Intelligent monitoring system for quality of PCB solder paste printing process and method

An intelligent monitoring system and solder paste printing technology, which is applied in the field of surface mount and PCB solder paste printing process quality monitoring, can solve the problems that cannot be prevented, reduce solder paste printing defects, solve equipment operation islands, and improve SMT process quality effect

Inactive Publication Date: 2016-11-09
CHONGQING UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Solve the defect that the printing process in the prior art cannot realize prevention-oriented control

Method used

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  • Intelligent monitoring system for quality of PCB solder paste printing process and method
  • Intelligent monitoring system for quality of PCB solder paste printing process and method
  • Intelligent monitoring system for quality of PCB solder paste printing process and method

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Embodiment Construction

[0031] An intelligent monitoring system for PCB solder paste printing process quality, including a data acquisition module, a printing quality management database, a statistical analysis module and a lighting control module; the printing quality management database can be used to store the data of the data acquisition module and the statistical analysis module respectively, convenient Staff view call history data.

[0032] The data acquisition module is used for real-time acquisition of various parameter data in the PCB solder paste printing process detected by the SPI detection system, and simultaneously transmits the collected data to the printing quality management database for storage;

[0033] The statistical analysis module acquires the data collected by the data collection module (it can directly read the data collected by the data collection module, or read the data stored in the printing quality management database by the data collection module), and analyze the data, ...

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Abstract

The invention provides an intelligent monitoring system for the quality of a PCB solder paste printing process and a method. The system comprises a data acquisition module, a printing quality management database, a statistical analysis module and a light control module, wherein the data acquisition module is used for performing real-time acquisition of various parameter data of PCB printing solder paste, which is detected by an SPI detection system; the statistical analysis module is used for acquiring and analyzing the data acquired by the data acquisition module, judging whether the quality of the solder paste printing process is controlled or not according to an analysis result, and sending a signal representing that the quality of the printing process is out of control to the light control module when the quality of the solder paste printing process is out of control or tends to be out of control; and the light control module can control different warning lights to give a warning of specific out-of-control conditions. Through the system and the method, the defect that the quality of a printing process cannot be monitored in the prior art is overcome, the printing process can be monitored, and a warning can be given in time when that the printing process is out of control is found so as to reduce defects in solder paste printing.

Description

technical field [0001] The invention relates to the field of surface mount technology, in particular to the field of quality monitoring of PCB solder paste printing process. Background technique [0002] Surface mount technology SMT (Surface Mount Technology) is a method of mounting non-pin or short-lead surface mount components on the surface of a printed circuit board PCB or the surface of other substrates, and soldering them by reflow soldering or dip soldering. Assembled circuit assembly technology. For SMT quality, the most critical process is the printing process. According to the report of the Global Surface Mount Association (SMTA), under the premise of correct PCB design and guaranteed quality of components and PCBs, 74% of the defective SMT processes are related to solder paste printing. The quality of the solder paste printing process determines the quality of the SMT process. [0003] In the process of printing production, due to the interaction of various fac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41F33/16G05B19/418
CPCB41F33/16G05B19/41875Y02P90/02
Inventor 孛正军曹乐谢林骏张帮杰张济邓兰兵
Owner CHONGQING UNIV
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