24results about How to "Easy to Plating" patented technology

The invention discloses electroplating equipment for phosphor copper ball surface treatment, and relates to the technical field of phosphor copper ball electroplating equipment.The electroplating equipment comprises an electroplating bath body, two vertical plates are symmetrically and fixedly connected to the top of the electroplating bath body, and a supporting shaft is rotationally connected between the two vertical plates in a penetrating mode; a motor is fixedly connected to the end of the supporting shaft and located on one side of the outer wall of the vertical plate, a bearing frame is fixedly connected to the outer wall of the right side of the supporting shaft, a storage plate is rotationally connected into the bearing frame, an auxiliary electroplating mechanism is arranged in the bearing frame, and an auxiliary feeding assembly is arranged at the top of the electroplating bath body and located above the bearing frame. A material draining assembly is arranged on the outer wall of the left side of the electroplating bath body, a storage plate vibrates, the phosphor copper balls immersed in electroplating liquid can shake on the surface of the storage plate and between the two partition plates, the effect of changing the positions of the phosphor copper balls can be achieved, the surfaces of the phosphor copper balls can be completely electroplated, the thickness of the electroplated layers of the phosphor copper balls is kept uniform, and the electroplating quality is improved. And the uneven condition is avoided.

The present invention discloses a wafer electroplating device for wafer wet process equipment, comprising a plating tank shell with a cavity for electroplating, wherein the plating tank shell is provided with adjacent and detachable wafer hanger parts and a plating diffusion and shielding part, wherein the wafer hanger part is provided with a single-sided exposure port for exposing one side of the plating surface of the wafer, and the plating diffusion and shielding part is provided with a multi-stage guide surface directly opposite to the single-sided exposure port. The wafer electroplating device for wafer wet process equipment provided by the present invention has a compact overall structural arrangement, a sophisticated internal structure and comprehensive functions, and multiple wafers can be electroplated at the same time through the wafer hanger part, and each wafer is plated on only one side of the surface, and the plating liquid can be fully diffused through the multi-stage guide surface of the plating diffusion and shielding part to ensure that the plating liquid is evenly plated on the wafer to meet the requirement of uniform thickness.

The invention discloses a laser diode and a method of manufacturing a stacked high density laser diode array wherein the laser diode comprises a substrate and a stacked layer, the stacked layer comprising a P-type layer with ridge strips, the laser diode having a waveguide surface, a light output surface, a reflective surface, and a bottom surface; the top surface of the P-type layer is a waveguide surface, the bottom surface of the substrate is a bottom surface, and the waveguide surface and the bottom surface are oppositely arranged; the bottom surface is provided with at least one groove, and the extending direction of the groove is perpendicular to the ridge-shaped strip. The two side edges of the waveguide surface, the light output surface and the reflection surface are all plated with coatings. According to the laser diode and the method for manufacturing the stacked high-density laser diode array, the structure of the laser diode is improved, and at least one groove is formed in the bottom surface of the laser diode, so that the two side edges, the light output surface and the reflecting surface of the waveguide surface are conveniently coated with coatings, and the light output surface and the reflecting surface are coated with the coatings; and the electrical performance of the laser diode is further ensured.

The utility model discloses a full-automatic unloading and feeding device for an electroplating line, and relates to the technical field of electroplating. The device comprises installation beams, a lifting plate is arranged between the installation beams through a feeding assembly, and a containing basket is further arranged below the lifting plate through a discharging assembly. The feeding assembly comprises cross beams fixedly connected to the front end and the rear end between the mounting beams in the transverse direction, sliding grooves are formed in the end faces of the cross beams in the transverse direction, movable plates are movably connected to the lower portions of the cross beams, and lifting plates are movably connected to the lower portions of the movable plates. The movable plate is driven by the driving wheel to move on the cross beam, and a workpiece is driven by the movable plate and the lifting plate to move, so that the problem that the conventional device is inconvenient to be used for a long-distance electroplating production line is solved, and meanwhile, the U-shaped frame is driven by the movable plate to apply external force to the mounting rod; and the mounting rod and the concentric-square-shaped frame drive the placing basket to rotate, and the problem that automatic discharging is not convenient in the prior art is solved.

The utility model provides an automatic heating device for electroplating an environment-friendly aluminum material. The automatic heating device for electroplating the environment-friendly aluminum material comprises a sealing box and a heating device, the electroplating tank is fixedly mounted on the inner wall of one side of the sealing box; the supporting frame is fixedly installed on the inner wall of the bottom of the sealing box, the top of the supporting frame is fixedly connected with the electroplating pool, and an opening is formed in the supporting frame; the ventilation frame is arranged in the opening; the supporting frame is mounted on the inner wall of the ventilation frame in a sliding manner; and the plurality of electric heating tubes are fixedly mounted on the supporting frame. The automatic heating device for electroplating the environment-friendly aluminum material, provided by the utility model, has the advantages of better temperature adjusting effect and more functions.

The utility model belongs to the technical field of printing cylinder processing, and particularly relates to an electroplating device of a hollow gravure cylinder, which comprises a processing tank, a partition plate is fixed in the middle of the processing tank and divides the left side and the right side of the processing tank into a cleaning tank and an electroplating tank, and a rotating shaft is rotatably assembled in the middle of the processing tank. A motor is installed on the front side of the processing pool, an output shaft of the motor is in transmission connection with the rotating shaft, connecting rods are fixed to the front side and the rear side of the rotating shaft correspondingly, and clamping assemblies are arranged at the ends of the two connecting rods correspondingly; according to the hollow gravure cylinder electroplating device, the hollow gravure cylinder can be conveniently electroplated, the hollow gravure cylinder can be rapidly transferred into the cleaning pool after electroplating is completed, the hollow gravure cylinder can be automatically driven to rotate through water pressure, the hollow gravure cylinder can be comprehensively washed, electroplating liquid is prevented from remaining on the surface of the hollow gravure cylinder, and the structural design is reasonable.

The utility model discloses a chlorine water corrosion resistant protection device, and relates to the technical field of chlorine water corrosion resistant processing protection. A protective device resistant to chlorine water corrosion comprises a box body, a fixing block is fixed to the side face of the box body, a cover plate is installed on the box body, a limiting frame is fixed to the side face of the fixing block and is in a U shape, a limiting plate is fixed to the side face of the box body, a supporting strip is arranged on the cover plate, one end of the supporting strip extends into the limiting frame, and a clamping plate is fixed to the end, away from the limiting frame, of the supporting strip. The limiting plate slidably penetrates through the clamping plate, a filter screen is fixed in the box body and corresponds to the cover plate, and a protection mechanism is arranged between the box body and the fixing block. The watch needing to be additionally provided with a protection device is placed in the box body, and the protection liquid is added to the surface of the watch through the protection mechanism in an electroplating mode, so that the chlorine water corrosion resistance of the watch is improved, and the watch is convenient to wear and use.

The invention discloses a bipolar current collector with double copper layers and a preparation method thereof, and relates to the field of battery current collectors, the current collector takes an aluminum foil as a substrate, and a compact first copper layer prepared by magnetron sputtering and a thickened second copper layer prepared by electroplating are sequentially arranged on one side of the substrate. The first copper layer is prepared by adopting an intermittent deposition method, a pause interval is set in the deposition process, and substrate heating and low-energy ion beam bombardment are assisted, so that the compactness and the bonding strength of a plating layer are remarkably improved; and the second copper layer is prepared by adopting a pulse electroplating method, so that the non-porous and uniform structure is further ensured. Through a sputtering and electroplating composite process, a copper-aluminum interface which is high in binding force and free of defects is successfully constructed, electrolyte permeation is effectively blocked, and generation of lithium-aluminum alloy is prevented, so that the use safety of the bipolar current collector is greatly improved, and the cycle life of a battery is greatly prolonged.

The invention discloses a manufacturing method suitable for an alloy foil resistor. The manufacturing method comprises the following steps: 1, curing a substrate and pasting a film; 2, pattern transfer; 3, developing, etching and removing the film; 4, printing a protective layer before rack plating; 5, exposing and developing the protective layer before rack plating; 6, rack plating; 7, plating bridge cutting; 8, precisely adjusting the resistance; 9, printing a protective layer; 10, marking and printing; 11, the protection layer mark is cured; 12, laser scribing; 13, performing primary segmentation; 14, performing vacuum sputtering; 15, carrying out secondary segmentation; sixthly, barrel plating of copper, nickel and tin is conducted. According to the invention, by introducing an innovative alloy foil resistor manufacturing process, the resistance precision of the alloy foil resistor is greatly improved, the purpose of automatic resistance adjustment of the high-precision alloy foil resistor is achieved, and the stability and consistency of the product are improved.

The invention provides an anti-reverse-plating electroplating clamp which comprises a hanging frame, a bearing rod is fixed to the bottom of the hanging frame, a plurality of mounting discs distributed at equal intervals are fixed to the bearing rod, and a plurality of fixing assemblies distributed in an annular array are arranged on the mounting discs. The fixing assembly is connected with a connecting base on the side wall of the mounting disc through a connecting rod. The fixing assembly comprises a mounting shaft, and a conductive part is arranged on the mounting shaft; the conductive part comprises a deformable deformation cover, the interior of the deformation cover is filled with a deformable conductive piece, and the deformation cover is in contact with a workpiece. Compared with a traditional electroplating clamp, a conductive connecting point between the electroplating clamp and the to-be-electroplated workpiece is in soft contact, the clamp and the to-be-electroplated workpiece can be in full contact through the deformable and conductive deformation cover and the conductive part, the resistance between the clamp and the contact point of the to-be-electroplated workpiece is reduced, and the electroplating quality is improved. And the current passing efficiency is improved, and electroplating is facilitated.

The utility model discloses an LED plate structure capable of overcoming metal migration, which comprises a substrate, a wafer copper foil and a conducting strip are arranged on the front surface of the substrate, and an LED wafer is arranged on the wafer copper foil; the LED wafer is electrically connected with the conducting strip; the packaging structure is characterized in that a gap is reserved between the edge of the wafer copper foil and the edge of the substrate, the substrate is provided with a packaging colloid covering the wafer copper foil and the conducting strip, and the gap is located in the packaging colloid; a lead copper foil is arranged on the back face of the substrate, a lead is arranged on the lead copper foil, and the lead copper foil is electrically connected with the conducting strip. A network formed by the wafer copper foil and the conducting strip is reserved, electroplating is facilitated, and no lead is arranged around the wafer fixing area, so that moisture cannot directly act on the LED wafer to generate metal migration.

The utility model discloses a split type heating block structure which comprises a connecting frame, and the connecting frame and a translation assembly used for pushing the connecting frame to move horizontally are integrated on the outer surface wall of the connecting frame. According to the device, after the tray component is transferred to the corresponding station and fixed, a driving piece is matched with a chain to drive a supporting frame and a sliding base at the top of the supporting frame to slide along a sliding rail, the supporting frame is in linkage with a heating plate till the heating plate is arranged above the tray component, and a lifting motor is matched with a transmission rod and a threaded rod to drive the heating plate to move downwards; the heating metal strip is matched with the heat conduction plate to achieve hot melting of the tray component, the operation space of the top of the tray component is guaranteed through the heating plate which can be arranged in a receding mode, a traditional integrated metal strip is divided into six sets of split bodies of an S-shaped structure, follow-up maintenance is facilitated, and meanwhile the welding efficiency is improved. Once local problems occur, only the split bodies need to be replaced correspondingly.

The utility model relates to the field of electroplating equipment, and discloses an anode plate coating electroplating device. According to the device, a fine electrolytic tank is welded to the outer surface of a main electrolytic tank, a side supporting shell is welded to the outer surface of the end, away from the fine electrolytic tank, of the main electrolytic tank, a side supporting plate is welded to the outer surface of the end, away from the main electrolytic tank, of the fine electrolytic tank, and a supporting beam is movably connected to the inner surface of a connecting groove; a connecting supporting rod is fixedly connected to the lower surface of the supporting beam, an anode expansion slot is movably connected to the outer surface of the connecting supporting rod, a limiting block is arranged on the outer surface of the anode expansion slot, electrolyte is stored in the main electrolytic tank and the fine electrolytic tank, electroplating is conveniently completed, the fine electrolytic tank can better conduct electroplating under the action of semiconductor cooling fins, and the electroplating efficiency is improved. The side supporting shell and the side supporting plate guarantee supporting of equipment at the two ends, the limiting block is pulled to 90 degrees by being inserted into the inner surface of the anode expansion groove to complete fixation, and then the size adjustment of the anode plate is completed.

The utility model relates to the technical field of electroplating, and discloses an insoluble anode pulse electroplating device and electroplating equipment, and the insoluble anode pulse electroplating device comprises a pulse power supply which is provided with a first electrode and a second electrode; the first anode structure is coated with a catalytic coating and electrically connected with the first electrode, a first unilateral diode is electrically connected between the first anode structure and the first electrode, an anode of the first unilateral diode is electrically connected with the first electrode, and a cathode of the first unilateral diode is electrically connected with the first anode structure; the second anode structure is electrically connected with the first electrode; according to the utility model, the problems that the service life of the anode is affected and the electroplating cost is increased due to the fact that hydrogen evolution corrosion occurs at the anode with the catalytic coating and the catalytic coating falls off are solved.

The automatic electroplating equipment comprises a rack, an automobile decoration part electroplating box is arranged on the left side of the bottom end in the rack, an automobile decoration part cleaning box is arranged on the right side of the automobile decoration part electroplating box, a sliding mechanism is arranged on the top of the rack, and the lower end of the sliding mechanism is connected with an adjusting mechanism. According to the automatic electroplating equipment for machining the automobile decorating parts, dregs generated by electroplating the automobile decorating parts in the hollowed-out placing frame enter the filtering frame through hollowed-out holes, the dregs generated by electroplating the automobile decorating parts hung on the surface of the hanging frame directly fall into the filtering frame, and the filtering frame effectively collects the dregs generated by electroplating the automobile decorating parts in a unified mode; according to the automobile decoration part electroplating box, overflowing of residues generated by automobile decoration part electroplating is avoided, the cleaning difficulty of the automobile decoration part electroplating box is reduced, after the storage assembly and the auxiliary mechanism are cleaned through the automobile decoration part cleaning box, a worker screws a limiting screw ring to remove the storage assembly and the auxiliary mechanism, the filter frame can be detached, and residues in the filter frame can be conveniently cleaned.

This invention discloses a connection structure and fastener, comprising a fastener including a body, an insert portion disposed at one end of the body, and a washer installed within the insert portion. The body has an axially penetrating inner hole, the inner wall of which has an internal thread adjacent to the insert portion. The washer is interference-fitted with the insert portion, thereby forming a blind hole in the fastener. The other end of the body also has a riveting portion; a plate having a riveting hole for connecting with the riveting portion, the fastener being interference-fitted with the plate; and a bolt including a threaded shank threadedly connected to the body of the fastener and a nut connected to the end of the shank away from the fastener. The bolt is used to fix at least one connector, the connector being fitted against the side of the plate away from the fastener, and the nut abutting against the other side of the connector, thereby fixing the connector. In this invention, the internal thread of the fastener penetrates the body, having a longer effective thread length within a limited axial space, thereby ensuring connection strength.

The application discloses a processing device and method for probes of a probe card. The device comprises an upper tray, a first main body and a plurality of first support parts, the first main body is annular, a plurality of first support parts are arranged at intervals in the first main body to support the metal substrate, there is a first space between two adjacent first support parts, and the upper tray is further provided with a positioning structure for fixing the metal substrate; a lower tray, a second main body and a plurality of second support parts, a plurality of second support parts are arranged at intervals on the second main body, when the upper tray and the lower tray are assembled, a plurality of second support parts are respectively embedded in a plurality of first spaces and support the metal substrate. The scheme simplifies the probe processing flow, reduces the labor cost, avoids defects such as bending, falling off or surface scratch caused by repeated mounting in the probe processing process, and improves the yield of the probe.

The invention provides a preparation method of a composite copper foil for a circuit, and belongs to the technical field of preparation of composite copper foils. According to the invention, amino groups in polydopamine are chelated with metal nickel ions to form a compact nickel coating, so that the binding force and the separation performance of the carrier and the ultrathin copper foil are remarkably improved. The in-situ polymerization method is used for generating the polypyrrole layer on the surface of the carrier copper foil, and the operation is simple; by grafting polypyrrole with polydopamine, the adsorption capacity and conductivity of an organic layer to nickel ions are enhanced, the conductivity of the organic separation layer is quickly and efficiently improved by an electrochemical film forming method, and subsequent copper foil electroplating is facilitated. Pollution-free divalent nickel sulfate is used as a main component of the electroplating solution, so that the safety is ensured.

The invention relates to the technical field of environment-friendly electroplating, in particular to an environment-friendly pulse electroplating method. The environment-friendly pulse electroplating method comprises the following steps that S1, environment-friendly electroplating liquid is prepared; s2, multiple sets of pulse electroplating parameters are set, and each set of pulse electroplating parameters corresponds to the corresponding electroplating wave band; s3, carrying out pulse electroplating; and S4, ultrasonic hot water cleaning and drying treatment. According to the environment-friendly pulse electroplating method, the quality of an electroplated layer can be improved, environmental pollution can be reduced, the electroplating process is optimized by accurately controlling parameters such as the positive and negative pulse current density, the positive and negative pulse width and the positive and negative pulse pause time, during the pulse pause period, metal ions near a cathode are recovered, and the electroplating quality is improved. Therefore, the concentration polarization phenomenon is reduced, the deposition efficiency of an electroplated layer is improved, the thickness uniformity and compactness of the plated layer are improved, and the appearance quality, corrosion resistance and wear resistance of the plated layer are further remarkably improved. Meanwhile, the environment-friendly nickel electroplating solution and the environment-friendly additive are adopted, so that emission of harmful substances generated in the electroplating process can be reduced, pollution to the environment is relieved, and electroplating wastewater treatment is relatively economical, simple and easy to implement.

The application discloses a strawberry soil culture seedling digging device, which comprises a sleeve, a supporting cylinder is slidably connected to the outside of the sleeve, a rotating shaft is rotatably connected to the inside of the sleeve, the lower end of the rotating shaft extends into the inside of the supporting cylinder, a pressure plate is transmissionally connected to the lower end of the rotating shaft, a plurality of spades are evenly hinged to the circumference of the pressure plate, and each spade is slidably connected to the inner side of the supporting cylinder. The device generates downward driving force through the rotating shaft, drives the spades to be inserted into the soil, and cooperates with adjacent spades to cut the creeping stems while digging the soil, so that the high-quality seedling digging can be rapidly and accurately realized.

The utility model relates to the field of electroplating, in particular to electroplating equipment capable of realizing uniform electroplating, which comprises a base, an electroplating frame and an electroplating device, the electroplating mechanism is mounted at the top of the electroplating frame and can be used for electroplating the workpiece; when a workpiece enters the electroplating frame, the electroplating liquid surface is lifted upwards, and when the liquid surface rises to a certain position, the electroplating liquid enters the liquid storage box through communication of the liquid collecting shell and the liquid discharging pipe to be temporarily stored, so that the situation that the electroplating liquid overflows when the workpiece enters the electroplating frame due to the fact that the electroplating liquid in the electroplating frame is too much is avoided; when the electroplating liquid in the electroplating frame is less, the liquid conveying pump re-injects the electroplating liquid temporarily stored in the liquid storage tank into the electroplating frame through communication of the circulating pipe and the liquid storage tank, so that the electroplating liquid in the electroplating frame can be guided out in a self-adaptive manner, and the electroplating liquid is prevented from overflowing when a workpiece enters the electroplating frame; and the surrounding environment is influenced.

The utility model provides an electroplating device for bearing processing, which comprises a rack, support legs arranged at four corners of the lower surface of the rack, an electroplating box arranged inside the rack, a top cover rotatably arranged at the upper end of the electroplating box, a handle arranged at the front side of the top cover, and a liquid inlet pipe arranged at a liquid inlet arranged at the right side of the electroplating box, a liquid discharging pipe is arranged at a liquid discharging opening formed in the lower surface of the electroplating box, two electroplating controllers distributed in a bilateral symmetry mode are arranged at the lower end of the inner wall of the rear side of the electroplating box, and an electroplating auxiliary module used for assisting in bearing electroplating is further arranged on the electroplating box. According to the electroplating device for bearing machining, the bearing in the electroplating bath is driven to shake quickly and uniformly in multiple directions, so that the bearing can be in contact with electroplating liquid quickly and efficiently, and the bearing can be electroplated quickly and efficiently.

The utility model provides a barrel plating device for a battery clamp. The barrel plating device comprises a mounting plate, the electroplating device comprises a mounting plate, electroplating pools are mounted on the top surface of the mounting plate at equal intervals, rails are fixedly connected to the positions, located on the two sides of the electroplating pools, of the top surface of the mounting plate correspondingly, a door-shaped frame is slidably connected to the upper portions of the rails, a hydraulic rod is fixedly connected to the middle of the bottom surface of the door-shaped frame, and a hanging hook is fixedly connected to the bottom surface of the hydraulic rod; a barrel plating assembly is installed on the lower portion of the hanging hook, a driving assembly is installed on the upper portion of one side of the outer surface of the electroplating pool, and one end of the driving assembly is connected with one end of the barrel plating assembly. And the barrel plating assembly comprises a U-shaped frame, large fluted discs are rotationally connected to the two sides of the inner cavity wall of the U-shaped frame correspondingly, a rhombic barrel is fixedly connected to the middle of the two large fluted discs, water passing holes are formed in the outer surface of the rhombic barrel at equal intervals, and a material opening is formed in one face of the rhombic barrel. According to the utility model, the electroplating pool, the hydraulic rod, the barrel plating assembly and the driving assembly are matched with one another, so that barrel plating of the battery clamp is realized.

The utility model provides a lantern type electroplating hanger, which relates to the technical field of lantern type electroplating hangers and comprises a circular ring, the circular ring is an open ring, a vertical rod is fixedly connected to the surface of the circular ring, a rotating rod is fixedly connected to the surface of the circular ring, the circular ring, the vertical rod and the rotating rod are combined to form the lantern type electroplating hanger, and a hook is arranged on the surface of the vertical rod. A utilization device is arranged on the surface of the vertical rod, an adjusting device is arranged on the surface of the vertical rod, the utilization device comprises a semicircular plate fixedly connected to the surface of the vertical rod, a storage plate is inserted into the semicircular plate, a through hole is formed in the surface of the storage plate, and a clamping rod is inserted into the upper top of the semicircular plate. One end of the clamping rod is fixedly connected with a semi-arc plate, the surface of the clamping rod is sleeved with a first spring, the two ends of the first spring are fixedly connected with the upper top of the semi-arc plate and the bottom of the semi-arc plate respectively, and the problem that the inner space of the lantern type electroplating hanger is wasted is solved.