A kind of electroless nickel plating liquid and preparation method thereof

Abstract

The invention provides chemical nickel-plating plating solution and a preparation method thereof. The chemical nickel-plating plating solution comprises basic chemical nickel-plating solution and an alcohol additive; the pH value of the chemical nickel-plating plating solution is 4.8 to 5.2; the alcohol additive is one or more selected from water-soluble monohydric alcohol, dihydric alcohol or trihydric alcohol. The chemical nickel-plating plating solution contains the alcohol additive, so that the plating solution has excellent stability, and the nitric acid resistant melanism capacity of a clad layer during application of the chemical nickel-plating plating solution can be remarkably improved.

Description

technical field

[0001] The invention belongs to the technical field of circuit board processing technology, and in particular relates to an electroless nickel plating solution and a preparation method thereof.

[0002] technical background

[0003] Electroless nickel-plating gold immersion process for circuit boards usually requires the nickel-gold layer to be resistant to 24h salt spray test, and some even require 48h salt spray test resistance, but the thickness of the electroless nickel plating layer is limited to 2-6 microns, resulting in anti-corrosion Corrosion ability is limited. At the same time, in order to improve the welding performance, the P content in the nickel coating is in the range of medium and low phosphorus, resulting in poorer corrosion resistance of the nickel coating than the high P content coating.

[0004] In order to improve the corrosion resistance of the electroless nickel plating layer, the patent ZL201110101184.7 proposes a sealing method, that...