84 results about "Electroplated nickel" patented technology

The invention relates to the technical field of semi-gold-nickel plating and processing, in particular to a floating connector terminal continuous semi-gold-nickel plating process which comprises the following preparation steps: S1, a floating connector terminal to be electroplated is put into degreasing fluid for degreasing treatment, and then the degreased terminal is put into activating fluid for activating treatment; s2, nickel electroplating is conducted on the activated floating connector terminal through a nickel plating solution, a nickel cake serves as an anode, the pH value of the nickel plating solution is controlled to be 3.5-5.5 through weak acid in the electroplating process, the electroplating current is controlled to be 0.4-0.8 A / dm < 2 >, the temperature is controlled to be 50-60 DEG C, cleaning is conducted, and the nickel-plated floating connector terminal is obtained; and S3, the nickel-plated floating connector terminal is put into the gold plating solution to be electroplated, the electroplating temperature is 40-50 DEG C, the current density is 0.1-2 A / dm, a finished product is obtained, and the floating connector terminal can still keep high conductivity, low contact resistance, high abrasion resistance and high corrosion resistance under the complex environments of high temperature, vibration, salt mist and the like through the technology.

The application discloses a brazing method of magnesium / aluminum dissimilar metals, which comprises the following steps: pre-electroplating nickel on a magnesium alloy base material, connecting the prepared magnesium alloy with a nickel plating layer and an aluminum alloy by using an ultrasonic-assisted brazing method, and using a brazing filler metal SAC305. The method prevents the generation of Mg-Sn intermetallic compounds (IMCs) in the process of magnesium / aluminum dissimilar metal low-temperature brazing using a Sn-based brazing filler metal. After welding, the position of the original nickel plating layer is changed into a Cu-Ni solid solution, and no large block-shaped Mg2Sn IMC is found in the brazing seam. Compared with a joint without a plating layer, the shear strength of the magnesium / aluminum dissimilar metal brazing joint based on the nickel plating layer is greatly improved, and the joint strength is strengthened by the diffusion of the nickel element into the brazing seam in the welding process. In addition, the corrosion resistance of the magnesium alloy can be improved by plating nickel on the surface of the magnesium alloy, and the service life of the magnesium / aluminum component is prolonged.

A layered structure includes a silicon-based substrate comprising a substrate surface; a titanium-copper seed layer arranged on the substrate surface, wherein the titanium-copper seed layer comprises a titanium layer and a copper layer, wherein the titanium layer is arranged on the substrate surface such that covalent bonds are formed between the titanium layer and silicon of the silicon-based substrate, and wherein the copper layer is arranged directly on the titanium layer, such that the titanium layer is arranged between the substrate surface and the copper layer; and a nickel-iron plating layer arranged directly on the copper layer of the titanium-copper seed layer such that the titanium-copper seed layer is arranged between the silicon-based substrate and the nickel-iron plating layer.

The invention belongs to the technical field of printed circuit boards, and discloses a printed circuit board manufacturing method and a printed circuit board, and the method comprises the steps: covering the surface of a plated circuit board with a positive dry film, and forming a circuit board with the positive dry film; wherein the positive dry film is provided with a pattern to be plated with nickel and gold, and the pattern to be plated with nickel and gold is a pattern which coincides with a pre-designed circuit pattern and is compensated and pre-enlarged; performing exposure, development and micro-etching treatment on the circuit board with the positive dry film to form a circuit board with a concave position to be plated with nickel and gold; carrying out nickel and gold electroplating treatment on the circuit board with the concave position to be plated with nickel and gold, and removing a film to obtain a circuit board with a nickel and gold plating layer; covering a negative dry film on the surface of the circuit board with the nickel-gold plating layer to form a circuit board with a negative dry film; performing exposure, development, acid etching and film stripping on the circuit board with the negative dry film to obtain a printed circuit board; according to the invention, the quality and reliability of the printed circuit board can be remarkably improved while the nickel-gold saving ratio is effectively improved.

The utility model discloses a kind of electroplating nickel anode copper bar hydraulic pressure quick breaking locking device, it is related to power supply locking equipment technical field.The utility model includes clamp, clamp outside is equipped with clamping frame, two titanium blue copper bars are installed between clamping frame one end and clamp, and two rectifier copper bars are installed between another end and clamp, clamp one end is equipped with jack locking part, jack locking part is used to control the locking state of rectifier copper bar, titanium blue copper bar by clamp.The utility model is installed clamp between two groups of rectifier copper bar and titanium blue copper bar, clamping frame is installed outside in clamp middle part, lockable jack locking part is installed in clamp one end, the opening and closing of clamp is controlled by jack locking part, in turn, the clamping state of two groups of copper bar is controlled, artificial installation bolt is avoided, and electroplating efficiency is indirectly improved.

The invention provides a zirconium alloy nickel plating method based on a multi-element gradient transition layer and a nickel-plated zirconium alloy workpiece, and relates to the technical field of surface treatment.The method comprises the steps that the zirconium alloy workpiece is pretreated; the pretreated zirconium alloy workpiece is immersed in fused salt electroplating liquid, stepped electro-deposition and vacuum annealing treatment are conducted on the pretreated zirconium alloy workpiece, a multi-element gradient transition layer with components changing from zirconium-rich nickel alloy to nickel-rich zirconium alloy in a gradient mode is formed on the surface of the zirconium alloy workpiece, and an intermediate zirconium alloy workpiece is generated; and the intermediate zirconium alloy workpiece is subjected to activating treatment, the intermediate zirconium alloy workpiece subjected to activating treatment is placed in an electroplating nickel solution to be subjected to electroplating nickel treatment, and the nickel plating layer is obtained. The bonding performance of the surface nickel plating layer is improved.

Rolling guide supporting devices are arranged on the outer walls of the periphery of the upper end of a nickel plating tank, the upper ends of the rolling guide supporting devices are fixedly connected with the bottom edge of the corresponding side of a swinging frame, and supporting bases are fixed to the middles of the upper end faces of the two wide sides of the swinging frame. The end part of the hanging rod for hanging the electroplated workpiece is matched with the supporting seat at the corresponding end; a swing driving device is arranged on one wide edge side of the nickel plating tank, an action part of the swing driving device is connected with the corresponding side of the swing frame, and the swing driving device drives the swing frame and the electroplated workpieces on the swing frame to swing in a reciprocating mode in the length direction, the width direction and the height direction of the nickel plating tank under supporting of the rolling guide supporting device. According to the invention, the multi-direction swinging motion of the swinging frame is realized to optimize the flowing state of the plating solution, the purposes of efficient separation of bubbles on electroplated workpieces and uniform deposition of plating layers are achieved, the workpiece loading flexibility and the production efficiency are improved, and the defects of non-uniform permeation of the plating solution and residual bubbles in the nickel electroplating process are overcome.

This invention relates to a nickel-plated steel sheet with excellent corrosion resistance for battery casings and a method for manufacturing the same. In one specific embodiment, the nickel-plated steel sheet comprises: a base steel sheet; a nickel plating layer formed on at least one surface of the base steel sheet; and a nickel-iron diffusion layer formed between the base steel sheet and the nickel plating layer. The nickel plating layer and the nickel-iron (Ni-Fe) diffusion layer are formed by heat treatment after forming an electroplated nickel layer on the base steel sheet and a chemically plated nickel layer on at least a portion of the surface of the electroplated nickel layer. The nickel plating layer contains one or more vacancy elements selected from phosphorus (P), boron (B), tungsten (W), cobalt (Co), molybdenum (Mo), and copper (Cu) on its surface.

A method of producing a flexible nickel phosphorus coating on a substrate. The substrate includes a dielectric material having a copper layer thereon. The method comprises the steps of: (1) activating the substrate with a palladium activation solution to catalyze the substrate, and 2) contacting the activated substrate with an electroless nickel phosphorus plating bath comprising: (i) a source of nickel ions; (ii) a hypophosphite ion source; (iii) at least one metal complexing agent; and (iv) an organic flexible additive. The nickel-phosphorus plating layer deposited on the substrate shows a columnar grain structure.

The present disclosure relates to a nickel plated steel sheet for a battery case having excellent corrosion resistance and a method for manufacturing the same. In one embodiment, the nickel plated steel sheet comprises: a base steel sheet; a nickel plating layer formed on one or more surfaces of the base steel sheet; and a nickel-iron (Ni—Fe) diffusion layer formed between the base steel sheet and the nickel plating layer; wherein the nickel plating layer and the nickel-iron (Ni—Fe) diffusion layer are formed by forming an electro-nickel plating layer on the base steel sheet and an electroless nickel plating layer on at least a portion of the surface of the electro-nickel plating layer, followed by heat treatment, and the nickel plating layer includes one or more co-deposited elements selected from phosphorus (P), boron (B), tungsten (W), cobalt (Co), molybdenum (Mo), and copper (Cu) on its surface.

This utility model relates to a circular vertical lifting continuous electroplating nickel-gold wire, comprising several clamps for holding PCB boards, a symmetrically arranged rotating mechanism one and a rotating mechanism two, with vertically lifting electroplating tweezers and vertically lifting electroplating gold wires arranged facing each other between rotating mechanism one and rotating mechanism two. The clamps move cyclically along the vertically lifting electroplating tweezers, rotating mechanism two, vertically lifting electroplating gold wires, and rotating mechanism one in a circular trajectory. The advantages are: the cyclic movement of the clamps along the circular trajectory ensures a consistent electroplating path for each OCB board, avoiding differences in electroplating paths affecting electroplating quality; the cyclic movement of the clamps reduces the need for transfer equipment and channels, reducing the footprint of the electroplating equipment; and the vertical lifting method allows the PCB board to be directly inserted into the lower gold bath, eliminating the need for the upper gold bath in traditional vertical continuous electroplating lines, reducing the volume of the gold bath and the initial one-time investment cost for the enterprise.

The invention discloses a GN (at) Ti / NiO-x00 anode electro-catalytic material and a preparation method of the GN (at) Ti / NiO-x00 anode electro-catalytic material. The method comprises the following steps: electroplating nickel on the surface of a titanium substrate to form a nickel intermediate layer, annealing to change the surface crystal form structure and refine intermediate layer grains, and carrying out high temperature and hydrogen catalytic reduction on acetylene gas on the surface of the nickel intermediate layer of the titanium substrate to form a graphene active layer on the surface through chemical vapor deposition. The nickel-plated graphene doped titanium substrate non-noble metal electrode, namely the GNatTi / NiO-x00 anode electro-catalytic material, is obtained. The titanium-based electrode plate is subjected to nickel plating and loaded with the graphene layer, so that active sites on the surface of the electrode are increased, the electrocatalytic activity is improved, peeling of the coating is reduced, the efficiency of degrading complex coking wastewater is greatly improved, the electrode has high economic benefits, and compared with a traditional commercial precious metal electrode, the electrode has the advantages that the cost is low, and the application range is wide. The material is a novel composite electrode material with excellent electrochemical performance.

This invention discloses a method for electroplating soft gold onto a circuit board, and also discloses the circuit board. The method includes the following steps: S1: Obtaining a circuit board with a copper layer on its surface; S2: Electroplating a nickel layer on the surface of the copper layer, wherein the surface of the nickel layer has gold bonding lines and non-gold bonding lines; S3: Forming multiple arrayed and spaced bump structures in the gold bonding lines, each bump structure including a nickel substrate and a gold surface layer disposed on the surface of the nickel substrate; S4: Electroplating the circuit board with gold to form a first gold layer on the gold bonding lines and a second gold layer on the non-gold bonding lines, wherein the thickness of the first gold layer is greater than the thickness of the second gold layer. In this way, selective thickening of the gold bonding lines is achieved during the gold plating process, ensuring that the gold bonding lines have a sufficiently thick gold layer to guarantee the reliability of the gold bonding lines, while the non-gold bonding lines maintain a relatively thin gold layer, which can reduce the amount of gold used and lower the production cost of the circuit board.

The invention discloses an efficient tungsten filament drawing process and an electric drawing and gas annealing eleven-die all-in-one machine, and the efficient tungsten filament drawing process comprises the following steps: hot drawing: heating a tungsten lanthanum alloy with the wire diameter of 0.360-0.390 mm to 800-840 DEG C, and drawing the tungsten lanthanum alloy through a die at the area reduction rate of 16%-22% to obtain a tungsten filament with the wire diameter of 0.150-0.170 mm; annealing and stretching: annealing the tungsten filament subjected to hot stretching at the temperature of 1450-1500 DEG C, and then stretching the tungsten filament to 0.125-0.135 mm through a mold; the wires obtained in the annealing and stretching steps are subjected to electrolytic alkali washing to obtain white wires with the diameter ranging from 0.118 mm to 0.122 mm; electroplating: electroplating a nickel-zinc-copper alloy layer on the wire material subjected to alkali washing until the thickness is 0.124-0.126 mm; and cold drawing is conducted, specifically, the electroplated wire is subjected to multi-pass cold drawing at the room temperature through a mold with the area reduction rate of 12%-18%, the wire is drawn to the target wire diameter, and the target wire diameter is smaller than 28 micrometers. According to the method, the tungsten filament is subjected to structure reconstruction when the diameter of the tungsten filament is large, the machining rate of a follow-up cold drawing section is increased, and the strength of a final finished product can reach 6909 MPa and is far higher than that of a traditional process.

The invention belongs to the technical field of diffusion welding and thin-wall seamless steel pipe bulging, and relates to a gas cylinder for filling high-pressure oxygen and a manufacturing method thereof, the gas cylinder comprises a thin-wall seamless steel pipe liner, a gas cylinder joint, a Teflon lining coating, a high-molecular polymer layer, a carbon fiber reinforced winding layer and an external protection layer, the bottle body is formed through multiple times of water pressure bulging, and cracks and wrinkles caused by spinning are avoided; electroplating a nickel-iron-PTFE composite layer on the inner surface, and spraying and sintering PTFE to form an antioxidant lining; the outer surface is fully wound with a carbon fiber main bearing structure after being subjected to injection molding of a polyethylene layer, and then is coated with a glass fiber and epoxy resin protective layer. A traditional spinning process is abandoned, forming is uniform, defects are avoided, the connector strength is high, the sealing performance is good, the light weight level, the fatigue life and the use safety of the gas cylinder are remarkably improved, and the gas cylinder is suitable for medical, aviation and other high-purity high-pressure oxygen storage scenes.

The present application belongs to the technical field of surface treatment, and in particular to a surface treatment process for diamond / aluminum composite material. The present application comprises the following steps: degreasing, drying, sand blasting, degreasing, pickling, sensitization, activation, electroless nickel plating, low-temperature annealing, degreasing, pickling, impact nickel plating, electroplating nickel, pre-plating gold, electroplating gold, and low-temperature annealing. The present application reduces the stress between the surface of the composite material and the plating layer through a stepwise heating mode, thereby improving the bonding force and meeting the welding technical requirements of the diamond / aluminum composite material.

The invention discloses a ceramic coating marine cable connector, which comprises a connector shell, a conductive pin and an end cover, a composite protective coating system is arranged on the outer surface of the connector shell and the matching surface of the end cover, and a metal protective coating is arranged on the contact surface of the conductive pin. According to the ceramic coating marine cable connector and the preparation method thereof, the problem of galvanic corrosion of dissimilar metal is effectively solved through micro-arc oxidation / electronickelling differentiation bottom layer treatment, physical barrier and intelligent response cooperative protection is achieved through the graphene composite middle layer, a complete protection system is formed in combination with the super-hydrophobic top layer, and the corrosion resistance of the connector is improved. And finally, while the bonding strength of the coating is ensured, the corrosion-resistant life and maintainability of the connector in a marine environment are remarkably improved.

The invention relates to the technical field of wastewater treatment, in particular to an electroplating nickel-chromium wastewater treatment device which comprises a sewage tank, a water suction pump is fixedly connected to the upper surface of the inner wall of the bottom of the sewage tank, one end of the water suction pump is fixedly connected with a door-shaped pipeline, and the other end of the door-shaped pipeline extends into a flocculation tank. Four square columns are fixedly connected to the four corners of the lower surface of the flocculation tank, stirring assemblies are fixedly connected to the upper surfaces of the tank walls of the two sides of the flocculation tank, and one end of the bottom of each stirring assembly is connected with an anti-condensation assembly in a meshed mode. According to the nickel-chromium electroplating wastewater treatment device, the water pump is matched with the flocculation basin, the sedimentation basin and the filter press, metal impurities such as nickel and chromium contained in wastewater are sequentially neutralized, stripped and filtered, the site requirement of the wastewater treatment device can be reduced through flow matching, and the production requirements of many related industries such as chemical engineering, metal or sewage processing plants are met; operation is convenient, and efficiency is high.

The invention discloses a stainless steel oxygen-free copper embedded T / R shell and a preparation method thereof. The shell comprises a 316L stainless steel shell body, a TU1 oxygen-free copper substrate, a radio frequency connector, a stress gradient slow release ring and a low-frequency connector. The preparation method comprises the following steps: cleaning and annealing each component; the weldability is enhanced by pre-plating nickel; the shell, the substrate and the stress slow release ring are assembled through silver-copper brazing; after nickel / gold electroplating, a plating layer on the sealing and welding surface is removed through laser; and installing the radio frequency / low frequency connector to the kovar ring through gold-tin brazing. Through gradient material design and a step-by-step brazing process, the problem of sealing failure caused by thermal expansion coefficient mismatch is solved, and the high-power heat dissipation performance and the airtight reliability are remarkably improved.

This invention relates to the field of circuit board processing technology, specifically to a method for manufacturing an electroplating substrate. The method includes: attaching a selective dry film to the surface of the substrate, designing the exposure area of ​​the selective dry film according to the area to be plated and the non-plated area; after exposure and development, exposing the area to be plated and covering the non-plated area; electroplating nickel-gold onto the exposed copper circuit to form a nickel-gold layer on its surface, while simultaneously depositing gold whiskers on the sides of the copper circuit near the edge within the selective film coverage area; after removing the selective dry film, attaching a back-etching dry film, designing the exposure area of ​​the back-etching dry film according to the area where the gold whiskers are located, and retaining a back-etching protection area corresponding to the local copper circuit on the side where the gold whiskers are located; performing back-etching to remove the uncovered copper circuit; and removing the back-etching dry film, allowing the gold whiskers to remain bonded to the remaining local copper circuit. This invention, through the design of two exposure areas—selective dry film and back-etching dry film—fixes the gold whiskers onto the copper circuit, preventing gold whisker drift and short circuits, thus improving product yield.

The invention discloses a method for electroplating gold on a molybdenum-copper alloy, relates to the technical field of surface treatment, and aims to solve the technical problems that the binding force between the existing molybdenum-copper alloy and a gold-plated layer is weak, and the requirements of severe environments and long-time use are difficult to meet. The method for electroplating the gold on the molybdenum-copper alloy comprises the following steps: immersing the molybdenum-copper alloy into an activating solution for activating treatment; the activating solution comprises chromic anhydride, sulfuric acid and nitric acid; the molybdenum-copper alloy is subjected to impact nickel plating through the first solution; the components of the first solution comprise nickel chloride and hydrochloric acid; carrying out nickel electroplating on the molybdenum-copper alloy by using a second solution; the second solution comprises the following components: nickel aminosulfonate, nickel chloride, boric acid and lauryl sodium sulfate; immersing the molybdenum-copper alloy into a third solution for gold plating, and forming a gold-plated layer on the surface of the molybdenum-copper alloy; and the third solution comprises the following components: potassium aurous cyanide, potassium citrate and sodium sulfite.

The present application relates to electroplating nickel equipment technical field, specifically to a kind of electroplating is with nickel plating device and nickel plating method, including electroplating tank, still including hanger, first pipeline, pump body, second pipeline and deflector, wherein, hanger includes vertical pole, multiple clamping units are equipped on vertical pole, clamping unit includes first clamping plate, second clamping plate and bolt, bolt is connected with first clamping plate by screwing through second clamping plate;Two ends of first pipeline are set in the two sides inside electroplating tank;Pump body is connected in series on first pipeline;Second pipeline is vertically arranged and is installed in one end of first pipeline close to hanger, second pipeline has multiple liquid outlets;Deflector is arc plate, and hanger is located inside deflector.The present application can make the electroplating solution with high nickel ion concentration circulate around the plated part, while it can also improve the tangential velocity of the electroplating solution on the surface of the plated part, thereby reducing the overall diffusion layer thickness around the plated part, and further improving the deposition rate of the plated layer.

The invention relates to the technical field of electronic component manufacturing, in particular to a patch common mode inductor magnetic core spot welding tin explosion prevention technology. The spot welding tin explosion prevention process specifically comprises filling liquid vacuum impregnation between magnetic core silver dipping treatment and nickel-tin composite coating electroplating, and specifically comprises the following steps that vacuum pretreatment is conducted firstly, and then multi-frequency ultrasonic auxiliary impregnation is conducted, specifically, the composite filling liquid slowly flows into a container in the negative pressure state, meanwhile, double-frequency ultrasonic vibration is started, and the composite filling liquid is subjected to multi-frequency ultrasonic auxiliary impregnation; performing a gradient boosting process: keeping the pressure at-0.1 MPa for 0.5-1.5 h, performing gradient boosting to-0.05 MPa and keeping the pressure at-0.05 MPa for 0.5-1 h, and then performing boosting to 0 MPa and keeping the pressure at 0 for 0.5-1 h; the composite filling liquid is a mixed liquid of methyl phenyl silicone resin and nanometer aluminum oxide, and the mass ratio of the methyl phenyl silicone resin to the nanometer aluminum oxide is (99-99.5): (0.5-1); and then pressure relief and draining are carried out. By means of the spot welding tin explosion prevention technology, the good tin explosion prevention effect can be achieved.

The application discloses a surface protection method of a Nd-Fe-B double-plating layer, which comprises the following steps: after a Nd-Fe-B part is subjected to mechanical treatment of surface physical defects and surface oil removal treatment, the Nd-Fe-B part is subjected to ultrasonic treatment in an acid pickling solution; then, a copper layer is deposited on the surface of the Nd-Fe-B part by a physical gas deposition method or a magnetron sputtering method, wherein part of copper atoms diffuse into a surface layer of the Nd-Fe-B part and are distributed in grain boundaries; and a nickel layer is electroplated on the copper layer deposited on the surface of the Nd-Fe-B part. The application optimizes boundary microstructure by depositing the copper layer, and on the other hand, the double-plating layer is preferentially selected to replace a three-layer plating layer structure, so that magnetic shielding generated by the plating layer is reduced; and the new surface protection with high corrosion resistance is realized, which does not affect surface adhesion and greatly reduces loss of magnetic performance or even does not cause loss of magnetic performance.

An electrical plug connector contact (101, 201) has a terminal section (102, 202) for contacting with another complementary electrical plug connector contact (201, 101). A first galvanic nickel layer (107, 207) is positioned on top of the terminal section (102, 202). A second galvanic nickel layer (108, 208) is positioned on top of the first galvanic nickel layer (107, 207).

The invention belongs to the technical field of electronic components, and particularly relates to a thin-film chip inductor and a preparation method and application thereof. The preparation method of the thin-film chip inductor comprises the following steps that a first target material and a second target material are adopted to sequentially sputter and deposit a thin film layer on a substrate, then masking, electroplating, etching, protective film printing and end sealing treatment are carried out, then a nickel layer and a tin layer are electroplated, and the thin-film chip inductor is obtained. The first target material is NiCr, and the sputtering thickness of the first target material is 40-70 nm; the second target material is Cu, and the sputtering thickness of the second target material is 400-700 nm; the sputtering is carried out in mixed gas, the mixed gas comprises nitrogen and argon, and the flow ratio of the nitrogen to the argon is (2-3): (35-45). The precision of the thin-film chip inductor prepared by the method can reach + / -0.05%, and meanwhile, the thin-film chip inductor has a high Q value and is particularly suitable for the field with extreme requirements on performance and size.

The invention discloses a method for measuring the concentration of sodium ions in a multi-mixing nickel electroplating bath solution based on a sodium ion selective electrode, relates to a method for measuring the content of sodium in an electroplating solution, and belongs to the technical field of solution analysis. The method aims at solving the technical problems that an existing common analysis method is complex in operation and low in accuracy. The method comprises the following steps: taking a standard sodium ion solution; recording the membrane potential E; drawing a standard curve; and measuring the sample. According to the method, the sodium ion concentration can be directly read based on an electrode method, the environment condition of a solution system is set, the sodium ion electrode is used for testing, the method is convenient, stable and rapid, and the testing range and accuracy of the method can meet analysis requirements. The method is used for measuring the concentration of the sodium ions in the multi-mixing nickel electroplating bath solution.

The present application belongs to the technical field of object surface treatment, and in particular relates to a method for electroplating nickel on the surface of a hot-pressed graphite piece, which comprises the following steps: ultrasonic oil removal of the graphite piece in anhydrous ethanol; impregnation and hole sealing of the oil-removed graphite piece in a zinc-hard acid-anhydrous ethanol solution, and air drying after taking out; impregnation of the hole-sealed graphite piece in a dilute hydrochloric acid solution for activation, and water washing; electroplating of nickel in an electroplating solution after activation, and water washing after treatment is completed. The technology provided by the present application can realize uniform and rapid electroplating of nickel on the surface of a hot-pressed graphite piece without chemical activation of special chemicals, the plating layer has good adhesion with the substrate, absorption of corrosive chloride ions by the porous graphite substrate is avoided, and the technology is suitable for mass continuous production.

The present application relates to the technical field of flat vibration motor accessories, and particularly relates to an electrode tab plating process of a flat vibration motor; specific specific surface area, particle size and adding amount of silicon dioxide are used as a plating aid, and a specific step-by-step nickel plating method is used for nano-composite plating; due to the addition of porous silicon dioxide particles, more nucleation centers are provided for the deposition of cathode nickel ions, the growth of nickel grains is inhibited, and the nickel layer is more compact; meanwhile, when an external force is applied to the plating layer, the silicon dioxide particles can play a pinning role in the plating layer to prevent the sliding of dislocations and the diffusion of micro-cracks. Therefore, the hardness and wear resistance of the plating layer can be significantly improved; the above method is introduced into the process of plating nickel on the tab of the PCB of the flat vibration motor, so that the service life of the flat vibration motor is improved.

The invention discloses a SiCnw / Ni composite material as well as a preparation method and application thereof. The preparation method of the SiCnw / Ni composite material comprises the following steps: putting a substrate material into a deposition cavity of laser chemical vapor deposition equipment, vacuumizing the deposition cavity to 10Pa or below, introducing H2 and carrier gas carrying a precursor, adjusting the deposition pressure to a target value, and stabilizing the deposition pressure; and starting laser to heat the substrate material, raising the temperature of the substrate material to a deposition temperature and starting deposition, after deposition is completed, sequentially stopping introduction of the precursor and the carrier gas, closing the laser, then stopping introduction of H2, vacuumizing the reaction chamber to 20 Pa or below, taking out the substrate material after the substrate material is cooled to the room temperature, and electroplating nickel on the surface of the substrate material. The shielding effectiveness of the prepared SiCnw / Ni composite material reaches 69 dB (8-12 GHz) when the thickness is 0.39 mm, and the SiCnw / Ni composite material is good in flexibility, high in stability and wide in application prospect.