Chemical nano-silver plating solution and preparation method thereof, and silver plating method for copper part

An electroless plating and nano-silver technology, applied in the field of electroless plating, can solve the problems of the stability of the electroless plating solution, the poor bonding force between the plating layer and the metal plating parts, etc., and achieve the effects of low price, simple and easy method, and wide source of raw materials.

Inactive Publication Date: 2013-12-11
JIANGSU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are still some disadvantages in electroless plating: (1) the stability of the electroless plating solution; (2) the poor bonding force between the coating and the metal plated parts, etc.
[0006] Moreover, there is no report on the electroless plating of nano-silver on the surface of copper parts. Nano-silver is more conducive to the deposition of silver on the surface of copper parts, so that the silver-plated layer can be firmly combined with the surface of copper parts.

Method used

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  • Chemical nano-silver plating solution and preparation method thereof, and silver plating method for copper part
  • Chemical nano-silver plating solution and preparation method thereof, and silver plating method for copper part

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] The copper sheet is composed of NaOH 10 g / L, Na 2 CO 3 55 g / L, Na 3 PO 4 55 g / L, Na 2 SiO 3 Slightly boil in 10 g / L lye for 10-15 minutes, wash with distilled water, dry and store in H at a temperature of 30-50 °C 2 SO 4 700 g / L, HCl 10 g / L, HNO 3 Immerse in 500 g / L etching solution for 15-30 s, take it out, rinse it with distilled water, fix it in the plating solution A configured according to Table 1, stir rapidly at a temperature of 25 °C, and slowly drip Add the plating solution B prepared according to the formula in Table 1, drop it for 5 minutes, stir and age for 15 minutes, wash with water after plating, and dry in the air.

[0038] Table 1 chemical silver plating solution formula one

[0039]

[0040] The workpiece after electroless plating was measured at room temperature, and a uniform and fine silver coating was obtained. The silver particle size was 20-50 nm, and the thickness was about 1.6 μm. The surface was sterile through medical testing....

Embodiment 2

[0042] Same as Example 1, only at a temperature of 25 °C, the plating solution B was dropped in 5 minutes, and aged for 25 minutes with stirring. The workpiece after electroless plating was measured at room temperature, the size of the silver particles was 35 nm, and the thickness of the uniform and fine silver coating was about 2.5 μm, and the surface was sterile through medical testing.

Embodiment 3

[0044] Same as Example 1, only at a temperature of 25 °C, the plating solution B was dropped in 5 minutes, and aged for 60 minutes with stirring. The workpiece after electroless plating was measured at room temperature. The size of the silver particles was 25 nm, and the thickness of the uniform and fine silver coating was about 2.6 μm. The surface was sterile through medical testing.

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Abstract

The invention relates to a chemical nano-silver plating solution and a preparation method thereof, and a silver plating method for a copper part, and belongs to the technical field of chemical silver plating. The chemical silver plating solution comprises the following raw material components: a plating solution A and a plating solution B, wherein 1L of the plating solution A comprises 1 to 20g of silver salt and 3 to 50g of 25 mass percent ammonia water; 1L of the plating solution B comprises 3 to 105g of reducing agent, 0.05 to 1g of organic additive and 0.01 to 0.2g of other additives; and chemical silver plating temperature is 25 DEG C, and ageing time is 5 to 60 minutes. The surface of copper is subjected to chemical silver plating by the method, the plating solution has high stability, a bright and fine nano-silver plating is formed on the surface of the copper, is high in performance and adhesion, and is thick, uniform, non-foaming and crack-free, and the application requirements of fields of decorative electroplating and functional electroplating are met.

Description

technical field [0001] The invention belongs to the field of electroless plating, and relates to the preparation of an electroless silver plating solution, as well as its electroless plating method and application on the surface of stainless steel. Background technique [0002] Silver itself has high electrical conductivity and sterilizing properties, high chemical stability to acids and alkalis, strong corrosion resistance, and the price of silver is relatively low compared with other precious metals. Therefore, silver plating on metal and non-metal surfaces has been widely used in many fields such as decorations, medical equipment, tableware, and electronic products. [0003] At present, most of the silver plating on copper parts adopts silver plating process or electroplating process. Although electroplating can better plate silver on copper parts, there are still many disadvantages, such as waste liquid treatment after electroplating, cyanide silver plating , the waste...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/44B82Y40/00B82Y30/00
Inventor 殷恒波葛超群冯永海颜晓波柳艳君姜逸倩沈玉堂
Owner JIANGSU UNIV
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