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356results about How to "Improve the quality of workmanship" patented technology

Intelligent monitoring system for quality of PCB solder paste printing process and method

The invention provides an intelligent monitoring system for the quality of a PCB solder paste printing process and a method. The system comprises a data acquisition module, a printing quality management database, a statistical analysis module and a light control module, wherein the data acquisition module is used for performing real-time acquisition of various parameter data of PCB printing solder paste, which is detected by an SPI detection system; the statistical analysis module is used for acquiring and analyzing the data acquired by the data acquisition module, judging whether the quality of the solder paste printing process is controlled or not according to an analysis result, and sending a signal representing that the quality of the printing process is out of control to the light control module when the quality of the solder paste printing process is out of control or tends to be out of control; and the light control module can control different warning lights to give a warning of specific out-of-control conditions. Through the system and the method, the defect that the quality of a printing process cannot be monitored in the prior art is overcome, the printing process can be monitored, and a warning can be given in time when that the printing process is out of control is found so as to reduce defects in solder paste printing.
Owner:CHONGQING UNIV

Test method of residual stress of silicon single crystal piece

The invention discloses a test method of residual stress of a silicon single crystal piece. Main test steps comprise preparing a three-dimensional strain rosette, a strain gauge, a detected silicon single crystal piece and the like, pasting the three-dimensional strain rosette, testing an initial value of each resistor of the three-dimensional strain rosette and recording the value, cutting a silicon chip to release a stress, testing each data of the three-dimensional strain rosette again and recording the data, processing the data, and analyzing and discussing a result. According to the invention, the three-dimensional strain rosette is taken as a strain sensor, a cutting method is employed to release a residual stress of the silicon chip, through employing an YE2539 high speed static strain indicator to measure reverse direction strain of the strain rosette tightly pasted on the silicon chip, size and direction of a residual stress of each point on the silicon chip can be calculated, and a unique test operation process of the silicon chip is formed. Test precision is high, speed is fast, and cost is low. A test result analysis shows that: total residual stress of a monocrystalline silicon piece is small, a residual stress at a circumference edge is large relative to an internal measuring point, a maximum residual stress of an unprocessed monocrystalline silicon piece is large relative to a processed monocrystalline silicon piece.
Owner:扬州晶新微电子有限公司

Method for device for forming metal micro-thixotropy in semi-solid state assistant by supersonic vibration

The invention discloses a method for the micro-thixotropy and molding of semisolid metal through the assistance of supersonic vibration. The lower end of a lower mould is provided with an electric heater of the lower mould; the lower mould is connected with a supersonic amplitude transformer; the lower mould is provided with a thermocouple of the lower mould; the upper end of a punching head is connected with an upper mould; the upper end of the upper mould is provided with an electric heater of the upper mould; the upper mould is connected with a pressure lever; and the upper mould is provided with a thermocouple of the upper mould. A semisolid metal blank material is remelted and heated to a solid-liquid coexisting region and is subjected to pressure machining; at the same time, supersonic vibration is applied to reduce friction and micro-molding resistance between the semisolid metal blank material and a micro-mould, strengthen the fluidity of the semi-solid metal material, improve the filling performance of the semisolid metal material in the micro-mould, and achieve good micro-molding effect. The method promotes the micro-thixotropy and molding of the semisolid metal, improves the efficiency of micro-molding, reduces equipment cost, avoids the disadvantages of hole contraction and the like in micro-machining process and improves the effects of micro-thixotropy and molding of the semisolid metal.
Owner:ZHEJIANG UNIV

Method for glass micro-crack detection by molecule stainer

The invention provides a method used for detecting microcracks of glass by a molecule colorant, belonging to a real-time detection method in the technical field of optical cold working; the method comprises the steps as follows: after chunk glass is roughly machined, the chunk glass is arranged statically for several tens of hours so as to release the stress; subsequently, the surface of the chunk glass is corroded by acid, coated by the molecule colorant and arranged statically for several minutes; the colorant molecules infiltrate the interior of the microcrack passage till the bottom end by the compatibility of the glass on the aqueous solution and the scattering nature of the colorant; and the floating color on the surface of the chunk glass is washed away by water and the shape and depth of the microcrack can be clearly displayed, thus providing reliable basis for removing the microcrack. The method has the active effects that HF corrosion is used for reinforcing the chemical and mechanic performance of the glass surface, natural high-strength characteristic of the glass is partly recovered, the limits of microcrack theory detection method are overcome, the process flow is simplified, the processing time is saved, the processing cost is reduced, and the working efficiency and process quality are improved.
Owner:CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI

Electrostatic chuck apparatus and temperature control method thereof

The invention discloses a plasma processing device and an electrostatic chuck assembly. The electrostatic chuck assembly comprises a first cooling passage and a second cooling passage which can provide cooling media to a cooling medium cavity, and a passage switching device which selects either of the first cooling passage or the second cooling passage to be communicated with the cooling medium cavity. Temperature differences exist between the cooling media in the two cooling passages. The invention further discloses a temperature control method of the electrostatic chuck assembly. Through the method, cooling media at different temperatures are provided for the cooling medium cavity in a substrate of the electrostatic chuck assembly through at least two cooling passages; when temperature rise is needed, the cooling medium at the higher temperature is imported to the cooling medium cavity; and when temperature reduction is needed, the cooling medium at the lower temperature is importedin the cooling medium cavity. When the temperature is increased, the electrostatic chuck assembly can obtain higher basic temperature, thereby being conducive to reducing the power of a heater and saving heating time. When the temperature is reduced and the temperature reduction gradient is increased, the electrostatic chuck assembly can be greatly cooled in a short time.
Owner:BEIJING NAURA MICROELECTRONICS EQUIP CO LTD

Enclosure for continuous wall foundation pit formed by steel cylinders or steel plate piles adopting seal grooves and occlusion structures and construction method of enclosure

The invention relates to an enclosure for a continuous wall foundation pit formed by steel cylinders or steel plate piles adopting seal grooves and occlusion structures. The steel cylinders or steel plate piles adopting the seal grooves are connected to form the continuous pile wall so as to form the foundation pit enclosure, according to the steel cylinders or steel plate piles with the seal grooves, at least one seal groove is formed at the connecting positions of steel plates or piles of steel cylinder piles, the cross section of each groove is in a convex arc shape, a concave shape or a polygon shape, a matched pipe is inlaid in each groove, the steel plates or steel cylinder piles and the pipes in the grooves are jointly and independently tampered into the stratum, pipe cavities in the grooves are left or waterproof sealing materials are injected into the pipe cavities to serve as sealing layers at the connecting positions of the steel plates or the piles of the steel cylinder piles; the cross section of the connecting positions of the steel plates or the piles of the steel cylinder piles is in a hook shape or concave-convex matched or third filling block filling connecting shape; and one or more sealing grooves are formed in the pile connecting positions.
Owner:JIANGSU GREEN RIVER ENVIRONMENTAL TECH CO LTD

Reaction chamber and semiconductor processing equipment

A reaction chamber and semi-conductor processing device, comprising a Faraday shielding ring (21) made of nonconductive magnetic material and an insulating ring (22) made of insulating material; the Faraday shield ring (21) is provided with a slot thereon passing through the ring surface thereof in an axial direction; both the Faraday shielding ring (21) and the insulating ring (22) are disposed in the reaction chamber surrounding the inner peripheral wall of the reaction chamber; the Faraday shielding ring (21) is stacked on the insulating ring (22) in a vertical direction; a shielding ring (211) is disposed surrounding the inner peripheral wall of the insulating ring (22), the shielding ring (211) is connected to an area on the lower surface of the Faraday shielding ring (21) adjacent to the center of the reaction chamber; and the shielding ring (211) is made of the nonconductive magnetic material, and is provided with the slot thereon passing through the ring surface thereof in the axial direction. The reaction chamber and the semi-conductor processing device avoid or reduce the risk of sparking, reduce pollution of the reaction chamber caused by the flaking off of metal particles, and increase the inner diameter and available space of the reaction chamber.
Owner:BEIJING NAURA MICROELECTRONICS EQUIP CO LTD

Light guide plate and manufacturing method of light guide plate as well as backlight module and display device

The invention relates to the technical field of display and particularly relates to a light guide plate capable of utilizing a micro-penetration surface to collect light and a manufacturing method of the light guide plate as well as a backlight module and a display device. An emergent surface of the light guide plate is the micro-penetration surface; the micro-penetration surface comprises a plurality of micro-penetration points and the micro-penetration points are provided with convex surfaces; and the bottom surface of the light guide plate is a net surface and the net surface comprises a plurality of net points and the net points are provided with convex surfaces. The manufacturing method of the light guide plate comprises the steps of: presetting a micro-penetration point distribution pattern by a precision engraving machine; putting a micro-penetration surface die core base plate into a precision engraving machine; engraving the micro-penetration surface die core base plate into a micro-penetration face die core according to the micro-penetration point distribution pattern; assembling the micro-penetration surface die core and a light guide plate die core into a light guide plate die; and injecting and molding into the light guide plate by the light guide plate die. A micro-penetration surface design is adopted and directions of all scattering lights in the light guide plate can be adjusted by using the micro-penetration surface to collect the scattering lights; and the development brightness and the influence definition of a liquid crystal liquid screen are improved and the product quality is improved.
Owner:BOE TECH GRP CO LTD +1

Magnetron sputtering device and magnetron sputtering method

The present invention provides a magnetron sputtering device and a magnetron sputtering method. The magnetron sputtering device comprises a reaction chamber, a sputtering power supply and a driving source, a target is arranged at the top of the reaction chamber, and the sputtering power supply is electrically connected with the target, and is used to output a sputtering power to the target during the magnetron sputtering process. A pedestal is arranged in the reaction chamber, is located below the target, and is used to bear a processed workpiece. The driving source is used to drive the pedestal to rise or drop. Moreover, the magnetron sputtering device also comprises a control unit used for controlling the driving source to drive the pedestal to rise during the magnetron sputtering process, so that the spacing between the target and the pedestal is always kept at a predetermined value and does not change. The magnetron sputtering device provided by the present invention uses the control unit to control the driving source to drive the pedestal to rise during the magnetron sputtering process, so that the spacing between the target and the pedestal is always kept at the predetermined value, does not change, and is always kept at an optimal value, and accordingly, the thin film uniformity and deposition rate can be improved.
Owner:BEIJING NAURA MICROELECTRONICS EQUIP CO LTD

Automatic grinding and polishing machine for engine crankshafts

The invention relates to an automatic grinding and polishing machine for engine crankshafts. The automatic grinding and polishing machine comprises a front body and a rear body. A motor and a transmission adjusting device are sequentially disposed at the left end of the front body. An output shaft of the motor is connected with the transmission adjusting device. A tail positioning device is disposed at the right end of the front body. A crankshaft spindle polishing device is disposed between the transmission adjusting device and the tail positioning device. A first air cylinder is disposed on the crankshaft spindle polishing device. A crankshaft spindle clamp controller which is connected with the first air cylinder is further disposed on the front body. A crankshaft connecting rod polishing device and a crankshaft connecting rod clamp controller which are connected are disposed on the rear body. A second air cylinder is disposed on the crankshaft connecting rod polishing device. By the automatic grinding and polishing machine which is simple to operate and high in work efficiency, crankshaft spindles and crankshaft connecting rods can be polished simultaneously, quality requirements of crankshaft polishing can be guaranteed, and consistency of the spindles and the connecting rods can be increased.
Owner:山西东鑫衡隆机械制造股份有限公司

Heating chamber and semiconductor processing equipment

The present invention relates to a heating chamber and semiconductor processing equipment, the heating chamber comprises a plurality of heating zones, heating units in one-to-one correspondence to the heating zones, a drive unit, a detection unit, a control unit and adjustment units in one-to-one correspondence to the heating units, the drive unit is used for driving the detection unit to move in a plane parallel to a wafer and transmitting a position signal of the detection unit in real time to the control unit, the detection unit is used for detecting in real time the wafer temperature in correspondence to the plurality of heating zones and transmitting the temperature to the control unit, the control unit is used for judging which one of the heating zones, the temperature transmitted by the detection unit belongs to, according to the position signal transmitted by the drive unit and judging whether a bias exists between the temperature and a preset temperature, and if the bias exists between the temperature and the preset temperature, the adjustment unit in correspondence to the heating zone, to which the temperature belongs, is adjusted so as to calibrate the output power of the corresponding heating unit. The heating chamber may improve the heating accuracy and the temperature uniformity and lowers the wafer temperature measurement difficulty.
Owner:BEIJING NAURA MICROELECTRONICS EQUIP CO LTD

Metal sheet slotting machine convenient to operate

The invention discloses a metal sheet slotting machine convenient to operate. The metal sheet slotting machine comprises a box body; threaded rods which are mutually symmetric are rotationally connected to the bottom of the inner wall of the box body; a first helical gear is fixedly connected to the lower part of the outer wall of each threaded rod through a flat key; a dustproof motor box is fixedly connected to the bottom of the inner wall of the box body and between the two threaded rods; a double-output motor is fixedly connected to the bottom of the inner wall of the dustproof motor box;output shafts on the two sides of the double-output motor penetrate through the two sides of the inner wall of the dustproof motor box and extend out of the dustproof motor box respectively; and a second helical gear is fixedly connected to each of the output shafts on the two sides of the double-output motor. The invention relates to the technical field of metal processing mechanical equipment. The metal sheet slotting machine convenient to operate solves the problems of complex structure, tedious operation and limited use conditions of the existing metal sheet slotting machine, reaches the purpose of more stable slotting, improves the working efficiency and the process quality and ensures cleanness of processing environment while the practicability of the machine is improved.
Owner:邯郸兴力铝模板科技有限公司

Full-automatic printing ink plate printing and drying device

The invention discloses a full-automatic printing ink plate printing and drying device. The device comprises a box body, a first fixing table and a second fixing table are fixedly connected to the twosides of the bottom of the inner wall of the box body respectively, the top of the first fixing table and the top of the second fixing table are rotationally connected with a first straight gear anda second straight gear respectively, a first belt wheel is fixedly connected to the front part of the second straight gear, and a first motor is fixedly connected to the bottom of the inner wall of the box body and on the left side of the second fixing table. The invention relates to the technical field of automatic mechanical equipment. The full-automatic printing ink plate printing and drying device solves the problems that an existing equipment plate printing process is complex and cannot realize stable printing, the position deviation is easy to occur, the equipment is relatively large inabrasion and ink plate printing can not be carried out on a large scale; and the purposes of carrying out ink plate printing on the parts and buffering and protecting the parts are achieved, damage caused by too large stress on the equipment is avoided, the parts with different thicknesses can be printed, the practicability of the equipment is effectively improved, and the equipment is convenientto maintain.
Owner:宋晓莉
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