tin ion complexing agent, hydroquinone is used as an antioxidant, and the pH value of the electrolyte is from 8 to 9. When the method is used for preparing Au-30at.%Sn eutectic plated layer through electroplating, the plating speed reaches 13 mum/hour, the electrolyte is stable, the operation is simple, and the gold and tin content in the plated layer is easy to control. The method can be applied in microelectronics and photoelectron industry for connecting and encapsulating LED chips, connecting flip chips, forming welding pads or patterns on the surface of semiconductor devices or similar devices, etc.
Owner:DALIAN UNIV OF TECH

Rare earth modified brushing electroplating silver plating solution and preparing technology and use method of solution

ActiveCN106283134AUniform and dense appearanceBright appearanceN dimethylformamideHexamethylenetetramine
The invention provides a rare earth modified brushing electroplating silver plating solution. The rare earth modified brushing electroplating silver plating solution comprises following components including, by mass concentration, 10 g/L to 30 g/L of silver salt, 0.1 g/L to 2 g/L of modifying agent rare earth cerous nitrate, 50 g/L to 200 g/L of coordination agent sulfosalicylic acid, 50 g/L to 200 g/L of imidazole, 0.01 g/L to 1 g/L of protection agent hexamethylenetetramine, 0.01 g/L to 1 g/L of addition agent N,N-dimethylformamide, 1 g/L to 30 g/L of polyethylene glycol, 10 g/L to 50 g/L of ammonium hydroxide, 10 g/L to 40 g/L of stabilizing agent ammonium acetate and 5 g/L to 30 g/L of potassium pyrophosphate. The pH value of the solution is adjusted to range from 6.8 to 7.2 through dilute nitric acid or dilute sodium hydroxide. The invention further provides a preparing technology and use method of the rare earth modified brushing electroplating silver plating solution. The harmfulless silver salt, a rare earth modification agent, a coordination agent, a protection agent and the like are mixed for forming the solution, the solution is a neutral cyanide-free silver plating solution, raw materials are easily obtained, and the preparing technology is simple. A product is applied to a copper or copper alloy surface to be subject to brushing electroplating, the method is simple and easy to operate, and a plating is stable.
Owner:STATE GRID CORP OF CHINA +1

Cyanide-free silver plating solution additive

The invention relates to a cyanide-free silver plating solution additive which comprises the following components by ratio: 0.1-10g/ l of brightener, 5-10g/ l of leveling agent, 100-600g/ l of complexing agent and the balance of plasma water, wherein the brightener is one or mixture of more in nitrogen-containing compound, triazole, benzotriazole, 2-hydroxypyridine, pyridine, 22 dipyridyl, 1, 10-phenanthroline, triethylene tetramine and diethylene triamine according to any ratio; the leveling agent is one or mixture of more in aromatic hydrocarbon compounds, naphthalene, 1-methylnaphthalene, 1, 4-naphthoquinone and 1-naphthol according to any ratio; the complexing agent is one or mixture of more in disodium ethylenediamine tetraacetate, niacin, aminosulfonic acid and potassium pyrophosphate according to any ratio. The cyanide-free silver plating solution additive has the beneficial effects that the plating solution is stable, low in toxicity and good in dispersing ability; the obtained plating layer is bright and fine as well as good in binding force; the technology adopts the environment-friendly organic additive which does not contain heavy metal and sulfide; the plating layer is good in corrosion resistance. Furthermore, the cyanide-free silver plating solution additive can be directly used for parts such as brass, copper, chemical nickel and the like, preplating is not needed, and the binding force is also guaranteed.
Owner:HANGZHOU WIN WIN TECH CO LTD

Anti-hard water composite water-soluble fertilizer and preparation method thereof

The invention discloses an anti-hard water composite water-soluble fertilizer and a preparation method of the anti-hard water composite water-soluble fertilizer. The existing composite water-soluble fertilizer is low in hard water resistance and cannot be used in saline-alkali areas. The anti-hard water composite water-soluble fertilizer contains the following components: 30-50% of nitrogen, phosphorus and potassium, 0.5-2% of microelements including iron, manganese, copper, zinc, molybdenum and boron, 3-8% of humic acid, and water for the rest. The preparation method of the anti-hard water composite water-soluble fertilizer comprises the following steps: taking weathered coal, sulfuric acid, phosphoric acid, nitric acid, ammonium nitrate, potassium hydroxide and potassium nitrate as main materials; taking potassium pyrophosphate, polyvinylpyrrolidone, polyacrylamide, ammonium polyphosphate, sodium dodecyl sulfate, methylsilane, xanthan gum, carrageenan and konjac gum mixture as an auxiliary anti-hard water slow release agent; taking ferrous sulfate, zinc sulfate, potassium borate, copper sulfate, manganese sulfate and ammonium molybdate as microelement additives; degrading, modifying, chelating, stabilizing and the like to obtain the anti-hard water composite water-soluble fertilizer. The anti-hard water composite water-soluble fertilizer is high in utilization rate, stable in product shape, convenient to use, resistant to hard water and the like, and is suitable for saline-alkali areas with harder water.
Owner:HANGZHOU QIUSHI INTPROP CONSULTATION & SERVICE

Magnesium-lithium alloy surface electrocoppering solution and magnesium-lithium alloy surface electrocoppering treatment method

The invention provides magnesium-lithium alloy surface electrocoppering solution and a magnesium-lithium alloy surface electrocoppering treatment method. The method comprises the following steps that (1) the magnesium-lithium alloy surface is subjected to pretreatment; (2) the activation is carried out under the room temperature and ultrasonic conditions; (3) the zinc galvanizing is carried out at the temperature being 40 to 60 DEG C; and (4) the electrocoppering is carried out in copper plating solution; the electrocoppering solution consists of 50 to 70g/L of cupric pyrophosphate, 300g/L of potassium pyrophosphate, 40g/L of dipotassium phosphate, 40g/L of potassium sodium tartrate, 0.1 g/L of citric acid, 0.1g/L of phytic acid, 0.02 g/L of vanillin and the balance water; and the electrocoppering comprises the following conditions that the pH is 8 to 9, the temperature is 30 to 50 DEG C, the voltage is 2 to 4V, the current is 0.02 to 0.04 A, and the time is 20 to 40 minutes. The plating layer has the performance which is not reached by the existing magnesium-lithium alloy surface treatment method, meanwhile, the plating layer forming is fast, the plating layer forming speed is accelerated, the surface treatment efficiency is improved, the operation is simple and convenient, the production efficiency is high, and the large-scale popularization and the application are favorably realized.
Owner:HARBIN ENG UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products