The present invention provides a
chip sealing ring structure and a preparation method thereof, a
semiconductor chip and a preparation method thereof, wherein the preparation method of the
chip sealing ring structure comprises: providing a chip, wherein a bottom protective layer is formed on the
active surface of the chip; forming a sealing ring
metal layer pattern on the bottom protective layer, wherein the sealing ring
metal layer pattern is located around the
active surface of the chip; forming an insulating
dielectric layer on the bottom protective layer, wherein the insulating
dielectric layer has an isolation opening for exposing the sealing ring
metal layer pattern, wherein the isolation opening also exposes the bottom protective layer; forming a
moisture-proof layer on the insulating
dielectric layer and in the isolation opening, wherein the
moisture-proof layer covers a first exposed portion of the sealing ring metal layer pattern and a second exposed portion of the bottom protective layer in the isolation opening. The present invention forms a
moisture-proof layer on the surface of the sealing ring metal layer pattern, which can effectively prevent the metal layer from being directly exposed to the air during the manufacturing process and being oxidized or corroded by
oxygen,
water vapor or other gas and liquid, thereby greatly enhancing the gas-liquid barrier capability.