Making method of electric nickel and golden circuit board for saving nickel and gold dosage
What is Al technical title?
Al technical title is built by PatSnap Al team. It summarizes the technical point description of the patent document.
A manufacturing method and circuit board technology, which are applied in the manufacture of printed circuits, removal of conductive materials by chemical/electrolytic methods, and printed circuits, etc., can solve the waste of precious metals, increase production costs and other problems, save precious metals nickel and gold, reduce The effect of production costs
Inactive Publication Date: 2008-09-17
陈国富
View PDF0 Cites 24 Cited by
Summary
Abstract
Description
Claims
Application Information
AI Technical Summary
This helps you quickly interpret patents by identifying the three key elements:
Problems solved by technology
Method used
Benefits of technology
Problems solved by technology
Because in the traditional electro-nickel and electro-gold process, nickel and gold need to be plated on all conductive patterns, so a large amount of nickel and gold need to be consumed, and nickel and gold are precious metals. Partial nickel and gold plating not only reflects the major defects of the traditional process, but also directly leads to the waste of precious metals, and greatly increases the production cost of the enterprise
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more
Image
Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
Click on the blue label to locate the original text in one second.
Reading with bidirectional positioning of images and text.
Smart Image
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0017] The following examples are further explanations and illustrations of the present invention, and do not constitute any limitation to the present invention.
[0018] The steps of the manufacturing method (taking the double-sided panel as an example) of electric nickel and gold circuit boards that can save nickel and gold consumption of the present invention are as follows:
[0019] First, drill holes on the cut and baked copper clad board according to the program compiled by the customer, and then perform copper sinking and copper plating on the drilled holes to make the circuits on both sides of the copper clad board conductive. The above steps are the same as the conventional process.
[0020] The gist of the present invention is that, by forming the secondary circuit on the circuit board, the circuit pattern is selectively electro-nickel and electro-gold, and the specific steps are:
[0021] a. Paste a layer of dry film on the copper-plated circuit board. The dry film ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
PUM
Login to view more
Abstract
A manufacturing method of an electrolytic nickel and gold wiring board capable of saving dosage of nickel and gold, comprises broaching, copper precipitation, and copperizing on a copper-coated plate. The method is characterized by further comprising: a, adhering a dry film or printing a wet film on the wiring board, then adhering a positive sheet, exposing and developing to form a primary circuit; b, electroplating nickel and gold on all positions to be welded and copper surfaces of metal holes, then stripping; c, printing a wet film or adhering a dry film, then adhering a negative sheet, exposing and developing to form a secondary circuit; d, etching a circuit diagram, removing non-circuit portions, holding circuit portions, then performing stripping and etching detection; e, performing deoxidation treatment to the wiring board to remove oxides on the copper surfaces; f, after deoxidation treatment, resistance welding, exposing, developing, printing element symbols and machining shapes so as to manufacture the electrolytic nickel and gold wiring board only at the positions to be welded and the metal hole positions. With the method, the area of the nickel and gold can be reduced by 40-60%, thereby saving the noble metal nickel and gold and effectively reducing enterprise production cost.
Description
【Technical field】 [0001] The invention relates to a printed circuit board (PCB), in particular to a method for manufacturing an electro-nickel and gold circuit board which can reduce the plated area by 40-60% compared with a traditional circuit board and can save nickel and gold consumption. 【Background technique】 [0002] As we all know, printed circuit boards (PCBs) are used in almost all electronic devices we can see, ranging from electronic watches, calculators, general-purpose computers, to computers, electronic communication equipment, military weapon systems, etc., as long as There are electronic components such as integrated circuits, and PCBs are used for electrical interconnection between them. Printed circuit boards are formed by setting conductive patterns for electrical connections between electronic components on an insulating substrate, and its manufacturing process is relatively complicated. On printed circuit boards with higher requirements, nickel and gold...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
Application Information
Patent Timeline
Application Date:The date an application was filed.
Publication Date:The date a patent or application was officially published.
First Publication Date:The earliest publication date of a patent with the same application number.
Issue Date:Publication date of the patent grant document.
PCT Entry Date:The Entry date of PCT National Phase.
Estimated Expiry Date:The statutory expiry date of a patent right according to the Patent Law, and it is the longest term of protection that the patent right can achieve without the termination of the patent right due to other reasons(Term extension factor has been taken into account ).
Invalid Date:Actual expiry date is based on effective date or publication date of legal transaction data of invalid patent.
Login to view more 
Login to view more