The invention relates to a solder paste for SMT lead-free solder paste, comprising a solvent, a thixotropic agent, a composite adhesive, an active agent, a surfactant and an antioxidant, and the composite active agent is composed of methyl succinic acid and Composite active agents formed from other organic acids and halogen salts, the halogen salts are diphenylguanidine hydrobromide or diphenylguanidine hydrochloride, and the antioxidant is 2.6-di-tert-butyl-4- methyl phenol. The use of the solder paste for SMT lead-free solder paste of the present invention meets the requirements of the market and environmental protection. At the same time, the present invention uses methylsuccinic acid to form a composite active agent with other organic acids and halogen salts, and the wettability of the lead-free solder paste manufactured Good, good printability, uniform and delicate paste, light color of residue after soldering, low corrosion, good storage stability, and can meet the requirements of secondary reflow soldering of double-sided circuit boards in the electronics industry.