Cyanide-free silver plating solution additive

A cyanide-free silver-plating and additive technology is applied in the field of cyanide-free silver-plating solution additives, which can solve problems such as serious damage to the health of operators and unfavorable environmental protection by sewage, and achieve the effects of bright and meticulous coating, excellent bonding force and stable plating solution.
CN103469261AActive Publication Date: 2013-12-25HANGZHOU WIN WIN TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
HANGZHOU WIN WIN TECH CO LTD
Publication Date
2013-12-25
Patent Text Reader

Abstract

The invention relates to a cyanide-free silver plating solution additive which comprises the following components by ratio: 0.1-10g / l of brightener, 5-10g / l of leveling agent, 100-600g / l of complexing agent and the balance of plasma water, wherein the brightener is one or mixture of more in nitrogen-containing compound, triazole, benzotriazole, 2-hydroxypyridine, pyridine, 22 dipyridyl, 1, 10-phenanthroline, triethylene tetramine and diethylene triamine according to any ratio; the leveling agent is one or mixture of more in aromatic hydrocarbon compounds, naphthalene, 1-methylnaphthalene, 1, 4-naphthoquinone and 1-naphthol according to any ratio; the complexing agent is one or mixture of more in disodium ethylenediamine tetraacetate, niacin, aminosulfonic acid and potassium pyrophosphate according to any ratio. The cyanide-free silver plating solution additive has the beneficial effects that the plating solution is stable, low in toxicity and good in dispersing ability; the obtained plating layer is bright and fine as well as good in binding force; the technology adopts the environment-friendly organic additive which does not contain heavy metal and sulfide; the plating layer is good in corrosion resistance. Furthermore, the cyanide-free silver plating solution additive can be directly used for parts such as brass, copper, chemical nickel and the like, preplating is not needed, and the binding force is also guaranteed.
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Description

technical field

[0001] The invention belongs to the technical field of electroplating silver, in particular to a cyanide-free silver plating solution additive. Background technique

[0002] Silver has a unique silver-white luster, is relatively stable to organic acids and alkalis, and is cheaper than other precious metals. It is widely used in the fields of tableware, jewelry, and artwork as a decorative coating; Electrically conductive and brazable, it is widely used as an electrical contact material in the electrical and electronic industries.

[0003] So far, most of the electroplating silver processes at home and abroad still use cyanide silver plating. The reason is that the cyanide silver plating process has good stability of the plating solution, good plating ability and depth capability, and fine crystallization of the coating. However, cyanide is a highly toxic substance, which is harmful to the health of on-site operators. Good ventilation equipment is required du...

Claims

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