Prepn process of Sn-Cu alloy material for negative pole of lithium ion cell

A lithium-ion battery, tin-copper alloy technology, applied in electrode manufacturing, battery electrodes, circuits, etc., can solve problems such as difficulty in large-scale production, and achieve the effects of low cost and improved charge-discharge cycle performance

Inactive Publication Date: 2007-06-06
XIAMEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a non-polluting, low cost, large initial capacity, high initial charge and discharge efficiency and cycle performance in view of the existing methods for preparing tin-copper alloy negative electrode materials whose steps are relatively complicated and difficult for large-scale production. Good non-cyanide electroplating method for preparing tin-copper alloy anode materials mainly used in lithium-ion batteries

Method used

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  • Prepn process of Sn-Cu alloy material for negative pole of lithium ion cell
  • Prepn process of Sn-Cu alloy material for negative pole of lithium ion cell
  • Prepn process of Sn-Cu alloy material for negative pole of lithium ion cell

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Embodiment 1

[0022] Potassium pyrophosphate is dissolved in deionized water, under the situation of stirring, add stannous chloride and cupric sulfate respectively, obtain mixed solution, the concentration of potassium pyrophosphate is 100g / L, and the concentration of stannous chloride is 10g / L, The concentration of copper sulfate is 5g / L. Add additives in the mixed solution, the additives are epichlorohydrin, triethanolamine, formaldehyde and gelatin, calculated according to the total volume of the mixed solution, the content of the additive in the mixed solution is 0.7g / L of epichlorohydrin, 0.8g of triethanolamine / L, formaldehyde 0.5g / L, gelatin 0.03g / L to obtain electroplating solution. at 0.7A / dm 2 Under the conditions of current density and stirring, the copper sheet is used as the base and electroplated in the electroplating solution for 5 minutes to form a silver-white bright plating layer, that is, a tin-copper alloy is obtained.

Embodiment 2

[0024] Potassium pyrophosphate is dissolved in deionized water, under the situation of stirring, add tin protochloride and cupric sulfate respectively, obtain mixed solution, the concentration of potassium pyrophosphate is 200g / L, and the concentration of stannous chloride is 15g / L, The concentration of copper sulfate is 6g / L. Add additives in the mixed solution, the additives are epichlorohydrin, triethanolamine, formaldehyde and gelatin, calculated according to the total volume of the mixed solution, the content of the additive in the mixed solution is epichlorohydrin 1g / L, triethanolamine 0.7g / L L, formaldehyde 0.7g / L, gelatin 0.05g / L to obtain electroplating solution. at 0.8A / dm 2 Under the conditions of current density and stirring, the copper sheet is used as the substrate and electroplated in the electroplating solution for 7 minutes to form a silver-white bright plating layer, that is, a tin-copper alloy is obtained.

Embodiment 3

[0026] Potassium pyrophosphate is dissolved in distilled water, under the situation of stirring, add stannous chloride and cupric sulfate respectively, obtain mixed solution, the concentration of potassium pyrophosphate is 300g / L, the concentration of stannous chloride is 25g / L, sulfuric acid The concentration of copper is 3g / L. Add additives in the mixed solution, the additives are epichlorohydrin, triethanolamine, formaldehyde and gelatin, calculated according to the total volume of the mixed solution, the content of the additive in the mixed solution is 0.8g / L of epichlorohydrin, 0.5g of triethanolamine / L, formaldehyde 1g / L, gelatin 0.1g / L, to obtain electroplating solution. at 0.5A / dm 2 Under the conditions of current density and stirring, the copper sheet is used as the substrate and electroplated in the electroplating solution for 1 min to form a silver-white bright coating, that is, a tin-copper alloy is obtained.

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Abstract

The present invention relates to negative pole material for lithium ion cell, and is especially one no-cyanide electroplating process for preparing Sn-Cu alloy as negative pole material for lithium ion cell. The no-cyanide electroplating process includes the following steps: dissolving potassium pyrophosphate in water, adding stannous chloride and copper sulfate to obtain mixed solution, adding epoxy chloroalkane, triethanolamine, formaldehyde and gelatin to form electroplating solution; and electroplating on copper substrate to form silvery white bright Sn-Cu alloy. The process has low cost, no environmental pollution, and the lithium ion cell with negative pole of the Sn-Cu alloy has high initial capacity, high initial charging and discharging efficiency and good charging and discharging circulating performance.

Description

technical field [0001] The invention relates to a lithium ion battery negative electrode material, in particular to a method for preparing a lithium ion battery tin-copper alloy negative electrode material by non-cyanide electroplating. technical background [0002] As an anode material for lithium-ion batteries, tin has high theoretical mass specific capacity (990mAh / g) and volume specific capacity (7200Ah / L), and has good safety performance, so it has received more and more research and attention. The main problem of tin as the anode material of lithium-ion batteries is that the volume change rate is very large during the lithium ion intercalation and extraction process, resulting in poor charge-discharge cycle performance. Tin alloys, as anode materials for lithium-ion batteries, can alleviate the volume expansion during the alloying process of tin and lithium to a certain extent, and achieve the purpose of improving the cycle performance of materials. [0003] At presen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/02C25D3/30C25D3/38H01M4/04H01M4/38
CPCY02E60/12Y02E60/10
Inventor 孙世刚樊小勇黄令
Owner XIAMEN UNIV
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