Electroless palladium plating bath and electroless palladium plating method

一种无电镀、不饱和的技术，应用在电路、电气元件、电固体器件等方向，达到高浴稳定性、优异软焊结合性能和引线接合性能、长浴寿命的效果

Inactive Publication Date: 2009-01-28
C UYEMURA & CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] The present inventors have continued extensive research to solve the problems described above

Method used

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  • Electroless palladium plating bath and electroless palladium plating method
  • Electroless palladium plating bath and electroless palladium plating method
  • Electroless palladium plating bath and electroless palladium plating method

Examples

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Embodiment 1 to 8

[0033] Examples 1 to 8, Comparative Examples 1 to 5

[0034]Electroless palladium plating baths of the compositions shown in Table 2 and Table 3 were prepared, and the plating properties of the plating baths, the properties of the resulting plated layers, and the stability of the plating baths were evaluated by the methods described below. In Examples 1, 2, 5 and 6, the properties of the coatings were also evaluated by using the coating bath after carrying out the continuous plating test at 50°C, which is described below. Results are shown in Tables 2 and 3.

[0035] Plating Appearance

[0036] Treatments (1) to (5) [pretreatment] and treatments (6) to (8) [plating treatment] shown in Table 1 were used for copper plates (size: 10 cm × 20 cm, thickness: 0.1 mm), And the appearance of the final coating was visually evaluated. When the plating layer had no unevenness in appearance, it was evaluated as "good", but when it had uneven appearance, it was evaluated as "bad".

[0...

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Abstract

Disclosed is an electroless palladium plating bath containing a palladium compound, at least one complexing agent selected from ammonia and amine compounds, at least one reducing agent selected from phosphinic acid and phosphinates, and at least one unsaturated carboxylic acid compound selected from unsaturated carboxylic acids, unsaturated carboxylic acid anhydrides, unsaturated carboxylates and unsaturated carboxylic acid derivatives. Such an electroless palladium plating bath has high bath stability, and decomposition of the bath hardly occurs. Consequently, the electroless palladium plating bath of the present invention has a longer bath life than conventional electroless palladium plating baths. In addition, this electroless palladium plating bath enables to obtain excellent solder bonding characteristics and wire bonding characteristics since it does not affect plating film characteristics even when it is used for a long time.

Description

technical field [0001] The present invention relates to an electroless palladium plating bath having high storage stability and good bath stability in continuous use and capable of withstanding industrial use, and an electroless palladium plating method using the bath. Background technique [0002] In packaging steps for printed wiring boards or electronic parts or components, electroless nickel / gold displacement plating has been widely used for many years as a surface treatment for applications requiring high reliability. [0003] Since displacement gold plating causes gold precipitation by utilizing the difference in oxidation-reduction potential between nickel as a base and a plating bath, gold penetrates into nickel so that spot corrosion occurs by oxidation (elution). Corrosion of these points by this oxidation may act as an inhibiting factor in connecting tin and nickel in the solder layer during subsequent solder reflow, resulting in a problem that connection properti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/44
CPCC23C18/54C23C18/44C23C18/1651H01L24/43H01L24/745H01L2224/45664C23C18/42
Inventor 村角明彦黑坂成吾稻川扩小田幸典
Owner C UYEMURA & CO LTD
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