1381 results about "Alloy substrate" patented technology

The invention provides a composite body of aluminum or aluminum alloy and plastic and a manufacturing method thereof. The composite body includes an aluminum or aluminum alloy substrate and a plastic part that is bonded to the surface of the substrate by injection molding. An anodized film is formed on the surface of the substrate. The anodized film is formed with several nanopores, and the average pore diameter of the several nanopores is 30-60nm, the material of the plastic part is crystalline thermoplastic. The manufacturing method of the above-mentioned composite body comprises the steps of: providing an aluminum or aluminum alloy substrate; chemically etching the substrate to make the surface of the substrate rough; anodizing the above-mentioned substrate so that the surface of the substrate is formed with an average pore diameter of 30- 60nm anodic oxide film; the substrate after the anodic oxidation treatment is placed in an injection molding mold, and the injection molded part is combined with the surface of the substrate to obtain the composite, and the material of the plastic part is a crystalline thermoplastic .

The invention provides a compound of aluminum or an aluminum alloy and plastics and a manufacturing method thereof. The compound comprises an aluminum or aluminum alloy substrate and a plastic piece which is combined with the aluminum or aluminum alloy substrate through injection molding, wherein the aluminum or aluminum alloy substrate is subjected to electrochemical etching, thus the surface of the aluminum or aluminum alloy substrate is etched from the surface to the inside to form a plurality of nano holes; and the plastic piece is made of crystalline thermoplastic plastics. The manufacturing method of the compound comprises the following steps: providing the aluminum or aluminum alloy substrate; carrying out electrochemical etching treatment on the aluminum or aluminum alloy substrate, thus the surface of the aluminum or aluminum alloy substrate is etched from the surface to the inside to form the plurality of nano holes; and placing the aluminum or aluminum alloy substrate subjected to electrochemical etching into an injection molding mould, and combining the injection molding piece on the surface of the aluminum or aluminum alloy substrate, thus the compound is obtained, wherein the molding piece is made of crystalline thermoplastic plastics.

A coated electrically conductive substrate has particular utility where there are multiple closely spaced leads and tin whiskers constitute a potential short circuit. This electrically conductive substrate has a plurality of leads separated by a distance capable of bridging by a tin whisker, a silver or silver-base alloy layer coating at least one surface of at least one of the plurality of leads, and a fine grain tin or tin-base alloy layer directly coating said silver layer. An alternative coated electrically conductive substrate has utility where debris from fretting wear may increase electrical resistivity. This electrically conductive substrate has a barrier layer deposited on the substrate that is effective to inhibit diffusion of the substrate into a subsequently deposited layers, which include a sacrificial layer deposited on the barrier layer that is effective to form intermetallic compounds with tin, and a low resistivity oxide metal layer deposited on the sacrificial layer.An alternative coated electrically conductive substrate has particular utility where debris from fretting wear may oxidize and increase electrical resistivity, such an in a connector assembly. This electrically conductive substrate has a barrier layer deposited on the substrate that is effective to inhibit diffusion of constituents the substrate into a plurality of subsequently deposited layers. The subsequently deposited layers include a sacrificial layer deposited on the barrier layer that is effective to form intermetallic compounds with tin, a low resistivity oxide metal layer deposited on said sacrificial layer, and an outermost layer of tin or a tin-base alloy directly deposited on the low resistivity oxide metal layer.In this alternative embodiment, the barrier layer is preferably nickel or a nickel-base alloy and the low resisitivity oxide metal layer is preferably silver or a silver-base alloy.When heated, the coated substrate of this second embodiment forms a unique structure having a copper or copper-base alloy substrate, an intervening layer formed from a mixture or metals including copper and tin, and an outermost layer which is a mixture of a copper-tin intermetallic containing phase and a silver-rich phase. It is believed that this silver-rich phase is particularly beneficial to reduce an increase in resistivity due to oxidation of fretting wear debris.

A method for forming substantially white anodized aluminum oxide on an aluminum or aluminum alloy substrate is provided. A porous aluminum oxide layer is formed on the aluminum or aluminum alloy substrate by anodization in an acid electrolyte. Following formation of the anodized porous layer of aluminum oxide, the aluminum / aluminum alloy substrate is sequentially immersed in at least two reaction material solutions. The two or more reaction materials react to deposit a substantially white pigment material in the pores of the anodized aluminum oxide.

An intermediate substrate includes a handle substrate bonded to a thin layer suitable for epitaxial growth of a compound semiconductor layer, such as a III-nitride semiconductor layer. The handle substrate may be a metal or metal alloy substrate, such as a molybdenum or molybdenum alloy substrate, while the thin layer may be a sapphire layer. A method of making the intermediate substrate includes forming a weak interface in the source substrate, bonding the source substrate to the handle substrate, and exfoliating the thin layer from the source substrate such that the thin layer remains bonded to the handle substrate.