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Nickel plating method for silicon-aluminum alloy

A silicon aluminum alloy and nickel electroplating technology, which is applied in the field of silicon aluminum alloy nickel plating, can solve the problems of not being easy to bubble and delamination

Active Publication Date: 2012-07-11
CHINA ZHENHUA GRP YONGGUANG ELECTRONICS CO LTD STATE OWNED NO 873 FACTORY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to overcome the defects that the existing method of electroplating nickel on silicon-aluminum alloy cannot form a firm nickel layer on the silicon-aluminum alloy substrate, and is extremely easy to bubble and delaminate, and to provide a silicon-aluminum alloy electroplating Nickel method, the formed nickel coating does not cause blistering and delamination at a high temperature of 330 ° C, and the qualified rate of electroplating is as high as 98%

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0011] Embodiment 1: The process flow of the electroplating nickel method of the present invention: conventional degreasing of silicon-aluminum alloy parts → conventional alkali corrosion → conventional acid corrosion → activation → chemical nickel immersion treatment → electroplating pretreatment → conventional electroplating nickel → conventional dehydration → baking temperature treatment → cooling .

[0012] (1) Activation: Use deionized water to prepare a hydrofluoric acid solution with a volume ratio concentration of 5% as the activation solution. After the silicon-aluminum alloy parts are corroded by conventional acid, rinse them with tap water three times, and immediately place them in the activation solution at room temperature. Process for 2 minutes, and shake the plated parts continuously during the process;

[0013] (2) Chemical nickel immersion treatment: prepare a chemical nickel immersion solution containing 500g / l of nickel chloride, 40g / l of boric acid, and 10m...

Embodiment 2

[0017] Embodiment 2: The process flow of the electroplating nickel method of the present invention: conventional degreasing of silicon-aluminum alloy parts → conventional alkali corrosion → conventional acid corrosion → activation → chemical nickel immersion treatment → electroplating pretreatment → conventional electroplating nickel → conventional dehydration → baking temperature treatment → cooling .

[0018] (1) Activation: Use deionized water to prepare a hydrofluoric acid solution with a volume ratio concentration of 1% as the activation solution. After the silicon-aluminum alloy parts are corroded by conventional acid, rinse them with tap water three times, and immediately place them in the activation solution at room temperature. Process for 3 minutes, and shake the plated parts continuously during the process;

[0019] (2) Chemical nickel immersion treatment: prepare a chemical nickel immersion solution containing 300g / l of nickel chloride, 30g / l of boric acid, and 20m...

Embodiment 3

[0023] Embodiment 3: The process flow of the electroplating nickel method of the present invention: conventional degreasing of silicon-aluminum alloy parts → conventional alkali corrosion → conventional acid corrosion → activation → chemical immersion nickel treatment → electroplating pretreatment → conventional electroplating nickel → conventional dehydration → baking temperature treatment → cooling .

[0024] (1) Activation: Use deionized water to prepare a hydrofluoric acid solution with a volume ratio concentration of 8% as the activation solution. After the silicon-aluminum alloy parts are corroded by conventional acid, rinse them with tap water three times, and immediately place them in the activation solution at room temperature. Under processing for 10s, the plated parts were shaken continuously during the processing;

[0025] (2) Chemical nickel immersion treatment: prepare a chemical nickel immersion solution containing 700g / l of nickel chloride, 45g / l of boric acid,...

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Abstract

The invention discloses a nickel plating method for a silicon-aluminum alloy, and the method comprises the following steps: washing silicon-aluminum alloy parts with alkali and acid; then putting the silicon-aluminum alloy parts in a hydrofluoric acid solution so as to be activated; putting the activated silicon-aluminum alloy parts into a chemical nickel leaching solution so as to be processed; and finally electroplating nickel, dewatering and drying the processed silicon-aluminum alloy parts to form a firm nickel plating layer, wherein the chemical nickel leaching solution comprises 300-700 g / L of nickel chloride, 30-45 g / L of boric acid and 5-20 ml / L of hydrofluoric acid. The nickel plating layer can not foam or fall off at the high temperature of 33 DEG C, and the percent of pass of nickel electroplating is more than 98%, so the technical requirements of electroplating nickel on the silicon-aluminum alloy can be fully met.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a method for electroplating nickel on a silicon-aluminum alloy. Background technique [0002] Electroplating nickel on the surface of aluminum alloy is much more difficult than electroplating nickel on other metals. The main reason is that the bonding force between the aluminum alloy substrate and the nickel coating is poor, and it is easy to blister and delaminate. In the traditional nickel electroplating process, the bonding force between the silicon-aluminum alloy substrate and the nickel plating layer is often weak. During high-temperature brazing, the plating layer is prone to blistering and even delamination. There are five main reasons for this: 1) Aluminum It has a strong affinity with oxygen, and there is always an oxide film on the surface; 2) Aluminum is an amphoteric metal, and there is no electrolyte suitable for direct electroplating; 3) Aluminum is very acti...

Claims

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Application Information

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IPC IPC(8): C25D5/30C25D5/44
Inventor 向兴海刘宗永彭松龙俊
Owner CHINA ZHENHUA GRP YONGGUANG ELECTRONICS CO LTD STATE OWNED NO 873 FACTORY
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