Nickel-gold electroplating process of PCB

A technology of printed circuit board and nickel-gold electroplating, applied in the direction of secondary processing of printed circuit, etc., can solve the problem of inability to realize nickel-gold electroplating of printed circuit board, etc., and achieve the effects of excellent appearance, high feasibility and cost reduction.
CN101835346AInactive Publication Date: 2010-09-15CHINA CIRCUIT TECH SHANTOU CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
CHINA CIRCUIT TECH SHANTOU CORP
Publication Date
2010-09-15
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a nickel-gold electroplating process of a PCB, which comprises the following steps of: (1) preparing a PCB substrate; (2) making an outer circuit, an electric brush part and an electroplating connecting line of the PCB; (3) making a photosensitive soldering-resistant layer; (4) making a non-nickel-gold electroplating region protection layer; (5) electroplating nickel and gold; (6) removing the non-nickel-gold electroplating region protection layer; (7) removing the electroplating connecting line; (8) repairing an electroplating connecting line region; and (9) removing a process edge. In the nickel-gold electroplating process, the electric brush part on the process edge is communicated with a non-marginal to-be-electroplated region by the designed electroplating connecting line to electroplate a non-marginal region on the PCB, the electroplating connecting line is removed after nickel-gold electroplating, and the electroplating connecting line region is repaired to avoid the problem of electroplating connecting line residue and ensure the reliability of the PCB. Meanwhile, the non-marginal to-be-electroplated region and the electroplating connecting line can be freely selected according to actual needs. Accordingly, the nickel-gold electroplating process has high practicability.
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Description

technical field

[0001] The invention relates to a manufacturing process of a printed circuit board, more specifically, relates to a nickel-gold electroplating process of a printed circuit board. Background technique

[0002] Printed circuit board, that is, PCB board, the abbreviation of English (Printed Circuit Board). In order to avoid the oxidation and pollution of printed circuit boards before packaging components, it is necessary to protect the surface of printed circuit boards, that is, surface technology. Commonly used surface processes for printed circuit boards include hot air leveling, electroless nickel-gold, chemical silver, chemical tin, organic protective film, electroplating nickel-gold and other processes.

[0003] In the surface technology of printed circuit boards, the nickel-gold plating process is one of the important surface processes. The nickel-gold electroplating process of printed circuit boards uses the principle of an electrolytic cell to use the ...

Claims

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