2results about How to "Strong blocking ability" patented technology

The application discloses an Hf-Ta-Si / (Hf,Zr)B2 layered composite ultrahigh-temperature protective coating which is composed of a TaSi2 bottom layer, a ceramic layer surface layer with (Hf,Zr)B2 ultrahigh-temperature ceramic as a main phase and a Ta5Si3 interface reaction layer located at the interface between the substrate and the TaSi2 bottom layer, and the interface between each layer is an in-situ reaction autogenous interface; the coating is obtained by prepositioning the slurry of raw material powder on the surface of a tantalum alloy, drying, and then vacuum reaction sintering in one step; the coating has excellent ultrahigh-temperature oxidation resistance, heat scouring resistance and thermal shock resistance, and can effectively protect the tantalum alloy material under the conditions of oxygen, heat scouring and strong thermal shock at 1000 DEG C to 1800 DEG C; the method can reduce the adverse effects of the melting and sintering process on the microstructure and mechanical properties of the tantalum alloy, avoid the problem of preparing the ultrahigh-temperature ceramic coating on the surface of a tantalum alloy with a complex shape, and has higher coating deposition efficiency and lower cost.

This invention discloses a high-strength, high-conductivity copper-silver alloy for communication connectors and its preparation method, belonging to the technical field of copper alloy materials. The process includes: S1 melting and casting, the alloy containing Ag and one or more of the amplitude modulation decomposition inducing elements Ni, Co, Al, Ti, and Fe; S2 homogenization treatment; S3 cooling at 10-50℃ / h to 350-550℃ and holding for 2-24h to induce amplitude modulation decomposition and form a nanoscale periodic amplitude modulation structure; S4 cold deformation processing; S5 multi-stage gradient aging: holding at 200-350℃ for 1-5h, heating at 5-20℃ / h to 400-500℃ and holding for 2-8h, cooling at ≤10℃ / h to 300-350℃ and holding for 4-12h to form a periodically arrayed coherent nano-precipitated phase; S6 preparing an inner self-lubricating plating layer and an outer protective coating. This invention guides the orderly growth of precipitates using an amplitude-modulated template, resulting in an alloy with tensile strength ≥470MPa, conductivity ≥89%IACS, elongation ≥6%, and excellent high-temperature stability, making it suitable for connectors used in extreme environments such as 5G communication and deep space exploration.