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Tin plating solution

A technology of tin plating solution and stannous chloride, applied in the field of tin plating solution, can solve problems such as short circuit of electronic components and accidents, and achieve the effect of high stability and reasonable formula

Inactive Publication Date: 2013-07-03
谢柳芳
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Tin plating has good solderability and corrosion resistance, and is widely used in electronic components, but pure tin plating for a long time will produce whiskers, which will lead to short circuit of electronic components and cause accidents

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0010] A tin plating solution, that is, the formula: stannous chloride: 30g / L, hydrochloric acid: 150g / L, brightener: 10ml / L, stabilizer: 20m / L, bismuth nitrate: 1g / L, ammonia water 20g / L , the complexing agent 20g / L and the remaining water are fully stirred and mixed, and the pH value regulator is added to control the pH value of the plating solution at 2. The current density: 2.0A / dm 2 , Temperature: 25°C.

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PUM

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Abstract

The invention relates to a tin plating solution with a formula comprising 20-50 g / L of stannous chloride,150-200 g / L of hydrochloric acid, 5-20 ml / L of a brightening agent, 20-30 ml / L of a stabilizer, 0.5-2 g / L of bismuth nitrate, 20-50g / L of a pH regulator composed of ammonia water and a complexing agent, and the balance being deionized water. Preparation environment of the solution is that a current density is 1.0-2.0 A / dm<2>; a temperature is 20-30 DEG C; a pH value of the plating solution is controlled within 1-2. The solution is reasonable in formula, has good welding properties and can effectively inhibit the growth of crystal whiskers. The plating solution has high stability and long service life.

Description

technical field [0001] The invention specifically relates to a tin plating solution. Background technique [0002] Tin plating has good solderability and corrosion resistance, and is widely used in electronic components. However, if pure tin plating takes a long time, it will produce whiskers, which will cause short circuit of electronic components and cause accidents. Contents of the invention [0003] The purpose of the present invention is to provide a tin plating solution with reasonable formula, good weldability and stable plating solution which can inhibit the growth of whiskers. [0004] Technical solution of the present invention is: [0005] A tin-plating bath, characterized by: the formula: stannous chloride: 20-50g / L, hydrochloric acid: 150-200g / L, brightener: 5-20ml / L, stabilizer: 20-30m / L , bismuth nitrate: 0.5-2g / L, pH adjusting agent: ammonia water, complexing agent 20-50g / L, the balance water. [0006] The preparation environment of the present invention...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/30
Inventor 谢柳芳
Owner 谢柳芳
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