The invention discloses a UV photocuring
adhesive, a preparation method thereof and an application of the UV photocuring
adhesive in the electronic field, and relates to the field of adhesives. The preparation method comprises the following steps: when the UV photocuring
adhesive is prepared, carrying out a reaction on dihydroxyl modified 9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-
oxide, p-
phenylene diisocyanate,
polyethylene glycol and 2-ethyl-4-methylimidazole, so as to obtain
imidazole-terminated
isocyanate, and carrying out a reaction on the
imidazole-terminated
isocyanate and the 9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-
oxide, so as to obtain the UV photocuring adhesive. The modified
lignin, butanediamine and N, N '-
methylene bisacrylamide are subjected to a reaction, and a double-bond reactant is prepared; the preparation method comprises the following steps: reacting
epoxy-terminated
siloxane with
octamethylcyclotetrasiloxane, tetramethyltetravinyl cyclotetrasiloxane and
tetramethylammonium hydroxide to obtain modified
siloxane, and finally, uniformly mixing
imidazole-terminated
isocyanate, a double-bond reactant, modified polysiloxane and
benzoin butyl
ether to obtain the
polyurethane adhesive. The UV light-cured adhesive prepared by the invention has good adhesive property, anti-
aging property and
flame retardant property.