Electrostatic chuck apparatus and temperature control method thereof

Abstract

The invention discloses a plasma processing device and an electrostatic chuck assembly. The electrostatic chuck assembly comprises a first cooling passage and a second cooling passage which can provide cooling media to a cooling medium cavity, and a passage switching device which selects either of the first cooling passage or the second cooling passage to be communicated with the cooling medium cavity. Temperature differences exist between the cooling media in the two cooling passages. The invention further discloses a temperature control method of the electrostatic chuck assembly. Through the method, cooling media at different temperatures are provided for the cooling medium cavity in a substrate of the electrostatic chuck assembly through at least two cooling passages; when temperature rise is needed, the cooling medium at the higher temperature is imported to the cooling medium cavity; and when temperature reduction is needed, the cooling medium at the lower temperature is importedin the cooling medium cavity. When the temperature is increased, the electrostatic chuck assembly can obtain higher basic temperature, thereby being conducive to reducing the power of a heater and saving heating time. When the temperature is reduced and the temperature reduction gradient is increased, the electrostatic chuck assembly can be greatly cooled in a short time.

Description

technical field [0001] The invention relates to the temperature control technology in the technical field of microelectronics, in particular to an electrostatic chuck device used in plasma processing equipment and a temperature control method for the electrostatic chuck. Background technique [0002] The application of electrostatic chucks in plasma processing equipment (such as etching machines) has become more and more widespread. The main function of electrostatic chucks is to keep fixed and support wafers waiting to be processed, so as to avoid displacement of workpieces to be processed during the process. [0003] The electrostatic chuck uses electrostatic attraction to fix the workpiece to be processed, which has many advantages over the previously used mechanical chuck and vacuum chuck. For example, the electrostatic chuck can reduce the damage of the workpiece to be processed due to pressure, collision, etc. when using a mechanical chuck, increase the effective proce...

AI Technical Summary

Problems solved by technology

Therefore, at present, the electrostatic chucks of most plasma processing equipment are difficult to change the temperature quickly and greatly, which prolongs the process, restricts the improvement of production efficiency, and sometimes leads to the decline of process quality

Images