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210results about "Coins" patented technology

Metallic coin stamped with holographic anti-counterfeiting pattern and manufacturing method thereof

The invention relates to a laser holographic anti-counterfeiting stamping technology and particularly relates to a metallic coin stamped with a holographic anti-counterfeiting pattern and a manufacturing method thereof and provides the metallic coin which has a laser holographic anti-counterfeiting function and exquisite pattern and is stamped with the holographic anti-counterfeiting pattern and the manufacturing method of the metallic coin. The manufacturing method comprises the following steps of: duplicating a laser holographic image on a metallic nickel plate to form a metal nickel plate for die pressing; coating a release layer, an imaging layer, a die pressing layer, an aluminum plating layer and a dual-layer adhesive layer on a film belt of a base film; positioning, transferring and stamping a laser electrochemical aluminum stamping foil on the metallic coin; heating a stamping head to 80-90DEG C; meanwhile, preheating and improving the temperature of the original metallic coin to 90-100DEG C; and removing the film belt of the base film by the release layer to form the metallic coin with laser holographic pattern. The metallic coin generates a new visual color in the overlapped laser effect and is a novel metal coin anti-counterfeiting type; and in addition, the metallic coin has the advantages of accuracy in positioning, strong three-dimensional sense, abundant layers, simple and quick process, one-time transfer stamping, favorable reproducibility and no pollution.
Owner:HUBEI LHTC ANTI COUNTERFEITING TECH CO LTD

Electroplating liquid of multi-layer cyanide-free electroplated copper-tin alloy coating, electroplating technology and coin thereof

ActiveCN103668359AAvoid the risk of mutual contaminationReduce management costsCoinsCyanidePyrophosphate
The invention relates to the technical field of coinage, and particularly relates to electroplating liquid of a multi-layer cyanide-free electroplated copper-tin alloy coating, an electroplating technology and a coin produced by the technology. The pyrophosphate electroplating solution of a multi-layer cyanide-free electroplated copper-tin alloy coating provided by the invention comprises a cyanide-free brass tin major brightening agent consisting of solutes brightener A and brightener B, wherein the concentration of the brightener A in the major brightening agent is 1-10g/L, and the concentration of the brightener B in the major brightening agent is 0.05-0.5g/L. By adopting the pyrophosphate electroplating solution and the electroplating technology of the multi-layer cyanide-free electroplated copper-tin alloy coating, a coin product of which the coating thickness is over 20 microns and the coating is uniform and dense can be obtained. After high-temperature thermal treatment, the coil coating is of a single-layer structure; the content of tin in the single-layer coating is 11-14% by weight; the coating appearance is in uniform golden yellow color without chromatic aberration, and the problem acknowledged by the electroplating section at present that a single-layer cyanide-free electroplated alloy coating is relatively thin is solved.
Owner:SHANGHAI MINT +1
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