33results about How to "High bath stability" patented technology

Disclosed is an electroless palladium plating bath containing a palladium compound, at least one complexing agent selected from ammonia and amine compounds, at least one reducing agent selected from phosphinic acid and phosphinates, and at least one unsaturated carboxylic acid compound selected from unsaturated carboxylic acids, unsaturated carboxylic acid anhydrides, unsaturated carboxylates and unsaturated carboxylic acid derivatives. Such an electroless palladium plating bath has high bath stability, and decomposition of the bath hardly occurs. Consequently, the electroless palladium plating bath of the present invention has a longer bath life than conventional electroless palladium plating baths. In addition, this electroless palladium plating bath enables to obtain excellent solder bonding characteristics and wire bonding characteristics since it does not affect plating film characteristics even when it is used for a long time.

The invention discloses a combined electroplating process on a magnesium alloy motorcycle wheel hub by adopting a non-cyanide and chrome free pre-plating treatment solution. Electroplated nickel and pyrophosphate copper are adopted as dual-layer bottoming coating, and then Cu / Ni / Cr combined coating electroplating is performed, to obtain the Cu / Ni / Cr combined metallic coating with high corrosion resistance on the surface of the magnesium alloy motorcycle wheel hub. The metallic coating obtained on the surface of the magnesium alloy motorcycle wheel hub by adopting the process has the advantages that the binding force is strong, and the corrosion resistance is high, and the combined electroplating process has the prominent advantages that the personnel health is guaranteed, and the environmental pollution is avoided.

The invention relates to a method for the anodic electrophoretic enamelling of conductive surfaces by dipping into an aqueous anodic electrophoretic bath and by connecting as an anode. An aqueous anodic electrophoretic bath is used which contains 1 to 15 % by weight of one or more phosphoric acid epoxy esters and / or phosphonic acid epoxy esters in relation to the binding agent solid of the electrophoretic bath. Said phosphoric acid epoxy esters and / or phosphonic acid epoxy esters are produced in the presence of alcohols.

In the invention, the sodium hypophosphite is as the reducing agent of the bath, nickel sulfate as the main salt, with the complexing agent, accelerating agent and stabilizing agent being added. The ultrasonic chemical plating and second chemical plating method are adopted that utilizes the mechanical energy of the ultrasonic vibration, making the bath deposit nickel and phosphor under the catalysis of the metal surafce and the chemical reduction method controlled. The plating procedure includes the steps of edge rounding, oil removal, rust removal, activation, chemical plating and post treatment. The multiple complexing, accelerating and stabilizing agents raises the stability of the bath. The plating speed is adjustable. The even, compact nickel and phosphor plating layer covers the surface of the base body of powder metallurgical material so as to increase the service life of the material and provide wide application area.

The invention relates to a chemical palladium plating solution, in particular to a chemical palladium plating solution which can directly form a palladium film with good adhesive force on a chemical nickel plating film formed on a printed circuit board (PCB) and does not affect the chemical nickel plating film serving as a base film. The chemical palladium plating solution contains a soluble palladium salt, a first complexing agent, a second complexing agent and a stabilizing agent, wherein the first complexing agent is one out of ammonia and diamine compounds, and the second complexing agentis one or more out of alcohol amine compounds with 2-7 carbon atoms, amine compounds with less than 7 carbon atoms and aminocarboxylic acid compounds. The palladium plating solution has stable pH, stable deposition rate, long bath service life and excellent bath stability, does not generate cracks, and can obtain the palladium plating film with very low phosphorus content and excellent corrosion resistance, solder connectivity and lead weldability.

An environmental non-cyanide plating solution for silver-plating contains silver ion source, amino acid compound and derivative thereof used as complexant, auxiliary complexant and plating additive. The component ratio and the process condition are as follows: the contents of silver salt, amino acid compound and derivative thereof, auxiliary complexant and plating additive are separately 0.01-1mol / L, 0.01-10mol / L, 0.002-2mol / L and 0.001-2.0g / L, the pH value of silver-plating solution is 6-14 and the temperature of the silver-plating solution is 10-70 DEG C. Compared with the traditional cyanide-containing formulation for silver-plating, the environmental plating solution for silver-plating is characterized by clean plating; meanwhile the replacement rate between silver ions in the platingsolution and active metal such as copper, copper alloy and the like and alloy base is extremely slow, the one-step electroplating method is adopted for silver-plating, pre-plating and soaking processes of silver are not needed, and the coating is bright with good binding force.

The invention provides a chemical silver plating solution on a printed circuit board and a silver plating method. The chemical silver plating solution is prepared from the compositions of 1.0-2.0g / L of silver ions, 5-30g / L of a copper ion complexing agent, 0.5-1.8g / L of bithiazole-like compounds, 0.5-1.5g / L of azaindole-like-containedindole compounds, 0.05-0.075g / L of benzotriazole, 40-60ml / L of methanesulfonic acid, and 0.5-1.3 g / L of polyphenyl-tetramethyl-acyl-diphenyl-imide,a suitable pH value of the plating solution is 0.5-1, and the plating solution is put at the room temperature. By adopting the chemical silver plating solution, a bright white coating is obtained,especially the binding force and corrosion resistant properties are outstanding, meanwhile the process flow is shortened,pre-plating is not required, and reliability of the circuit board can be improved and the service life can be prolonged.

In the invention, the sodium hypopphosphite is as the reducing agent of the bath, nickel sulfate as the main salt, with the complexing agent, accelerating agent and stabilizing agent being added. The ultrasonic chemical plating is adopted that utilizes the mechanical energy of the ultrasonic vibration, making the bath deposit nickel and phosphor under the catalysis of the metal surface and the chemical reduction method controlled. The plating procedure includes the steps of oil removal, rust removal, activation, chemical plating and post treatment. The multiple complexing, accelerating and stabilizing agents raises the stability of the bath. The plating speed is adjustable. The even, compact nickel and phosphor plating layer covers the surface of the base body of powder metallurgical material so as to increase the service life of the material and provide wide application area.

The invention discloses an alkaline cyanide-free electro-deposition zinc-nickel alloy additive and an application thereof. The alkaline cyanide-free electro-deposition zinc-nickel alloy additive is prepared from an additive and ultrapure water. The additive is an organic additive or a mixture of the organic additive and an inorganic additive and can be applied to an alkaline cyanide-free electro-deposition zinc-nickel alloy plating solution to replace a traditional cadmium coating and cyanide electro-deposition zinc-nickel alloy process. According to the alkaline cyanide-free electro-deposition zinc-nickel alloy additive and the application thereof, through additive screening and adding, an electroplating process for electro-deposition zinc-nickel alloy is optimized, and a zinc-nickel alloy coating which is bright in appearance, high in hardness and excellent in corrosion resistance is finally obtained; the obtained plating solution is good in stability, dispersity and covering capacity, and the problems that a conventional alkaline zinc-nickel alloy plating solution is poor in stability and low in current efficiency, and an obtained coating is poor in quality are solved fundamentally; and the industrialized application feasibility of the alkaline cyanide-free electro-deposition zinc-nickel alloy additive is improved.

The invention relates to a chemical nano-silver plating solution and a preparation method thereof, and a silver plating method for a copper part, and belongs to the technical field of chemical silver plating. The chemical silver plating solution comprises the following raw material components: a plating solution A and a plating solution B, wherein 1L of the plating solution A comprises 1 to 20g of silver salt and 3 to 50g of 25 mass percent ammonia water; 1L of the plating solution B comprises 3 to 105g of reducing agent, 0.05 to 1g of organic additive and 0.01 to 0.2g of other additives; and chemical silver plating temperature is 25 DEG C, and ageing time is 5 to 60 minutes. The surface of copper is subjected to chemical silver plating by the method, the plating solution has high stability, a bright and fine nano-silver plating is formed on the surface of the copper, is high in performance and adhesion, and is thick, uniform, non-foaming and crack-free, and the application requirements of fields of decorative electroplating and functional electroplating are met.

The invention discloses a Ni-Cu-P ternary alloy coating serving as a welding spot reaction barrier layer and an electroplating preparation technology thereof. The Ni-Cu-P ternary alloy coating serving as the welding spot reaction barrier layer comprises the following components in percentage by weight: 70-90% of Ni, 3-10% of Cu and 7-20% of P. The thickness of the coating is 2-15mu m. The preparation method comprises the following steps of: putting an electroplated cathode piece (metallized Si chip or Cu piece) and an electroplated anode sheet (Pt piece) into electroplate liquid; introducing dipulse current for dipulse electroplating; and forming an Ni-Cu-P alloy coating on the surface of the cathode piece. The components of the Ni-Cu-P alloy coating prepared by using the electroplating preparation technology conform to the use requirement of a welding spot reaction barrier layer for electronic packaging and interconnection, the coating and the cathode piece substrate (metallized Si chip or Cu piece) are tightly combined, a plating layer is flat, and the Ni-Cu-P ternary alloy coating is fine in cellular tissue, even in thickness, and compact in structure and is basically free from holes.