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Manufacturing method for PCB golden finger

A production method and gold finger technology, which are applied in the direction of the formation of electrical connection of printing elements, can solve problems such as the inapplicability of the gold finger production process, and achieve the effect of preventing the gold finger gap and the side bulge of the gold finger.

Inactive Publication Date: 2015-09-16
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Although the third solution mentioned above can effectively improve the gap problem at the top of the gold finger after the corresponding type of gold finger plating lead is etched, it is not suitable for the production process of all types of gold fingers

Method used

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  • Manufacturing method for PCB golden finger
  • Manufacturing method for PCB golden finger
  • Manufacturing method for PCB golden finger

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0020] PCB parameter requirements

[0021] Inner core board:

[0022] 0.075mm 1 / 0.5OZ (without copper) (2 pieces);

[0023] 0.15mm 0.5 / 0.5OZ (without copper) (2 sheets);

[0024] 0.076mm 0.5 / 0.5OZ (without copper) (2 sheets);

[0025] Number of layers: 14 layers;

[0026] Inner line width / spacing: 0.089mm / 0.096mm, 0.096 / 0.096mm;

[0027] Outer layer line width / line spacing: 0.103 / 0.095mm (finished copper thickness 1.0OZ);

[0028] Sheet Tg: ≥170°;

[0029] Outer copper foil: 1 / 3OZ;

[0030] Hole copper thickness: 20μm(min) / 25μm(ave);

[0031] Surface treatment: immersion gold + electric gold fingers;

[0032] Finished board thickness: 1.6mm±10%;

[0033] Minimum drill bit: 0.25mm;

[0034] Drilling thickness to diameter ratio: 6.4:1;

[0035] Production PNL size: 518mm×620mm.

[0036] The above-mentioned PCB manufacturing process including the golden finger manufacturing method of the present invention

[0037] 1. Cutting - According to the number of core boards w...

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Abstract

The invention discloses a manufacturing method for PCB golden fingers, which belongs to the technical field of circuit board production and manufacturing. The manufacturing method comprises the steps of: S1, manufacturing copper base bodies in a golden finger region and electroplated lead wires connecting the adjacent copper base bodies, wherein each electroplated lead wire is arranged between the adjacent copper base bodies; S2, screen-printing antistatic gold ink for covering and protecting the electroplated lead wires, wherein the coverage area of the antistatic gold ink is 0.15 to 0.2mm greater than one-sided width of each electroplated lead wire and spaced from each copper base body at a distance ranging from 0.07 to 0.1mm; S3, electroplating nickel-gold on the copper base bodies in the golden finger region; S4, and removing the antistatic gold ink coating the electroplated lead wires, and etching the electroplated lead wires away. The manufacturing method for the PCB golden fingers can effectively avoid the occurrence of problems of golden finger notches and projections on side surfaces of the golden fingers during the manufacturing process of the golden fingers by adding the electroplated lead wires to the side surfaces of the copper base bodies of the golden fingers and setting a pre-enlarging value of the screen-printed antistatic gold ink.

Description

technical field [0001] The invention belongs to the technical field of circuit board production and manufacturing, and in particular relates to a method for manufacturing a PCB golden finger. Background technique [0002] The gold finger is the conductive contact piece of the electronic product hardware such as the contact terminal for signal transmission between the memory stick and the memory slot, the graphics card and the graphics card slot, etc. It is composed of many golden conductive contacts. They are arranged like fingers, so they are called "golden fingers". Because gold has strong oxidation resistance and strong conductivity, the gold finger is actually processed by coating a layer of gold on the copper clad laminate through a special process. [0003] For some printed circuit boards with buttons or plug-in requirements, some gold fingers need to be made. Existing gold fingers mainly include long and short gold fingers and disconnected gold fingers. Different go...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/40
CPCH05K3/40
Inventor 翟青霞彭君李金龙赵波周文涛
Owner SHENZHEN SUNTAK MULTILAYER PCB
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