Cyanogens-free gold plating solution and method for plating gold by adopting same
A technology of electroplating gold and plating solution, which is applied in the field of plating solution and electroplating, can solve the problems of poor stability of plating solution, poisonous cyanide plating solution, etc., and achieve the effect of good stability of plating solution
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specific Embodiment approach 1
[0012] Specific embodiment one: in the present embodiment, the plating solution of cyanide-free electroplating gold is made up of complexing agent, gold trichloride, potassium carbonate, potassium pyrophosphate and compound additive; In the plating solution of cyanide-free electroplating gold, the The concentration is 40g / L~150g / L, the concentration of gold ion is 4g / L~15g / L, the concentration of potassium carbonate is 60g / L~120g / L, the concentration of potassium pyrophosphate is 30g / L~70g / L, The concentration of the compound additive is 1ml / L-10ml / L; the compound additive is a mixture of rare earth salt, organic matter and surfactant.
[0013] In this embodiment, the ratios between the various components constituting the compound additive are arbitrary.
specific Embodiment approach 2
[0014] Specific embodiment two: the difference between this embodiment and specific embodiment one is that the complexing agent is 5,5-dimethylhydantoin, 3-hydroxymethyl-5,5-dimethylhydantoin Urea or 1,3-dichloro-5,5-dimethylhydantoin. Others are the same as in the first embodiment.
specific Embodiment approach 3
[0015] Embodiment 3: This embodiment is different from Embodiment 1 or Embodiment 2 in that the rare earth salt is cerium nitrate or lanthanum nitrate. Others are the same as those in the first or second embodiment.
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