A kind of electroless nickel plating liquid and preparation method thereof

A technology of electroless nickel plating solution and nickel phosphorus, which is applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problems that the nickel layer is prone to produce tiny holes and the corrosion resistance of the nickel coating is limited, and achieves Improved corrosion resistance, low cost, and enhanced stability

Active Publication Date: 2019-11-26
德星化工(苏州)有限公司
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Problems solved by technology

Patent CN201010142671.3 discloses that ethylenediaminetetraacetic acid bismuth compounds have the effect of stabilizing the plating solution and improving the coating’s resistance to nitric acid blackening, but experiments have proved that ethylenediaminetetraacetic acid bismuth compounds have limited ability to improve the corrosion resistance of nickel coatings, especially in In the electroless nickel plating and immersion gold process in the circuit board industry, the nickel layer is often prone to produce tiny holes

Method used

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Embodiment Construction

[0017] The present invention can be further illustrated by the following examples, but the examples are not intended to limit the protection scope of the present invention.

[0018] The composition of the basic electroless nickel plating liquid that the embodiment of the present invention adopts is: NiSO 4 ·6H 2 O 22g / L, NaH 2 PO 2 ·H 2 O22g / L, sodium succinate 12.5g / L, malic acid 8g / L, and the rest is water.

[0019] Mix 1L basic electroless nickel plating solution with alcohol additives, adjust the pH to 5.0 with ammonia water to obtain an electroless nickel plating solution, raise the temperature of the electroless nickel plating solution to 83°C, degrease and wash a 2cm×3cm copper sheet , After activation, immerse in the electroless nickel plating solution for 20 minutes to obtain a sample with nickel-phosphorus coating, take it out and wash it with water.

[0020] The dosage composition of the alcohol additives used in Examples 1-3 is shown in Table 1, and the prepar...

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Abstract

The invention provides chemical nickel-plating plating solution and a preparation method thereof. The chemical nickel-plating plating solution comprises basic chemical nickel-plating solution and an alcohol additive; the pH value of the chemical nickel-plating plating solution is 4.8 to 5.2; the alcohol additive is one or more selected from water-soluble monohydric alcohol, dihydric alcohol or trihydric alcohol. The chemical nickel-plating plating solution contains the alcohol additive, so that the plating solution has excellent stability, and the nitric acid resistant melanism capacity of a clad layer during application of the chemical nickel-plating plating solution can be remarkably improved.

Description

technical field [0001] The invention belongs to the technical field of circuit board processing technology, and in particular relates to an electroless nickel plating solution and a preparation method thereof. [0002] technical background [0003] Electroless nickel-plating gold immersion process for circuit boards usually requires the nickel-gold layer to be resistant to 24h salt spray test, and some even require 48h salt spray test resistance, but the thickness of the electroless nickel plating layer is limited to 2-6 microns, resulting in anti-corrosion Corrosion ability is limited. At the same time, in order to improve the welding performance, the P content in the nickel coating is in the range of medium and low phosphorus, resulting in poorer corrosion resistance of the nickel coating than the high P content coating. [0004] In order to improve the corrosion resistance of the electroless nickel plating layer, the patent ZL201110101184.7 proposes a sealing method, that...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/36
CPCC23C18/36
Inventor 胡光辉杨文健杜晓吟付正皋潘湛昌
Owner 德星化工(苏州)有限公司
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