Patents
Literature
Patsnap Copilot is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Patsnap Copilot

215results about How to "Minimized increase" patented technology

Fretting and whisker resistant coating system and method

A coated electrically conductive substrate has particular utility where there are multiple closely spaced leads and tin whiskers constitute a potential short circuit. This electrically conductive substrate has a plurality of leads separated by a distance capable of bridging by a tin whisker, a silver or silver-base alloy layer coating at least one surface of at least one of the plurality of leads, and a fine grain tin or tin-base alloy layer directly coating said silver layer. An alternative coated electrically conductive substrate has utility where debris from fretting wear may increase electrical resistivity. This electrically conductive substrate has a barrier layer deposited on the substrate that is effective to inhibit diffusion of the substrate into a subsequently deposited layers, which include a sacrificial layer deposited on the barrier layer that is effective to form intermetallic compounds with tin, and a low resistivity oxide metal layer deposited on the sacrificial layer.An alternative coated electrically conductive substrate has particular utility where debris from fretting wear may oxidize and increase electrical resistivity, such an in a connector assembly. This electrically conductive substrate has a barrier layer deposited on the substrate that is effective to inhibit diffusion of constituents the substrate into a plurality of subsequently deposited layers. The subsequently deposited layers include a sacrificial layer deposited on the barrier layer that is effective to form intermetallic compounds with tin, a low resistivity oxide metal layer deposited on said sacrificial layer, and an outermost layer of tin or a tin-base alloy directly deposited on the low resistivity oxide metal layer.In this alternative embodiment, the barrier layer is preferably nickel or a nickel-base alloy and the low resisitivity oxide metal layer is preferably silver or a silver-base alloy.When heated, the coated substrate of this second embodiment forms a unique structure having a copper or copper-base alloy substrate, an intervening layer formed from a mixture or metals including copper and tin, and an outermost layer which is a mixture of a copper-tin intermetallic containing phase and a silver-rich phase. It is believed that this silver-rich phase is particularly beneficial to reduce an increase in resistivity due to oxidation of fretting wear debris.
Owner:WIELAND ROLLED PROD NORTH AMERICA LLC

Resin composition containing inorganic nucleating agent, molding thereof and process for producing the same

The present invention provides a propylene resin composition (A) containing a combination of a component (a) a propylene homopolymer or propylene block copolymer having a propylene-chain isotactic pentad fraction of 0.90 or more; a component (b) an ethylene-α-olefin copolymer rubber, in an amount of 0.5 to 20 mass % when the component (a) is a propylene homopolymer, or in an amount of 0 to 10 mass % when the component (a) is a propylene block copolymer; a component (c) a high-density polyethylene, in an amount of 0 to 20 mass %; and a component (d) an inorganic nucleating agent, in an amount of 0.4 to 3.0 parts by mass on the basis of 100 parts by mass of the total amount of the components (a), (b), and (c), which composition exhibits high rigidity within a high-temperature range of room temperature or higher, which exhibits excellent impact resistance within a low-temperature range of the freezing point or lower, which emits odor at such a low level that it can be employed for food products, and which minimizes specific weight. The present invention also provides a multi-layer structure including at least one layer formed of the composition; a container produced through heat molding; an injection-molded product; an extrusion-molded product; and a method for producing such a molded product.
Owner:IDEMITSU UNITECH CO LTD

Semiconductor integrated communication circuit and operation method thereof

The semiconductor integrated communication circuit includes:a low-noise amplifier; a receive mixer; a receive VCO; a demodulation-processing circuit; a modulation-processing circuit; a transmit mixer; a transmit VCO; a second-order-distortion-characteristic-calibration circuit; a quadrature-receive-signal-calibration circuit; and a test-signal generator. The test-signal generator generates first and second test signals using the transmit VCO. In the second-order-distortion-characteristic-calibration mode, the second-order-distortion-characteristic-calibration circuit variably changes an operation parameter of the receive mixer thereby to calibrate the second-order distortion characteristic to achieve its best condition while the first test signal is supplied to the receive mixer. In the quadrature-receive-signal-calibration mode, the quadrature-receive-signal-calibration circuit calibrates IQ mismatch of a quadrature receive signal to achieve the best condition thereof while the second test signal is supplied to the receive mixer. The integrated communication circuit can minimize the increase in chip footprint of a test-signal-generating circuit used to perform calibrations of both the second-order characteristic and IQ mismatch.
Owner:RENESAS ELECTRONICS CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products