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Bright tin plating solution and preparation method thereof and method for electrobrush tin plating on copper-based material surface

A technology of tin plating solution and electric brush plating, which is applied in the field of electrochemistry, can solve the problems of easy turbidity of the plating solution, gray spots, pinholes, pitting, and crystal polarization reduction in the appearance of the coating layer, and achieves uniform and dense appearance. Avoid the effect of coating discoloration and tin plating process specification

Inactive Publication Date: 2019-04-12
HUBEI ENG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the existing brush-plating tin-plating technology, on the one hand, there are many brush-plating processes, including impurity removal, electro-cleaning, activation, pre-plating, aging and other steps. Due to many processes, various equipment and chemicals need to be prepared, which is not conducive to On-site development of electrical equipment repair work
On the other hand, the brush tin plating solution is mainly a sulfate-sulfuric acid solution process, supplemented by one or more aryl sodium salts, benzyl acetone, benzaldehyde and other additives. The adaptable temperature of these plating solution systems is relatively low. Low, when the operating temperature exceeds 30°C, the plating solution tends to become turbid and precipitate, and the appearance of the obtained coating appears foggy, gray spots, pinholes, and pitting
At the same time, a higher concentration of sulfuric acid will cause aldehydes and ketones to generate and cover a large amount of foam during the hydrogen evolution process at the cathode, which inhibits the heat dissipation effect of the plating system, resulting in a decrease in crystal polarization during deposition, and the coating is dark and rough

Method used

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  • Bright tin plating solution and preparation method thereof and method for electrobrush tin plating on copper-based material surface
  • Bright tin plating solution and preparation method thereof and method for electrobrush tin plating on copper-based material surface
  • Bright tin plating solution and preparation method thereof and method for electrobrush tin plating on copper-based material surface

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preparation example Construction

[0052] A kind of preparation method of described bright tin plating liquid, comprises the following steps:

[0053] In the aqueous solution of thiourea and methanol, sequentially add stannous sulfate, trisodium phosphate and compound additives, and mix well to obtain the bright tin plating solution.

[0054] Preferably, the preparation method of the compound additive specifically comprises the following steps:

[0055] Mix fatty alcohol polyoxyethylene ether, polyethylene glycol 400, N,N-dimethylformamide and 2-mercaptobenzothiazole, then add anhydrous methanol, stir until dissolved, then add catechol and ascorbic acid , stirring and mixing to obtain the compound additive.

[0056] The ingredients in the compound additive combination are difficult to dissolve in the aqueous solution. First, the organic additive is gradually dissolved to prepare the compound additive combination. Adding it to the aqueous solution system avoids the phenomenon of long dissolution period and prec...

Embodiment 1

[0072] Take a certain amount of fatty alcohol polyoxyethylene ether, polyethylene glycol 400, N,N-dimethylformamide and 2-mercapto-thiazole in a beaker, add a small amount of anhydrous methanol, stir to dissolve, and then add a certain amount of Amount of catechol and ascorbic acid stirring, in which fatty alcohol polyoxyethylene ether, polyethylene glycol 400, N, N-dimethylformamide, 2-mercapto-thiazole, anhydrous methanol, catechol and The dosage ratio of ascorbic acid is: 4g: 9.5ml: 0.115g: 0.08g: 13.5ml: 2g: 1.2g.

[0073] A certain amount of thiourea and methanesulfonic acid are dissolved in deionized water to obtain a mixed solution of thiourea and 35g / L methanesulfonic acid with a concentration of 60g / L to obtain the first mixed solution; Tin joins in above-mentioned mixed solution, and gained stannous sulfate concentration is 30g / L, obtains the second mixed solution; Add a certain amount of trisodium phosphate in the second mixed solution described above, stir, obtain ...

Embodiment 2

[0076] The formula and usage method of this embodiment are the same as those of Embodiment 1, the difference being that the number of times of brush plating is 5 times.

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Abstract

The invention provides a bright tin plating solution and a preparation method thereof and a method for electrobrush tin plating on the copper-based material surface. The bright tin plating solution isprepared from the raw materials in parts by mass: 30-45g / L of stannous sulfate, 60-85g / L of thiourea, 25-40g / L of methanesulfonic acid, and 30-45g / L of trisodium phosphate anhydrous. The bright tin plating solution has the advantages of being stable in chemical property, and being non-poisonous and environmentally friendly. A tinned metal layer with excellent electrochemical performance, uniformand compact structure and high adhesion is formed on the copper-based material surface. Operation is simple and convenient, the cost is low, and application to large-scale industry can be achieved.

Description

technical field [0001] The invention relates to the technical field of electrochemistry, in particular to a bright tin plating solution and its preparation method and application. Background technique [0002] The existing domestic power system operating equipment is developing towards high voltage, high frequency, high power, high current, intelligence and long life. Based on the good electrical conductivity, thermal conductivity and environmental adaptability of pure copper materials, copper bars are used in large The application in power equipment is also becoming more and more popular, and it is an indispensable conductive material. The surface of industrial copper-based materials used in power equipment is easily oxidized when exposed to the air, and its oxide seriously affects the conductivity of copper-based materials. Copper bars, copper plates and copper busbars in power equipment, in order to prevent oxidation of the contact surface, the diversion joints, terminal...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/32C25D5/34C25D5/06
Inventor 李伟黄超凡郑科旺覃彩芹张玺刘舰郭海吕振利颜枭
Owner HUBEI ENG UNIV
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