Rare earth modified brushing electroplating silver plating solution and preparing technology and use method of solution

Abstract

The invention provides a rare earth modified brushing electroplating silver plating solution. The rare earth modified brushing electroplating silver plating solution comprises following components including, by mass concentration, 10 g / L to 30 g / L of silver salt, 0.1 g / L to 2 g / L of modifying agent rare earth cerous nitrate, 50 g / L to 200 g / L of coordination agent sulfosalicylic acid, 50 g / L to 200 g / L of imidazole, 0.01 g / L to 1 g / L of protection agent hexamethylenetetramine, 0.01 g / L to 1 g / L of addition agent N,N-dimethylformamide, 1 g / L to 30 g / L of polyethylene glycol, 10 g / L to 50 g / L of ammonium hydroxide, 10 g / L to 40 g / L of stabilizing agent ammonium acetate and 5 g / L to 30 g / L of potassium pyrophosphate. The pH value of the solution is adjusted to range from 6.8 to 7.2 through dilute nitric acid or dilute sodium hydroxide. The invention further provides a preparing technology and use method of the rare earth modified brushing electroplating silver plating solution. The harmfulless silver salt, a rare earth modification agent, a coordination agent, a protection agent and the like are mixed for forming the solution, the solution is a neutral cyanide-free silver plating solution, raw materials are easily obtained, and the preparing technology is simple. A product is applied to a copper or copper alloy surface to be subject to brushing electroplating, the method is simple and easy to operate, and a plating is stable.

Description

technical field [0001] The invention relates to the technical field of electrochemistry, in particular to a rare earth-improved brush-plating silver-plating solution and a preparation process and application method thereof. Background technique [0002] The DL / T486-2010 standard stipulates that the contact surface of the isolating switch and the grounding switch must be silver-plated, and the thickness of the coating should not be less than 20 microns, so as to obtain a low contact resistance and ensure good electrical conductivity. Corrosion, wear resistance and anti-tarnish properties. The brush plating process uses a coating pen (anode) wrapped in a sheath and dipped in a special plating solution to attach to the plated part of the workpiece (cathode) and make a relative movement to form a coating. Its biggest feature is that the deposition rate is about 10 times higher than that of ordinary electroplating. . Some manufacturers often repair the unqualified silver-plated...

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Problems solved by technology

However, compared with cyanide silver plating, there are still many disadvantages: (1) plating solution stability problem: the silver ions in the plating solution will become simple substances under sunlight, which will affect the concentration of silver ions in the plating solution. The biting agent will also affect the properties of the plating solution, such as succinimide, which is easy to hydrolyze, etc.; The standard potential of copper is much more negative than that of silver. When copper and its alloy plating parts are placed in the plating solution, a substitution reaction may occur before power is applied, and a replacement silver layer is formed on the surface of the plating part. The bonding force between it and the substrate of the plating part Poor, and at the same time, some copper impurities contaminate the plating solution. Usually, pre-plating silver, immersion silver or amalgamation are used to solve this problem

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