1results about How to "Prevent implosion" patented technology

The present application relates to the technical field of semiconductor packaging materials, in particular to a liquid plastic packaging material for MiniLED with high light transmission and low stress and a preparation method thereof.The liquid plastic packaging material comprises the following components: vinyl MQ silicone resin, phenyl hydrogen-containing silicone resin, hydrogen-containing silicone oil, silicone epoxy resin, platinum gold catalyst, ethynyl cyclohexanol, epoxy group-containing silane coupling agent, silicone defoaming agent, fumed silica and phenyl vinyl silicone resin;the fumed silica is dried, then ground with part of the base resin to form a master batch, and then mixed with the remaining components to remove bubbles to obtain a liquid component;the catalyst and the inhibitor are respectively diluted into a premix, and then mixed in sequence and deaerated again before use.The present application realizes the extreme uniform dispersion of fumed silica and the precise release of stress by constructing a multiple crosslinking network and a double crosslinking system, combining the interface compatibilization effect and the gradient curing process, and solves the technical problem that high light transmission and low stress are difficult to be considered simultaneously.