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A cyanide-free silver-plating and additive technology is applied in the field of cyanide-free silver-plating solution additives, which can solve problems such as serious damage to the health of operators and unfavorable environmental protection by sewage, and achieve the effects of bright and meticulous coating, excellent bonding force and stable plating solution.
Active Publication Date: 2013-12-25
HANGZHOU WIN WIN TECH CO LTD
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Abstract
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Problems solved by technology
However, cyanide is a highly toxic substance, which is harmful to the health of on-site operators. Good ventilatio
Method used
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Effect test
Embodiment 1
[0017] Embodiment 1: a kind of cyanide-free silver plating solution additive, its component information is as follows:
[0018] 22 bipyridine 5g / l;
[0019] Diethylenetriamine 0.2g / l;
[0020] 1-naphthol 5g / l;
[0021] Disodium edetate 400g / l;
[0022] The above components are formulated into cyanide-free silver plating additives with deionized water.
[0023] The working solution process parameters are as follows:
[0024] Silver nitrate 40g / l
[0025] 55 Dimethylhydantoin 120g / l
[0026] Anhydrous potassium carbonate 80g / l
[0027] Potassium nitrate 25g / l
[0028] Additive 100ml / l
[0029] Adjust the pH of the solution to 10.5 with nitric acid or potassium hydroxide, and the temperature is 25°C. Immerse the copper parts in the electroplating solution, and electroplate the copper parts with a current density of 0.6A / dm2. The electroplating time is 10 minutes. The silver layer obtained is bright and fine, and has good bonding force with the substrate. Baking at 200°C ...
Embodiment 2
[0031] Embodiment 2: a kind of cyanide-free silver plating solution additive, its component information is as follows:
[0032] 1,10-Phenanthroline 8g / l
[0033] 1-Methylnaphthalene 5g / l
[0034] Niacin 200g / l
[0035] Potassium pyrophosphate 200g / l
[0036] The above components are formulated into cyanide-free silver plating additives with deionized water.
[0037] The working solution process parameters are as follows:
[0038] Silver nitrate 40g / l
[0039] 55 Dimethylhydantoin 120g / l
[0040] Anhydrous potassium carbonate 80g / l
[0041] Potassium nitrate 25g / l
[0042] Additive 100ml / l
[0043] Adjust the pH of the solution to 9.0 with nitric acid or potassium hydroxide, and the temperature is 25°C. Immerse the copper parts in the electroplating solution, and electroplate the copper parts with a current density of 1.0A / dm2. The electroplating time is 10 minutes. The silver layer obtained is bright and fine, and has good bonding force with the substrate. Baking at 2...
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Abstract
The invention relates to a cyanide-free silver plating solution additive which comprises the following components by ratio: 0.1-10g/ l of brightener, 5-10g/ l of leveling agent, 100-600g/ l of complexing agent and the balance of plasma water, wherein the brightener is one or mixture of more in nitrogen-containing compound, triazole, benzotriazole, 2-hydroxypyridine, pyridine, 22 dipyridyl, 1, 10-phenanthroline, triethylene tetramine and diethylene triamine according to any ratio; the leveling agent is one or mixture of more in aromatic hydrocarbon compounds, naphthalene, 1-methylnaphthalene, 1, 4-naphthoquinone and 1-naphthol according to any ratio; the complexing agent is one or mixture of more in disodium ethylenediamine tetraacetate, niacin, aminosulfonic acid and potassium pyrophosphate according to any ratio. The cyanide-free silver plating solution additive has the beneficial effects that the plating solution is stable, low in toxicity and good in dispersing ability; the obtained plating layer is bright and fine as well as good in binding force; the technology adopts the environment-friendly organic additive which does not contain heavy metal and sulfide; the plating layer is good in corrosion resistance. Furthermore, the cyanide-free silver plating solution additive can be directly used for parts such as brass, copper, chemical nickel and the like, preplating is not needed, and the binding force is also guaranteed.
Description
technical field [0001] The invention belongs to the technical field of electroplating silver, in particular to a cyanide-free silver plating solution additive. Background technique [0002] Silver has a unique silver-white luster, is relatively stable to organic acids and alkalis, and is cheaper than other precious metals. It is widely used in the fields of tableware, jewelry, and artwork as a decorative coating; Electrically conductive and brazable, it is widely used as an electrical contact material in the electrical and electronic industries. [0003] So far, most of the electroplating silver processes at home and abroad still use cyanide silver plating. The reason is that the cyanide silver plating process has good stability of the plating solution, good plating ability and depth capability, and fine crystallization of the coating. However, cyanide is a highly toxic substance, which is harmful to the health of on-site operators. Good ventilation equipment is required du...
Claims
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Application Information
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