Chemical silver plating solution and silver plating method

A technology of electroless silver plating and compounds, applied in the direction of liquid chemical plating, metal material coating process, coating, etc., to achieve good stability, good solderability, and reduce the effect of pre-plating steps

Active Publication Date: 2019-02-15
CHANGSHA UNIVERSITY OF SCIENCE AND TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the reduction of tartaric acid, although the obtained silver layer is bright, the plating solution is stable.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] Electroless silver plating solution includes: silver oxide 1.2g / L; copper ion complexing agent EDTA-2Na 5g / L; pyrrolo[2,3-d:5,4-d']bithiazole 0.5g / L; benzotri Azole 0.05g / L; Polymellitic diphenylimide 0.5g / L; Dibenzopyrrolo[1,2-a][1,8]naphthalene 1.2g / L; Methanesulfonic acid 50ml / L.

[0048] The appearance of the silver layer obtained under the above parameters is smooth and bright, there is no overflow plating on the circuit, the circuit is not blackened, the thickness of the coating is 0.2 microns (2min coating thickness), the stability of the bath solution reaches 6MTO, and the adhesion of the coating by the tape method is good and reaches grade 5 ( 5 stands for excellent, 4 stands for good, 3 stands for poor, 2 stands for poor, 1 stands for very bad), there is no peeling of the metal coating, and if the substrate is not broken, there should be no serious cracking or peeling after bending Phenomenon, when the substrate is not broken, there is no phenomenon of exposi...

Embodiment 2

[0050] Electroless silver plating solution, which includes raw materials with the following concentrations: silver oxide 1.8g / L; copper ion complexing agent EDTA-2Na 20g / L; pyrrolo[2,3-d:5,4-d']bithiazole 1.5g / L; Dibenzopyrrolo[1,2-a][1,8]naphthalene 1.2g / L; Benzotriazole 0.075g / L; Methanesulfonic acid 50ml / L; Diphenylimide 1.0g / L.

Embodiment 3

[0052] Electroless silver plating solution, which includes raw materials with the following concentrations: silver oxide 1.8g / L; copper ion complexing agent EDTA-2Na 15g / L; pyrrolo[2,3-d:5,4-d']bithiazole 1.2g / L; Dibenzopyrrolo[1,2-a][1,8]naphthalene 1.5g / L; Benzotriazole 0.06g / L; Methanesulfonic acid 55ml / L; Diphenylimide 0.75g / L.

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PUM

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Abstract

The invention provides a chemical silver plating solution on a printed circuit board and a silver plating method. The chemical silver plating solution is prepared from the compositions of 1.0-2.0g / L of silver ions, 5-30g / L of a copper ion complexing agent, 0.5-1.8g / L of bithiazole-like compounds, 0.5-1.5g / L of azaindole-like-containedindole compounds, 0.05-0.075g / L of benzotriazole, 40-60ml / L of methanesulfonic acid, and 0.5-1.3 g / L of polyphenyl-tetramethyl-acyl-diphenyl-imide,a suitable pH value of the plating solution is 0.5-1, and the plating solution is put at the room temperature. By adopting the chemical silver plating solution, a bright white coating is obtained,especially the binding force and corrosion resistant properties are outstanding, meanwhile the process flow is shortened,pre-plating is not required, and reliability of the circuit board can be improved and the service life can be prolonged.

Description

technical field [0001] The invention belongs to the technical field of chemical silver plating, and in particular relates to a chemical silver plating solution for surface treatment on a printed circuit board and a silver plating method for the silver plating solution. Background technique [0002] Packaging substrate and other printed circuit board layout surface treatment process, chemical immersion silver, has good flatness, solderability, good stability of plating solution, oxidation resistance, light stability, heat resistance and long-term stability better. Silver has excellent electrical conductivity, and compared with gold, its atomic diffusion is small and relatively economical. [0003] With the acceleration of the upgrading of electronic products, the requirements for printed circuit boards are getting higher and higher. Printed circuit boards are developing towards carrying more information, smaller and lighter. The requirements are also getting higher and high...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/42
CPCC23C18/42
Inventor 吴道新肖忠良杨荣华吴佳伦姚文娟曹忠
Owner CHANGSHA UNIVERSITY OF SCIENCE AND TECHNOLOGY
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