4results about How to "Prevent implosion" patented technology

The invention discloses a low-loss resin composition, which is prepared from the following main components in parts by weight: 10 to 90 parts of acenaphthylene-p-vinylbiphenyl copolymer, 10 to 70 parts of cross-linking agent, 20 to 60 parts of elastomer, 0.1 to 3 parts of initiator and 10 to 90 parts of filler. The acenaphthylene-p-vinylbiphenyl copolymer is obtained by pre-polymerizing acenaphthylene and divinylbiphenyl, the acenaphthylene monomer residue is less, the acenaphthylene monomer is difficult to volatilize in a resin system, implosion caused by too fast curing reaction of the resin system is prevented while good reaction activity is maintained, and a subsequent curing product is high in crosslinking density and good in heat resistance; a machining window is wide, and subsequent production and machining are facilitated; and an acenaphthylene structure has high symmetry and rigidity and does not contain elements such as oxygen, sulfur and nitrogen, so that the resin composition has excellent dielectric properties and thermal properties and a low thermal expansion coefficient, and an elastomer as a cross-linking curing matrix material can provide the characteristics of low dielectric constant, low dielectric loss, low water absorption and the like.

The present application relates to the technical field of semiconductor packaging materials, in particular to a liquid plastic packaging material for MiniLED with high light transmission and low stress and a preparation method thereof.The liquid plastic packaging material comprises the following components: vinyl MQ silicone resin, phenyl hydrogen-containing silicone resin, hydrogen-containing silicone oil, silicone epoxy resin, platinum gold catalyst, ethynyl cyclohexanol, epoxy group-containing silane coupling agent, silicone defoaming agent, fumed silica and phenyl vinyl silicone resin;the fumed silica is dried, then ground with part of the base resin to form a master batch, and then mixed with the remaining components to remove bubbles to obtain a liquid component;the catalyst and the inhibitor are respectively diluted into a premix, and then mixed in sequence and deaerated again before use.The present application realizes the extreme uniform dispersion of fumed silica and the precise release of stress by constructing a multiple crosslinking network and a double crosslinking system, combining the interface compatibilization effect and the gradient curing process, and solves the technical problem that high light transmission and low stress are difficult to be considered simultaneously.

The utility model provides a cooling cover body and heat treatment equipment, and relates to the technical field of semiconductor heat treatment equipment. The cooling cover comprises a cover plate, a bump is arranged at one end of the cover plate, a first air hole is formed in the side wall of the cover plate, and a second air hole is formed in the end, away from the bump, of the cover plate; the first air hole communicates with the second air hole. The cooling cover body can be used for rapidly cooling the reaction cavity, the problem of implosion of high-temperature gas is avoided, and the cooling cover body is simple and compact in structure, small in size, small in occupied space and high in cooling efficiency.

The invention provides low-entanglement copolymerized modified ultra-high molecular weight polyethylene, the viscosity average molecular weight of the low-entanglement copolymerized modified ultra-high molecular weight polyethylene is 1,000,000-1,200,000, the molecular weight distribution is 2-3, the tensile strength is 55-60 MPa, and the ratio of the initial elastic modulus to the equilibrium elastic modulus is 0.1-0.2. The preparation method comprises the following steps: diluting a metallocene catalyst and a cocatalyst with a solvent to obtain a catalyst diluent; the solvent is inert alkane of which the boiling point is not lower than 145 DEG C; adding a solvent as a kettle bottom solution into a stirring reaction kettle, adding the catalyst diluent, ethylene, 1-octylene and hydrogen into the kettle according to a stoichiometric ratio, and carrying out polymerization reaction at the temperature of 60-90 DEG C and the pressure in the kettle of 0.2-0.8 MPa; and after polymerization is completed, slurry discharged from the slurry is subjected to post-treatment. The high-performance low-entanglement copolymerized modified ultra-high molecular weight polyethylene is obtained by copolymerizing ethylene and 1-octylene and adopting long-chain alkane as a solvent, so that the machining performance of the product is greatly improved, and the problems of difficult polymerization, poor product performance, low octylene polymerization degree and the like existing in ethylene and octylene copolymerization are solved.