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130 results about "Electroplated nickel" patented technology

Continuous semi-gold-nickel plating process for floating connector terminal

The invention relates to the technical field of semi-gold-nickel plating and processing, in particular to a floating connector terminal continuous semi-gold-nickel plating process which comprises the following preparation steps: S1, a floating connector terminal to be electroplated is put into degreasing fluid for degreasing treatment, and then the degreased terminal is put into activating fluid for activating treatment; s2, nickel electroplating is conducted on the activated floating connector terminal through a nickel plating solution, a nickel cake serves as an anode, the pH value of the nickel plating solution is controlled to be 3.5-5.5 through weak acid in the electroplating process, the electroplating current is controlled to be 0.4-0.8 A / dm < 2 >, the temperature is controlled to be 50-60 DEG C, cleaning is conducted, and the nickel-plated floating connector terminal is obtained; and S3, the nickel-plated floating connector terminal is put into the gold plating solution to be electroplated, the electroplating temperature is 40-50 DEG C, the current density is 0.1-2 A / dm, a finished product is obtained, and the floating connector terminal can still keep high conductivity, low contact resistance, high abrasion resistance and high corrosion resistance under the complex environments of high temperature, vibration, salt mist and the like through the technology.
Owner:WANMING ELECTROPLATING INTELLIGENT TECH (DONGGUAN) CO LTD

Gradient composite graphene electrolysis electrode plate and in-situ preparation method thereof

The invention provides a gradient composite graphene electrolysis electrode plate and an in-situ preparation method thereof. The electrode plate comprises a metal conductive base material (such as titanium alloy), a porous ceramic skeleton layer (Al2O3-40% ZrO2, the porosity of which is 30 + / -5%), a chemical copper plating layer for filling pores, an electroplated nickel-ruthenium alloy catalytic layer (Ni: Ru = 9: 1) and 3-5 graphene functional layers (ID / IG is less than or equal to 0.08) grown in situ, wherein the porous ceramic skeleton layer (Al2O3-40% ZrO2) is laser-cladded on the surface of the porous ceramic skeleton layer (Al2O3-40% ZrO2). The preparation method comprises the following steps: performing laser cladding on a ceramic skeleton, wherein the power density is 300-500W / mm < 2 >, and sintering at 1600 DEG C to form metallurgical bonding; gradient plating: electroless copper plating (containing nano-diamond enhancement) and pulse electroplating of Ni Ru (duty ratio is 1: 5); and performing directional CVD growth: after reducing the catalyst layer by H2 at 1050 DEG C, introducing CH4 / H2 (the volume ratio is 1: 4) in a pulse manner, and realizing full coverage of the inner wall of the mesh by vortex air intake. The technical effects are as follows: (1) the overpotential of chlorine evolution in saturated salt water at 80 DEG C is as low as 268mV (1A / cm < 2 >); (2) strong acid environment service life gt; the time is 100 thousand hours (12 times that of the national standard); (3) the production cost is lt; and 620 / m < 2 > (90% lower than that of a traditional ruthenium-iridium coating). The problems of graphene transfer damage and special-shaped electrode covering are solved.
Owner:柯柏友

A brazing method for magnesium / aluminum dissimilar metals

The application discloses a brazing method of magnesium / aluminum dissimilar metals, which comprises the following steps: pre-electroplating nickel on a magnesium alloy base material, connecting the prepared magnesium alloy with a nickel plating layer and an aluminum alloy by using an ultrasonic-assisted brazing method, and using a brazing filler metal SAC305. The method prevents the generation of Mg-Sn intermetallic compounds (IMCs) in the process of magnesium / aluminum dissimilar metal low-temperature brazing using a Sn-based brazing filler metal. After welding, the position of the original nickel plating layer is changed into a Cu-Ni solid solution, and no large block-shaped Mg2Sn IMC is found in the brazing seam. Compared with a joint without a plating layer, the shear strength of the magnesium / aluminum dissimilar metal brazing joint based on the nickel plating layer is greatly improved, and the joint strength is strengthened by the diffusion of the nickel element into the brazing seam in the welding process. In addition, the corrosion resistance of the magnesium alloy can be improved by plating nickel on the surface of the magnesium alloy, and the service life of the magnesium / aluminum component is prolonged.
Owner:SOUTHWEST JIAOTONG UNIV

Fabrication of electroplated nickel-iron layers with titanium-copper seed layer

A layered structure includes a silicon-based substrate comprising a substrate surface; a titanium-copper seed layer arranged on the substrate surface, wherein the titanium-copper seed layer comprises a titanium layer and a copper layer, wherein the titanium layer is arranged on the substrate surface such that covalent bonds are formed between the titanium layer and silicon of the silicon-based substrate, and wherein the copper layer is arranged directly on the titanium layer, such that the titanium layer is arranged between the substrate surface and the copper layer; and a nickel-iron plating layer arranged directly on the copper layer of the titanium-copper seed layer such that the titanium-copper seed layer is arranged between the silicon-based substrate and the nickel-iron plating layer.
Owner:INFINEON TECHNOLOGIES AG

Energy-saving and efficient electroplating nickel-copper-containing wastewater treatment device

The invention discloses an energy-saving and efficient electroplating nickel-copper-containing wastewater treatment device, relates to the technical field of wastewater treatment, and aims to solve the problem that the adsorption efficiency is influenced by local loss caused by non-uniform particle size distribution of resin in a resin adsorption process. On one hand, automatic compaction of resin particles under the pressure difference is realized by the compaction moving assemblies which are arranged in the adsorption tank body and the exchange column in parallel, and the purpose of adsorbing and purifying the electroplating nickel-copper-containing wastewater and forming tight contact between the resin particles and achieving uniform particle size distribution is achieved; the resin particles can complete adsorption replacement from the whole to local concentration in the adsorption treatment process, and continuous collection and supplement of the invalid resin particles are realized; and under the combination of the two, the resin particles are automatically replaced and supplemented under the non-stop state, so that the sealing operation reliability in the electroplating nickel-copper-containing wastewater treatment process is achieved, and the adsorption efficiency is improved.
Owner:JIANGSU HAIYUE ENVIRONMENTAL ENG

A cold spray method for electroplating nickel-coated micro-sized tungsten carbide particle reinforced aluminum matrix composite coating

The present application belongs to the technical field of cold spraying of composite coating, and provides a cold spraying method for electroplating nickel-coated micro-sized tungsten carbide particle reinforced aluminum-based composite coating. First, a nickel layer is electroplated on the surface of 1-3 mu small-sized tungsten carbide particles in a constant-temperature water bath, to obtain nickel-coated tungsten carbide particles. Then, the electroplated nickel-coated tungsten carbide particles and aluminum powder are subjected to low-energy ball milling by using a ball mill, so that the electroplated nickel-coated tungsten carbide particles are uniformly distributed in the aluminum powder, to obtain a mixed powder. By using 1-3 mu micro-sized tungsten carbide particles as raw materials, compared with large-sized tungsten carbide particles, the small-sized tungsten carbide particles can obtain greater acceleration in the cold spraying process, and by plating nickel on the surface, the loss of small-sized tungsten carbide particles in the cold spraying process can be reduced, and the arc-shaped impact effect generated when reaching the surface of the substrate can be reduced, so that the small-sized tungsten carbide particles are more easily retained in the coating.
Owner:HARBIN INST OF TECH

Printed circuit board manufacturing method and printed circuit board

The invention belongs to the technical field of printed circuit boards, and discloses a printed circuit board manufacturing method and a printed circuit board, and the method comprises the steps: covering the surface of a plated circuit board with a positive dry film, and forming a circuit board with the positive dry film; wherein the positive dry film is provided with a pattern to be plated with nickel and gold, and the pattern to be plated with nickel and gold is a pattern which coincides with a pre-designed circuit pattern and is compensated and pre-enlarged; performing exposure, development and micro-etching treatment on the circuit board with the positive dry film to form a circuit board with a concave position to be plated with nickel and gold; carrying out nickel and gold electroplating treatment on the circuit board with the concave position to be plated with nickel and gold, and removing a film to obtain a circuit board with a nickel and gold plating layer; covering a negative dry film on the surface of the circuit board with the nickel-gold plating layer to form a circuit board with a negative dry film; performing exposure, development, acid etching and film stripping on the circuit board with the negative dry film to obtain a printed circuit board; according to the invention, the quality and reliability of the printed circuit board can be remarkably improved while the nickel-gold saving ratio is effectively improved.
Owner:SHENZHEN HENGBAOSHI CIRCUIT BOARD CO LTD

Electroplated nickel anode copper bar hydraulic quick breaking locking device

The utility model discloses a kind of electroplating nickel anode copper bar hydraulic pressure quick breaking locking device, it is related to power supply locking equipment technical field.The utility model includes clamp, clamp outside is equipped with clamping frame, two titanium blue copper bars are installed between clamping frame one end and clamp, and two rectifier copper bars are installed between another end and clamp, clamp one end is equipped with jack locking part, jack locking part is used to control the locking state of rectifier copper bar, titanium blue copper bar by clamp.The utility model is installed clamp between two groups of rectifier copper bar and titanium blue copper bar, clamping frame is installed outside in clamp middle part, lockable jack locking part is installed in clamp one end, the opening and closing of clamp is controlled by jack locking part, in turn, the clamping state of two groups of copper bar is controlled, artificial installation bolt is avoided, and electroplating efficiency is indirectly improved.
Owner:BEIJING XINGHE ZHONGYI ENGINEERING TECHNOLOGY CO LTD

Zirconium alloy nickel plating method based on multi-element gradient transition layer and nickel-plated zirconium alloy workpiece

PendingCN121737791ANickel alloyZirconium alloy
The invention provides a zirconium alloy nickel plating method based on a multi-element gradient transition layer and a nickel-plated zirconium alloy workpiece, and relates to the technical field of surface treatment.The method comprises the steps that the zirconium alloy workpiece is pretreated; the pretreated zirconium alloy workpiece is immersed in fused salt electroplating liquid, stepped electro-deposition and vacuum annealing treatment are conducted on the pretreated zirconium alloy workpiece, a multi-element gradient transition layer with components changing from zirconium-rich nickel alloy to nickel-rich zirconium alloy in a gradient mode is formed on the surface of the zirconium alloy workpiece, and an intermediate zirconium alloy workpiece is generated; and the intermediate zirconium alloy workpiece is subjected to activating treatment, the intermediate zirconium alloy workpiece subjected to activating treatment is placed in an electroplating nickel solution to be subjected to electroplating nickel treatment, and the nickel plating layer is obtained. The bonding performance of the surface nickel plating layer is improved.
Owner:XIAN SURFACE MATERIAL PROTECTION CO LTD +1

Swing tank device for nickel electroplating process

Rolling guide supporting devices are arranged on the outer walls of the periphery of the upper end of a nickel plating tank, the upper ends of the rolling guide supporting devices are fixedly connected with the bottom edge of the corresponding side of a swinging frame, and supporting bases are fixed to the middles of the upper end faces of the two wide sides of the swinging frame. The end part of the hanging rod for hanging the electroplated workpiece is matched with the supporting seat at the corresponding end; a swing driving device is arranged on one wide edge side of the nickel plating tank, an action part of the swing driving device is connected with the corresponding side of the swing frame, and the swing driving device drives the swing frame and the electroplated workpieces on the swing frame to swing in a reciprocating mode in the length direction, the width direction and the height direction of the nickel plating tank under supporting of the rolling guide supporting device. According to the invention, the multi-direction swinging motion of the swinging frame is realized to optimize the flowing state of the plating solution, the purposes of efficient separation of bubbles on electroplated workpieces and uniform deposition of plating layers are achieved, the workpiece loading flexibility and the production efficiency are improved, and the defects of non-uniform permeation of the plating solution and residual bubbles in the nickel electroplating process are overcome.
Owner:SHAANXI BAOCHENG AVIATION INSTR

A nickel-plated steel sheet with excellent corrosion resistance for battery casing and its manufacturing method.

This invention relates to a nickel-plated steel sheet with excellent corrosion resistance for battery casings and a method for manufacturing the same. In one specific embodiment, the nickel-plated steel sheet comprises: a base steel sheet; a nickel plating layer formed on at least one surface of the base steel sheet; and a nickel-iron diffusion layer formed between the base steel sheet and the nickel plating layer. The nickel plating layer and the nickel-iron (Ni-Fe) diffusion layer are formed by heat treatment after forming an electroplated nickel layer on the base steel sheet and a chemically plated nickel layer on at least a portion of the surface of the electroplated nickel layer. The nickel plating layer contains one or more vacancy elements selected from phosphorus (P), boron (B), tungsten (W), cobalt (Co), molybdenum (Mo), and copper (Cu) on its surface.
Owner:TCC STEEL

Bendable nickel plating on flexible substrates

A method of producing a flexible nickel phosphorus coating on a substrate. The substrate includes a dielectric material having a copper layer thereon. The method comprises the steps of: (1) activating the substrate with a palladium activation solution to catalyze the substrate, and 2) contacting the activated substrate with an electroless nickel phosphorus plating bath comprising: (i) a source of nickel ions; (ii) a hypophosphite ion source; (iii) at least one metal complexing agent; and (iv) an organic flexible additive. The nickel-phosphorus plating layer deposited on the substrate shows a columnar grain structure.
Owner:MACDERMID ENTHONE INC

Environment-friendly treatment process for waste liquid containing nickel and zinc

The invention discloses a nickel-zinc-containing waste liquid environment-friendly treatment process, which belongs to the technical field of electroplating waste liquid treatment, and comprises the following steps: collecting electroplating nickel-zinc-containing waste liquid, and adjusting the pH value to 6-9 to obtain pretreated nickel-zinc-containing waste liquid; adding modified charcoal and a hydrogen peroxide solution into the pretreated nickel-zinc-containing waste liquid, and stirring to react for 1-2 hours under the irradiation of an ultraviolet lamp, so as to obtain an oxidized nickel-zinc-containing waste liquid after the reaction is finished; the oxidized waste liquid containing nickel and zinc is introduced into a reduction pool, an unreacted hydrogen peroxide solution is reduced, a precipitator is added, stirring is conducted for 10-20 min, then a flocculant is added, stirring is conducted for 30-60 min, standing is conducted for 2 h, solid-liquid separation is conducted, solid sludge and filtrate are obtained, and the filtrate is to-be-discharged water; according to the invention, the modified biochar realizes synergistic interaction through an activation-complex breaking-capture mechanism; the multi-stage collaborative strategy effectively solves the problem of poor treatment effect of the nickel-zinc-containing waste liquid in the traditional Fenton process, and an innovative solution is provided for treatment of the nickel-zinc-containing waste liquid.
Owner:GUANGDONG FOOD & DRUG VOCATIONAL COLLEGE

Metal electronickelling drying equipment

The utility model discloses metal electronickelling drying equipment which comprises a drying box body used for metal electronickelling, an inlet and an outlet are formed in the two sides of the drying box body respectively, a conveying assembly is installed in the drying box body, and a console is installed on one side of the drying box body. An air inlet is formed in the top of the drying box body, a fan is installed on the air inlet, the bottom of the air inlet is connected with an air channel assembly, the tail of the air channel assembly is connected with a heat exchanger, and turbulent flow fans are installed on the upper side and the lower side of an inlet in one side of the drying box body. According to the utility model, the air duct assembly adopts the spiral air duct, so that hot air can be uniformly blown to a metal electroplated part on the conveying assembly from multiple directions, and each part of the electroplated part can be fully and uniformly dried; the turbulent flow fan can enable the hot air entering the drying box body to generate turbulent flow, so that the convective heat exchange effect between the hot air and the surface of the plated part is further enhanced; the heat exchanger can recycle waste heat of hot air exhausted in the drying process.
Owner:镇江特安锂新能源有限公司

Nickel plated steel sheet for battery case having excellent surface corrosion resistance and method for manufacturing

The present disclosure relates to a nickel plated steel sheet for a battery case having excellent corrosion resistance and a method for manufacturing the same. In one embodiment, the nickel plated steel sheet comprises: a base steel sheet; a nickel plating layer formed on one or more surfaces of the base steel sheet; and a nickel-iron (Ni—Fe) diffusion layer formed between the base steel sheet and the nickel plating layer; wherein the nickel plating layer and the nickel-iron (Ni—Fe) diffusion layer are formed by forming an electro-nickel plating layer on the base steel sheet and an electroless nickel plating layer on at least a portion of the surface of the electro-nickel plating layer, followed by heat treatment, and the nickel plating layer includes one or more co-deposited elements selected from phosphorus (P), boron (B), tungsten (W), cobalt (Co), molybdenum (Mo), and copper (Cu) on its surface.
Owner:TCC STEEL

Preparation method of mould-corrosion-resistant ABS electromagnetic protective coating in humid environment

The invention relates to a preparation method of a mould-corrosion-resistant ABS electromagnetic protective coating in a humid environment. The preparation method is characterized by comprising the following steps: pretreatment of an ABS matrix, preparation of an electromagnetic shielding layer, preparation of a mould-corrosion-resistant layer and preparation of a hydrophobic layer. In the ABS substrate pretreatment, a diamond free abrasive mechanical polishing method is adopted to remove an oxide layer not exceeding 10 microns on the surface, in the electromagnetic shielding layer preparation, a compact Cu-plated layer is reduced on the surface of the substrate by using an Ag nanoparticle-doped chemical copper plating process, and in the mold corrosion resistant layer preparation, a compact Ni-plated layer is prepared by using a nickel electroplating process on the surface of the electromagnetic shielding layer. And the hydrophobic layer is prepared by injecting a graphene oxide-doped polyurethane layer on the surface of the mould corrosion resistant layer through an injection molding process. According to the invention, 80-100 dB attenuation of broadband (1-18 GHz) electromagnetic waves is realized through the 10-13 [mu] m ultrathin composite coating, the growth of aspergillus niger, aspergillus flavus and other moulds can be inhibited, and the application prospect is wide.
Owner:NANJING UNIV OF AERONAUTICS & ASTRONAUTICS

Looped vertical lift continuous electroplating nickel-gold wire

This utility model relates to a circular vertical lifting continuous electroplating nickel-gold wire, comprising several clamps for holding PCB boards, a symmetrically arranged rotating mechanism one and a rotating mechanism two, with vertically lifting electroplating tweezers and vertically lifting electroplating gold wires arranged facing each other between rotating mechanism one and rotating mechanism two. The clamps move cyclically along the vertically lifting electroplating tweezers, rotating mechanism two, vertically lifting electroplating gold wires, and rotating mechanism one in a circular trajectory. The advantages are: the cyclic movement of the clamps along the circular trajectory ensures a consistent electroplating path for each OCB board, avoiding differences in electroplating paths affecting electroplating quality; the cyclic movement of the clamps reduces the need for transfer equipment and channels, reducing the footprint of the electroplating equipment; and the vertical lifting method allows the PCB board to be directly inserted into the lower gold bath, eliminating the need for the upper gold bath in traditional vertical continuous electroplating lines, reducing the volume of the gold bath and the initial one-time investment cost for the enterprise.
Owner:YONGTIAN MASCH EQUIP MFG SHENZHEN CO LTD

GNat-Ti / NiO-x00 anode electro-catalytic material and preparation method thereof

The invention discloses a GN (at) Ti / NiO-x00 anode electro-catalytic material and a preparation method of the GN (at) Ti / NiO-x00 anode electro-catalytic material. The method comprises the following steps: electroplating nickel on the surface of a titanium substrate to form a nickel intermediate layer, annealing to change the surface crystal form structure and refine intermediate layer grains, and carrying out high temperature and hydrogen catalytic reduction on acetylene gas on the surface of the nickel intermediate layer of the titanium substrate to form a graphene active layer on the surface through chemical vapor deposition. The nickel-plated graphene doped titanium substrate non-noble metal electrode, namely the GNatTi / NiO-x00 anode electro-catalytic material, is obtained. The titanium-based electrode plate is subjected to nickel plating and loaded with the graphene layer, so that active sites on the surface of the electrode are increased, the electrocatalytic activity is improved, peeling of the coating is reduced, the efficiency of degrading complex coking wastewater is greatly improved, the electrode has high economic benefits, and compared with a traditional commercial precious metal electrode, the electrode has the advantages that the cost is low, and the application range is wide. The material is a novel composite electrode material with excellent electrochemical performance.
Owner:ZHENGZHOU UNIV

Method for realizing selective electroplating of ceramic copper-clad substrate

PendingCN120603151ALithography/patterningMaterials scienceCopper substrate
The invention discloses a method for realizing selective electroplating of a ceramic copper-clad substrate. The method comprises the following steps of: masking and electroplating for the first time: coating a photosensitive film, aligning and exposing through a positioning hole, developing to form an electroplating window, electroplating nickel and gold, and removing the film by using an alkaline solution; secondary masking and etching a secondary coating photosensitive film; reusing a positioning hole for alignment exposure; developing and covering a gold plating area and exposing a to-be-etched copper layer; etching the copper layer; by adopting the double-mask collaborative mechanism, the first mask focuses on electroplating pattern transfer and the second mask side re-etching protection, so that batch production can be realized, the production speed is high, and a complicated process of ink printing is not needed.
Owner:JIANGSU TOBO OPTOELECTRONICS TECH CO LTD

Method for electroplating soft gold on a circuit board and circuit board

This invention discloses a method for electroplating soft gold onto a circuit board, and also discloses the circuit board. The method includes the following steps: S1: Obtaining a circuit board with a copper layer on its surface; S2: Electroplating a nickel layer on the surface of the copper layer, wherein the surface of the nickel layer has gold bonding lines and non-gold bonding lines; S3: Forming multiple arrayed and spaced bump structures in the gold bonding lines, each bump structure including a nickel substrate and a gold surface layer disposed on the surface of the nickel substrate; S4: Electroplating the circuit board with gold to form a first gold layer on the gold bonding lines and a second gold layer on the non-gold bonding lines, wherein the thickness of the first gold layer is greater than the thickness of the second gold layer. In this way, selective thickening of the gold bonding lines is achieved during the gold plating process, ensuring that the gold bonding lines have a sufficiently thick gold layer to guarantee the reliability of the gold bonding lines, while the non-gold bonding lines maintain a relatively thin gold layer, which can reduce the amount of gold used and lower the production cost of the circuit board.
Owner:KALEX MULTI LAYER CIRCUIT BOARD (ZHONGSHAN) CO LTD

Efficient tungsten filament drawing process and electric drawing and gas annealing eleven-mold all-in-one machine

The invention discloses an efficient tungsten filament drawing process and an electric drawing and gas annealing eleven-die all-in-one machine, and the efficient tungsten filament drawing process comprises the following steps: hot drawing: heating a tungsten lanthanum alloy with the wire diameter of 0.360-0.390 mm to 800-840 DEG C, and drawing the tungsten lanthanum alloy through a die at the area reduction rate of 16%-22% to obtain a tungsten filament with the wire diameter of 0.150-0.170 mm; annealing and stretching: annealing the tungsten filament subjected to hot stretching at the temperature of 1450-1500 DEG C, and then stretching the tungsten filament to 0.125-0.135 mm through a mold; the wires obtained in the annealing and stretching steps are subjected to electrolytic alkali washing to obtain white wires with the diameter ranging from 0.118 mm to 0.122 mm; electroplating: electroplating a nickel-zinc-copper alloy layer on the wire material subjected to alkali washing until the thickness is 0.124-0.126 mm; and cold drawing is conducted, specifically, the electroplated wire is subjected to multi-pass cold drawing at the room temperature through a mold with the area reduction rate of 12%-18%, the wire is drawn to the target wire diameter, and the target wire diameter is smaller than 28 micrometers. According to the method, the tungsten filament is subjected to structure reconstruction when the diameter of the tungsten filament is large, the machining rate of a follow-up cold drawing section is increased, and the strength of a final finished product can reach 6909 MPa and is far higher than that of a traditional process.
Owner:GANZHOU SUNNY NON-FERROUS METALS CO LTD

Nickel-coated graphite powder, additive, electroplating solution and electroplating process thereof

The application discloses a kind of nickel-coated graphite powder, additive, electroplating solution and its electroplating process, the additive is particulate matter electroplating nano nickel additive, with complexing agent, current dispersing agent, low potential deposition accelerator and lubricant, the mass ratio of its complexing agent, current dispersing agent, low potential deposition accelerator is 40~100:10:1, in the proportion, electroplating can form a large number of microcrystalline nucleus, but its growth is inhibited, so as to obtain crystalline meticulous nano nickel electroplating layer.The electroplating solution has the additive, and the process parameters are stable during plating process, and the nickel-coated graphite after plating has the advantages of easy water washing, low surface resistance, aging resistance and the like.The electroplating process first uses chemical plating to plate a layer of nickel on the surface of graphite, completely covers the surface of particles, and then electroplates a layer of electroplated nickel on the chemical nickel to obtain nickel-coated graphite powder, which has better surface conductivity, good adhesion, good dispersibility, uniform plating layer and excellent performance as conductive filler.
Owner:YAAN BESTRY PERFORMANCE MATERIALS CORP +2

High grade surface flash nickel plated cold rolled sheet and method of production thereof

The present application relates to a kind of high-grade surface flash nickel-plated cold-rolled plate and its production method, when flash nickel-plated, control the following process: 1) the upper surface and the lower surface of the strip steel are simultaneously sprayed with plating solution, and nickel is electroplated;2) the liquid supply flow is adjusted according to the set nickel plating layer thickness;3) the process temperature of plating solution is 50-60 ℃ when flash nickel-plated, heating heat exchanger is used to heat the plating solution when the flash nickel-plated unit starts, and the plating solution is cooled by cooling heat exchanger when the flash nickel-plated unit works normally;4) the plating solution is recycled, and a pre-coated backwash filter device is used to filter the plating solution.The present application is based on the formation mechanism of flash nickel-plated layer, and the main technical means is to improve the uniformity of plating solution distribution and the cleanliness of filtered plating solution, to realize the stable control of the surface quality of high surface grade flash nickel-plated cold-rolled plate, to improve the production efficiency of high surface grade flash nickel-plated cold-rolled plate, to improve the product competitiveness, and to meet the growing market demand, which has great significance.
Owner:ANGANG STEEL CO LTD

Gas cylinder for filling high-pressure oxygen and manufacturing method thereof

The invention belongs to the technical field of diffusion welding and thin-wall seamless steel pipe bulging, and relates to a gas cylinder for filling high-pressure oxygen and a manufacturing method thereof, the gas cylinder comprises a thin-wall seamless steel pipe liner, a gas cylinder joint, a Teflon lining coating, a high-molecular polymer layer, a carbon fiber reinforced winding layer and an external protection layer, the bottle body is formed through multiple times of water pressure bulging, and cracks and wrinkles caused by spinning are avoided; electroplating a nickel-iron-PTFE composite layer on the inner surface, and spraying and sintering PTFE to form an antioxidant lining; the outer surface is fully wound with a carbon fiber main bearing structure after being subjected to injection molding of a polyethylene layer, and then is coated with a glass fiber and epoxy resin protective layer. A traditional spinning process is abandoned, forming is uniform, defects are avoided, the connector strength is high, the sealing performance is good, the light weight level, the fatigue life and the use safety of the gas cylinder are remarkably improved, and the gas cylinder is suitable for medical, aviation and other high-purity high-pressure oxygen storage scenes.
Owner:LUOYANG SUNRUI SPECIAL EQUIP

A diamond / aluminum composite material surface treatment process

The present application belongs to the technical field of surface treatment, and in particular to a surface treatment process for diamond / aluminum composite material. The present application comprises the following steps: degreasing, drying, sand blasting, degreasing, pickling, sensitization, activation, electroless nickel plating, low-temperature annealing, degreasing, pickling, impact nickel plating, electroplating nickel, pre-plating gold, electroplating gold, and low-temperature annealing. The present application reduces the stress between the surface of the composite material and the plating layer through a stepwise heating mode, thereby improving the bonding force and meeting the welding technical requirements of the diamond / aluminum composite material.
Owner:HEFEI SHENGDA ELECTRONIC TECH IND CO LTD

High-grade surface flash nickel plating cold-rolled sheet and production method thereof

The invention relates to a high-grade surface flash nickel-plated cold-rolled sheet and a production method thereof. The flash nickel-plating process comprises the following steps: 1) electroplating nickel in a manner of spraying a plating solution on the upper surface and the lower surface of strip steel at the same time; (2) the liquid supply flow is adjusted according to the set nickel plating layer thickness; (3) the process temperature of the plating solution during nickel flash plating is 50-60 DEG C, a heating heat exchanger is adopted to heat the plating solution when the nickel flash plating unit is started, and a cooling heat exchanger is adopted to cool the plating solution when the nickel flash plating unit normally works; and (4) recycling the plating solution, and filtering the plating solution by adopting a pre-coating type backwashing filtering device. Based on the forming mechanism of the flash nickel plating layer, the stable control of the surface quality of the high-surface-grade flash nickel plating cold-rolled sheet is realized by taking the improvement of the distribution uniformity of the plating solution and the improvement of the cleanliness of the plating solution after filtration as main technical means, and the method has great significance in improving the production efficiency of the high-surface-grade flash nickel plating cold-rolled sheet and improving the product competitiveness. And the method has great significance in meeting the ever-increasing market demand.
Owner:ANGANG STEEL CO LTD

Ceramic coating marine cable connector and preparation method thereof

The invention discloses a ceramic coating marine cable connector, which comprises a connector shell, a conductive pin and an end cover, a composite protective coating system is arranged on the outer surface of the connector shell and the matching surface of the end cover, and a metal protective coating is arranged on the contact surface of the conductive pin. According to the ceramic coating marine cable connector and the preparation method thereof, the problem of galvanic corrosion of dissimilar metal is effectively solved through micro-arc oxidation / electronickelling differentiation bottom layer treatment, physical barrier and intelligent response cooperative protection is achieved through the graphene composite middle layer, a complete protection system is formed in combination with the super-hydrophobic top layer, and the corrosion resistance of the connector is improved. And finally, while the bonding strength of the coating is ensured, the corrosion-resistant life and maintainability of the connector in a marine environment are remarkably improved.
Owner:XIAMEN DINGXIN TECH CO LTD

Electroplating nickel-chromium wastewater treatment device

The invention relates to the technical field of wastewater treatment, in particular to an electroplating nickel-chromium wastewater treatment device which comprises a sewage tank, a water suction pump is fixedly connected to the upper surface of the inner wall of the bottom of the sewage tank, one end of the water suction pump is fixedly connected with a door-shaped pipeline, and the other end of the door-shaped pipeline extends into a flocculation tank. Four square columns are fixedly connected to the four corners of the lower surface of the flocculation tank, stirring assemblies are fixedly connected to the upper surfaces of the tank walls of the two sides of the flocculation tank, and one end of the bottom of each stirring assembly is connected with an anti-condensation assembly in a meshed mode. According to the nickel-chromium electroplating wastewater treatment device, the water pump is matched with the flocculation basin, the sedimentation basin and the filter press, metal impurities such as nickel and chromium contained in wastewater are sequentially neutralized, stripped and filtered, the site requirement of the wastewater treatment device can be reduced through flow matching, and the production requirements of many related industries such as chemical engineering, metal or sewage processing plants are met; operation is convenient, and efficiency is high.
Owner:JIAXING JINYING NEW MATERIAL CO LTD

Processing method for low-cost multi-stage signal finger of 1.6 T optical module

The invention relates to a processing method of a low-cost multi-stage signal finger of a 1.6 T optical module, which comprises the following steps of: pressing an anti-gold-plating dry film on an electroplated circuit board, exposing by adopting an LDI exposure machine, and only windowing a finger contact to be gold-plated; electroplating nickel and gold on the finger contact of the windowing; removing the gold-plated dry film; pasting a film on the gold-plated finger; carrying out etching processing on the exposed circuit board, and processing an outer-layer circuit and a grading finger; carrying out AOI full-automatic optical detection on the etched circuit board, and carrying out solder mask processing; performing film pressing and exposure on the finger contact in the gold plating area; plating a layer of nickel-palladium-gold on the non-gold-plated finger and the side edge area, completing the film removing treatment, then carrying out AOI scanning detection on the circuit board, and finally carrying out the post-processing treatment. According to the processing method, a mixed surface treatment process is adopted for the multi-stage plugging contact, so that the plating area of electroplated hard gold can be reduced by about 40%, and the gold plating cost is greatly reduced.
Owner:APCB ELECTRONIC (KUNSHAN) CO LTD

Stainless steel oxygen-free copper inlaid T / R shell and preparation method thereof

The invention discloses a stainless steel oxygen-free copper embedded T / R shell and a preparation method thereof. The shell comprises a 316L stainless steel shell body, a TU1 oxygen-free copper substrate, a radio frequency connector, a stress gradient slow release ring and a low-frequency connector. The preparation method comprises the following steps: cleaning and annealing each component; the weldability is enhanced by pre-plating nickel; the shell, the substrate and the stress slow release ring are assembled through silver-copper brazing; after nickel / gold electroplating, a plating layer on the sealing and welding surface is removed through laser; and installing the radio frequency / low frequency connector to the kovar ring through gold-tin brazing. Through gradient material design and a step-by-step brazing process, the problem of sealing failure caused by thermal expansion coefficient mismatch is solved, and the high-power heat dissipation performance and the airtight reliability are remarkably improved.
Owner:NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD