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Preparation method of conductive sponges

A technology of conductive sponge and sponge, which is applied in the plating of superimposed layers, metal material coating process, coating, etc., can solve the problems of impermeable plating of the substrate, easy peeling of the film layer, environmental pollution, etc., and overcome the impermeability of plating The effects of penetrating, overcoming product defects, and overcoming environmental pollution problems

Inactive Publication Date: 2013-07-24
WUZHOU HGP ADVANCED MATERIALS TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the method of vacuum physical vapor deposition of conductive nickel layer is subject to vacuum conditions and the continuous consumption of target nickel metal, which makes this layer of conductive nickel layer extremely delicate. Once it encounters water, oil stains, hands, etc. during the production process, it will be damaged. Cause the nickel layer to fall off, resulting in product defects; and with the increase of the thickness of the substrate sponge, the penetration of the method is getting worse. When the thickness of the sponge is greater than 3.0mm, the physical vapor deposition method cannot penetrate the sponge

Method used

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  • Preparation method of conductive sponges
  • Preparation method of conductive sponges

Examples

Experimental program
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Effect test

Embodiment 1

[0012] 1. Use 1.4mm polyurethane sponge to corrode in 0.5-10g / L acidic potassium permanganate solution, then use 1-10g / L hydrogen peroxide for decolorization and reduction, finally wash with water, dry and roll;

[0013] 2. Apply the carbon conductive adhesive by roller coating method. After the wet film of the roller coating is uniform, dry and solidify in a tunnel drying kiln at <200°C. This step can be repeated until a carbon conductive film with a surface resistance of ≤2000 ohms is obtained. until;

[0014] 3. Transfer the polyurethane sponge that has completed step 2 to the vacuum magnetron sputtering equipment, use metal nickel as the target, adjust the current and speed required for sputtering, and control the vacuum degree during sputtering. After the sputtering process is over, take it out Polyurethane sponge, and check the surface resistance to obtain a conductive layer with a resistance value ≤ 300 ohms, that is, the preparation process of the carbon-nickel embe...

Embodiment 2

[0017] 1. Use 4.5mm polyurethane sponge to corrode in 0.5-10g / L acidic potassium permanganate solution, then use 1-10g / L hydrogen peroxide for decolorization and reduction, finally wash with water, dry and roll;

[0018] 2. Apply the carbon conductive adhesive by roller coating method. After the wet film of the roller coating is uniform, dry and solidify in a tunnel drying kiln at <200°C. This step can be repeated until a carbon conductive film with a surface resistance of ≤2000 ohms is obtained. until;

[0019] 3. Transfer the polyurethane sponge that has completed step 2 to the vacuum magnetron sputtering equipment, use metal nickel as the target, adjust the current and speed required for sputtering, and control the vacuum degree during sputtering. After the sputtering process is over, take it out Polyurethane sponge, and check the surface resistance to obtain a conductive layer with a resistance value ≤ 300 ohms, that is, the preparation process of the carbon-nickel embe...

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Abstract

The invention discloses a preparation method of conductive sponges, which is implemented by taking a coiled material or sheet material of polyester sponges or polyether sponges with a thickness of not more than 10 mm as a base material through the steps of carrying out chemical pretreatment on the base material, coating a carbon conductive layer on the base material subjected to chemical pretreatment, carrying out gas-phase physical deposition of metal nickel or metal copper on the base material, carrying out electro-nickelling on the base material subjected to the gas-phase physical deposition of nickel or copper, and carrying out water washing and drying on the obtained product so as to obtain a conductive sponge; or sequentially carrying out electro-coppering and electro-nickelling on the base material subjected to the gas-phase physical deposition of nickel or copper, and carrying out water washing and drying on the obtained product so as to obtain a conductive sponge. The preparation method disclosed by the invention is environment-friendly, overcomes product defects caused by that a film layer is easy to fall off in the process of directly carrying out gas-phase physical deposition of metal nickel or metal copper, and also solves the problem that the base material is incompletely plated due to thickness limitation.

Description

technical field [0001] The invention relates to a method for preparing conductive and shielding materials, in particular to a method of coating a carbon-metal infiltrated film conductive layer on a polyester sponge or a polyether sponge and then electrodepositing metallic nickel or electrodepositing copper first and then electrodepositing nickel The preparation method of conductive sponge. Background technique [0002] With the rapid development of modern technology and the improvement of living standards, high-tech products are more and more favored by people, bringing people convenience in life and spiritual enjoyment, but the resulting electromagnetic radiation is also becoming more and more serious , Anti-electromagnetic radiation has also become an environmental protection topic that people are more and more concerned about. The most convenient and effective way to prevent electromagnetic radiation is to use electromagnetic shielding, that is, to use metal mesh with goo...

Claims

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Application Information

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IPC IPC(8): C23C28/02C25D5/12
Inventor 吴天和穆俊江朱彦文向裕林李承洪钟志彬
Owner WUZHOU HGP ADVANCED MATERIALS TECH CORP
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