The invention discloses a
semiconductor packaging structure, a device and a packaging process thereof, comprising the following steps: a
resonator packaging step: providing a substrate, on which a plurality of
ceramic resonators are evenly inverted, the bottom surface of the
resonator is exposed, a conductive block is mounted at the position of the exposed bottom
surface electrode pad, the
resonator is plastic-sealed, and the packaging surface is horizontally ground until the top surface of the conductive block is exposed; a
thermistor packaging step: mounting a
thermistor at the corresponding position of each resonator on the ground packaging surface, the
thermistor is electrically connected to the conductive block through an electroplated circuit, thereby achieving
electrical connection with the resonator; a control
chip packaging step: mounting a control
chip at the corresponding position of the packaging surface, the control
chip is directly electrically connected to the conductive block of the resonator through an electroplated column on the one hand, and is electrically connected to the circuit of the thermistor through an
interconnection layer on the other hand. The invention stacks the
ceramic resonator and the plastic
package body to form a
crystal oscillator heterogeneous stacking structure.