Process for reducing low internal stress of hub electroplated layer through semi-bright nickel electroplating procedure
A semi-bright nickel plating and semi-bright nickel technology, applied in the field of electroplating, can solve the problems of great harm to human health, increased production cost, many defects of plating parts, etc., so as to reduce harm and environmental pollution, save production cost, and achieve compactness of coating. high effect
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Embodiment 1
[0047] Described electroplating semi-bright nickel nickel sulfate process is: nickel sulfate (NiSO 4 ·6H 2 O): 100g·dm -3 , nickel chloride (NiCl 2 ·6H 2 O): 10g·dm -3 , boric acid (H 3 BO 3 ): 20g·dm -3 , Sodium dodecylsulfonate: 1g·dm -3 , Butynediol: 1g·dm -3 , sodium dextrin: 0.1g·dm -3 , temperature: 45℃, pH value: 2, cathode current density: 1A dm -2 , Time: 20min, air stirring, continuous filtration.
Embodiment 2
[0049] Described electroplating semi-bright nickel nickel sulfate process is: nickel sulfate (NiSO 4 ·6H 2 O): 150g·dm -3 , nickel chloride (NiCl 2 ·6H 2 O): 30g·dm -3 , boric acid (H 3 BO 3 ): 30g·dm -3 , Sodium dodecylsulfonate: 2g·dm -3 , Butynediol: 2g·dm -3 , sodium dextrin: 0.2g·dm -3 , temperature: 55°C, pH value: 3, cathode current density: 3A·dm -2 , Time: 10min, air stirring, continuous filtration.
Embodiment 3
[0051] Described electroplating semi-bright nickel nickel sulfate process is: nickel sulfate (NiSO 4 ·6H 2 O): 125g·dm -3 , nickel chloride (NiCl 2 ·6H 2 O): 20g·dm -3 , boric acid (H 3 BO 3 ): 25g·dm -3 , Sodium dodecylsulfonate: 1.5g·dm -3 , Butynediol: 1.5g·dm -3 , sodium dextrin: 0.15g·dm -3 , temperature: 50℃, pH value: 2.5, cathode current density: 2A dm -2 , Time: 15min, air stirring, continuous filtration.
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