Preparation method of composite diamond fretsaw

A diamond wire saw, diamond technology, applied in the direction of stone processing equipment, manufacturing tools, fine working devices, etc., can solve the difficulty in meeting the comprehensive performance requirements of sharpening and wear resistance, damage resistance, reduced service life of diamond wire, diamond distribution Unevenness and other problems, to achieve good sharpening performance, large holding capacity, and good wear resistance

Inactive Publication Date: 2010-09-22
CHANGSHA DIAT NEW MATERIAL SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the main problem of diamond wire saw is that diamond particles are used in the preparation. Since diamond is a non-conductor, the process of sanding the electroplated nickel substrate is completed by the adsorption of diamond particles by steel wire, and the distribution of diamond is not uniform. At the same time, the diamond is electroplated. Severe agglomeration occurs, resulting in uneven wire size; diamond agglomeration will cause diamonds to be difficult to sharpen during the cutting process, resulting in low cutting e...

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  • Preparation method of composite diamond fretsaw

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Experimental program
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Effect test

Embodiment 1

[0024] The first step: raw material preparation

[0025] Get particle size and be 5~15 μ m primary diamond micropowder and broken diamond micropowder, be by mass percentage: primary diamond: broken diamond=30%: 70% ratio is uniformly mixed, obtains mixed diamond micropowder; Get atomic ratio and be: W:Mo=1 : 1, the mixed powder of tungsten oxide powder and molybdenum oxide powder with a particle size of 45~65 μm is uniformly mixed in the ratio of mixed powder: mixed diamond micropowder=7:1 by mass ratio;

[0026] The second step: surface metallization of diamond powder

[0027] Heat the product obtained in the first step to 670 ° C ~ 700 ° C, and pass through water hydrogen; water will react with tungsten oxide powder and molybdenum oxide powder to form volatile hydrated hydroxide, and then be reduced by hydrogen to W and Mo metals Atoms are co-deposited on the surface of diamond powder, and at the same time, react with the surface of diamond powder particles to form a compos...

Embodiment 2

[0031] The first step: raw material preparation

[0032] Get particle size and be 20~30 μ m raw diamond powder and crushed diamond powder, by mass percentage be: raw diamond: the ratio of broken diamond=50%:50% mixes evenly, obtains mixed diamond powder; Get atomic ratio and be: W:Mo=1 : 1, particle size is the mixed powder of tungsten oxide powder and molybdenum oxide powder of 70~90 μm, by mass ratio is: mixed powder: the ratio of mixed diamond micropowder=5: 1 mixes evenly;

[0033] The second step: surface metallization of diamond powder

[0034] Heat the product obtained in the first step to 770 ° C ~ 800 ° C, and pass through water hydrogen; water will react with tungsten oxide powder and molybdenum oxide powder to form volatile hydrated hydroxide, and then be reduced by hydrogen to W and Mo metals Atoms are co-deposited on the surface of diamond powder, and at the same time, react with the surface of diamond powder particles to form a composite tungsten-molybdenum carb...

Embodiment 3

[0038] The first step: raw material preparation

[0039] Get particle size and be 35~45 μ m raw diamond powder and crushed diamond powder, by mass percentage be: raw diamond: broken diamond=70%: the ratio of 30% mixes evenly, obtains mixed diamond powder; Get atomic ratio and be: W: Mo=1 : 1, particle size is the mixed powder of tungsten oxide powder and molybdenum oxide powder of 100~120m, is by mass ratio: mixed powder: the ratio of mixed diamond micropowder=4: 1 mixes evenly;

[0040] The second step: surface metallization of diamond powder

[0041] Heat the product obtained in the first step to 870°C to 900°C, and pass through water hydrogen; water will react with tungsten oxide powder and molybdenum oxide powder to form volatile hydrated hydroxide, and then be reduced to W and Mo metals by hydrogen Atoms are co-deposited on the surface of diamond powder, and at the same time, react with the surface of diamond powder particles to form a composite tungsten-molybdenum carbi...

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Abstract

The invention relates to a preparation method of a composite diamond fretsaw, which comprises the following steps: 1, taking protogenetic diamond micro powder with the granularity of 5-45 Mu m and crushed diamond micro powder, mixing uniformly according to the proportion to obtain mixed diamond micro powder; taking the mixed powder of tungstic oxide powder and molybdenum powder as well as the mixed diamond micro powder, and mixing uniformly according to the proportion; 2, heating the product generated in step 1 and leading in rinsed hydrogen to form a diamond micro powder matrix / tungsten-molybdenum carbide interface / surface-metallized mixed diamond micro powder of tungsten-molybdenum alloy; and 3, taking electronickelling watt solution added with the surface-metallized mixed diamond micro powder as the electroplate liquid and taking a steel wire rope as a cathode to carry out the composite plating of metallized diamond and matrix nickel on the surface of the steel wire rope so as to obtain the composite diamond fretsaw of the invention. The invention has the advantages of simple process and easy operation, the prepared product has good edging performance, excellent wear-resisting compressive property, high processing speed and long service life, the utilization rate of the diamond fretsaw is high, the section flatness and the glossiness are high, the method is suitable for industrial production, and the prepared product is particularly suitable for the cutting processing with high efficiency, high quality and high cost performance on gems and other high-value materials.

Description

technical field [0001] The invention relates to a method for preparing a diamond wire saw, in particular to a method for preparing a composite diamond wire saw by using mixed electroplating of raw diamond and broken diamond after surface metallization treatment. The invention belongs to the technical field of surface deposition metal and surface electrochemical plating. Background technique [0002] Sapphire is a typical hard and brittle material with high hardness (Mohs hardness up to 9.2), high brittleness, high wear resistance, high corrosion resistance, high oxidation resistance, high resistivity, high temperature resistance, non-magnetic conductivity, etc. performance. LED (Light Emitting Diode) has been used in display screens, street lighting, etc. due to its excellent properties such as high brightness, low operating voltage, low power consumption, miniaturization, long life, impact resistance and stable performance, and is considered to have a wide range of applica...

Claims

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Application Information

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IPC IPC(8): C25D15/02B28D5/04
Inventor 贺跃辉段志明周永刘纯辉熊佳海杨辉煌匡怡新
Owner CHANGSHA DIAT NEW MATERIAL SCI & TECH
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