29 results about "Process compensation" patented technology

The invention relates to the technical field of semiconductors, and discloses a temperature control method and device of a machine heating system, a readable medium and electronic equipment. The temperature control method of the machine heating system comprises the following steps: acquiring related data of a heater; determining a feed-forward gain and a disturbance quantity based on the related data of the heater, wherein the feed-forward gain is used for determining feed-forward compensation power of the heater in combination with the disturbance quantity under the condition that sudden increase of the disturbance quantity is detected; a dissipation model of the heater is determined based on the related data of the heater, and dissipation compensation power of the heater is determined based on the dissipation model; under the working condition of machine liquid spraying, if the set process compensation condition is met, the process compensation power of the heater is determined; a target heating power for the heater is determined based on the feedforward compensation power, the dissipation compensation power, and the process compensation power. The method has the advantages that the temperature control response speed is increased, multi-dimensional power compensation cooperation is achieved, and the temperature stability in the semiconductor manufacturing process is improved.

The invention discloses a high-density printed circuit board circuit forming process compensation method, which comprises the following steps of: firstly, collecting and standardizing structures and detection data of multiple batches and multiple process sections, and constructing a multi-target compensation optimization model through multi-dimensional parameter integration and feature extraction; the multi-objective compensation optimization model fuses objectives such as size precision, cost, electrical and thermal behaviors, establishes inter-objective collaborative constraints, introduces a reinforcement learning algorithm, dynamically adjusts weights of all the objectives, continuously optimizes compensation amount distribution in combination with process simulation feedback, finally fuses the optimal compensation weight into actual process control and collects effect feedback, and finally achieves the purpose of optimizing the optimal compensation weight. According to the method, high-precision and multi-target adaptive optimization of process compensation is realized, and the forming quality and the production efficiency of the circuit board are improved.

The invention discloses a control system and method of an intelligent servo press, relates to the technical field of press control, and constructs a uniform stamping state representation through deep excavation and fusion of force and displacement process data streams generated in the servo press. On the basis, a double-time-scale implicit state estimation algorithm is introduced, time sequence modeling and deep analysis are carried out on weak and gradual change characteristics contained in a full-stroke force displacement curve, and therefore accurate quantitative evaluation of the implicit state of mold abrasion is achieved. Then, the quantized wear value serves as a core decision factor, a self-adaptive control mechanism based on a compensation knowledge base is driven, and an optimal process compensation strategy and a sliding block target track are dynamically generated. Therefore, the product quality consistency in the precise stamping process can be improved, the service life of the die is effectively prolonged, the production cost is reduced, and the intelligent level of stamping production is comprehensively improved.

The invention discloses a PCB intelligent jointed board based on parameterized driving and a process compensation method and system, and the method comprises the following steps: S1, determining a jointed board structure, inputting jointed board parameters through a graphical interface, and finally calculating the size of the jointed board in real time; s2, process edge compensation is carried out based on the input jointed board parameters, and coordinate positioning of a tool hole and an optical point is calculated; s3, analyzing the original PCB outline data, and calculating a milling vacancy processing position; and S4, comparing the pre-manufactured milling belt with the theoretical shape to calculate a specific position which is not milled in place, and taking the specific position as a corner cleaning hole adding position. According to the method, a visual graphical parameter input interface can be provided, real-time preview is supported, and intellectualization and parameterization of process edge compensation and gong vacancy generation are realized.

The invention discloses a processing defect detection method and system based on a semiconductor integrated circuit, and belongs to the technical field of semiconductor manufacturing data processing and defect detection, and the method comprises the steps: obtaining a high-resolution surface topography scanning matrix, an interlayer stress distribution matrix and a transient electrical response matrix of a specified process layer of a target wafer, and constructing an original feature tensor after correction; generating a multi-dimensional coupling feature matrix, and constructing a spatial adjacency topology network and a cross-layer coupling energy propagation graph model; performing energy iteration deduction on the basis of introducing a current density direction vector and a thermal diffusion coefficient parameter to obtain a potential energy gathering path; a microdefect risk coupling coefficient distribution diagram is generated through time sequence folding mapping and nonlinear coupling calculation, hidden defect characterization parameters are extracted through multi-scale feature compression and abnormal clustering analysis, and defect space positioning and process compensation parameter adjustment suggestion output are achieved; according to the invention, the subcritical microscale latent defect can be identified, and the detection sensitivity and reliability are improved.

The invention discloses a stainless steel die state monitoring and process compensation method and system based on stamping force, and the method comprises the following steps: collecting multi-mode sensing data in a stamping process in a stamping period; processing the multi-modal perceptual data, and synchronously determining a predicted part quality state and a predicted equipment health state in a parallel manner; generating a set comprising a plurality of candidate compensation strategies based on the part quality state and the equipment health state; selecting and determining an optimal compensation strategy from the set of candidate compensation strategies based on a production target; and the optimal compensation strategy is applied to the subsequent stamping process. According to the method, the predicted part quality state and the predicted equipment health state are synchronously determined in parallel, the service life of the mold is remarkably prolonged based on the quality priority, health priority and balance strategy of the production target, and the shutdown risk and the comprehensive production cost caused by excessive wear or sudden failure of the mold are reduced.

The invention provides a semiconductor pipeline weld joint intelligent detection and compensation method based on space attention, and the method comprises the steps: recognizing an internal fusion region image, an external fusion region image, an internal heat affected region image and an external heat affected region image of a welded special gas pipeline based on a collected 2D image and 3D point cloud of the welded special gas pipeline; respectively inputting the internal fusion region image, the external fusion region image, the internal heat affected region image and the external heat affected region image of the welded special gas pipeline into a pre-trained welding defect identification model to obtain a defect identification result output by the welding defect identification model, the defect identification result is used for indicating a welding defect type and a defect quantification out-of-tolerance degree value existing in the welded special gas pipeline; and on the basis of the defect recognition result, a corresponding process compensation scheme is matched in a process parameter association library, so that welding process parameters of the subsequent welding special gas pipeline of the tungsten electrode track welding equipment are adjusted.

The present application relates to the field of integrated circuit design, in particular to a clock source with temperature process voltage compensation. The present application improves the existing temperature process compensation module, so that the temperature process compensation module can compensate the voltage variation of temperature and process at the same time; a selection module is added between the temperature process compensation module and the voltage controlled oscillator, the four variation voltages output by the temperature process compensation module are compared, the largest variation voltage under the current temperature condition is selected as the compensation voltage Vctrl and output to the voltage controlled oscillator; at this time, the control voltage obtained is a curve fitted by straight lines with different slopes, which can be applied to the case of large frequency and large temperature variation, the fitting is very good, and the output frequency error is very small.

The invention belongs to the technical field of integrated circuits, and particularly relates to a positive temperature coefficient current generating circuit with process compensation. The circuit comprises a symmetric positive temperature coefficient current generating circuit or a complementary positive temperature coefficient current generating circuit. The symmetrical positive temperature coefficient current generation circuit comprises two positive temperature coefficient sub-current generation circuits; wherein one sub-current generating circuit comprises a positive temperature coefficient current biasing circuit with NMOS (N-channel metal oxide semiconductor) process characteristics, a first operational amplifier circuit and a first current mirror circuit; the other sub-current generating circuit comprises a positive temperature coefficient current biasing circuit with PMOS (P-channel Metal Oxide Semiconductor) process characteristics, a second operational amplifier circuit and a second current mirror circuit; the complementary positive temperature coefficient current generating circuit comprises a positive temperature coefficient current biasing circuit with dual-process characteristics, a third operational amplifier circuit and a third current mirror circuit; according to the invention, the asymmetry of a temperature curve caused by the asymmetry of a process corner can be effectively compensated while the positive temperature coefficient current is generated, so that the device has a good application prospect.

The application provides a door and window processing process data analysis method and system, relates to the field of data analysis, obtains equipment operation parameters of an upstream process, carries out extraction processing to obtain microscopic information representing the microscopic state of the process, processes the microscopic information by using preset deviation information, and obtains an upstream process deviation value. Based on the upstream process deviation value, the system can generate process compensation parameters of a downstream process, and obtain process parameters of the downstream process accordingly. In the actual operation process of the downstream process, the system monitors the operation parameters, adjusts the process parameters of the downstream process according to the deviation value of the actual operation parameters and expected state parameters, and finally obtains the adjusted process parameters. The application can find potential technical defects of risks in advance, effectively avoid quality problems, save production costs and reduce economic losses for the factory, and significantly improve the quality control level and production efficiency of door and window manufacturing.

The invention relates to the field of ferrous metallurgy automation control, and discloses a self-adaptive regulation and control method and system for steel production equipment based on instantaneous energy efficiency characteristic feedback. The method comprises the following steps: synchronously acquiring equipment operation state and material flow data through a millisecond-level period, and resolving an instantaneous characteristic value representing unit effective output energy consumption intensity by using an energy consumption-material coupling model; and under the limitation of the process stability constraint model, based on a comparison result of the instantaneous characteristic value and a dynamic reference threshold value, automatically generating a physical correction instruction to drive an execution mechanism to execute closed-loop adjustment. According to the method, the energy efficiency index is converted into the real-time process control variable, dynamic balance between energy efficiency optimization and process stability is achieved, and irreversible material loss is dealt with through cross-process compensation.

This invention relates to the field of semiconductor technology, specifically to a method and system for online control of in-plane electrical performance uniformity on a wafer. The method includes: acquiring key process parameters at multiple locations within the wafer plane online during wafer fabrication; inputting these parameters into a pre-trained machine learning model, which models the spatial correlation between locations and predicts the estimated electrical performance at different locations within the wafer plane; subsequently, generating a spatially adaptive process recipe for differentiated process compensation in different regions of the wafer based on the difference between the estimated and target performance; and finally, adjusting at least one process parameter in subsequent process steps according to this recipe to proactively correct electrical performance deviations. This invention achieves a shift from offline feedback to online feedforward, and by integrating spatial modeling and intelligent decision-making, it can suppress wafer-level process fluctuations in real time, proactively, and accurately, significantly improving chip electrical performance uniformity and manufacturing yield.

The embodiment of the invention provides a compensation determination method of a semiconductor structure and a related device, and the method comprises the steps: obtaining a target image containing a line structure; on the basis of a preset compensation range, performing compensation of different compensation sizes on the tail end of the line structure; performing contour extraction on the compensation image; performing multi-position sampling on the tail end of the line structure after contour extraction to obtain the contour key size of each sampling position; based on the contour key size and the sampling position, tail end curves corresponding to different compensation sizes are constructed, the tail end curves are used for indicating the contour key size of the line structure in a preset direction, and the preset direction is the extension direction of the line structure; selecting a target tail end curve meeting a process compensation condition from the tail end curves of the line structures corresponding to different compensation sizes; and determining a target compensation range based on the compensation size corresponding to the target end curve. According to the embodiment of the invention, the compensation effect of performing tail end compensation on the line structure is improved.

The present invention provides a method for automatically controlling film thickness and element doping concentration within the film, which is applicable to the field of semiconductor processing. Specifically, the method first uses the calculation formula provided by the present invention to calculate the total amount of reaction gas remaining in at least one batch of operations performed before a furnace tube reaction, that is, the actual amount of reaction gas remaining in the furnace tube reaction chamber. Then, based on the actual situation, the process compensation parameters required for this process are designed (set). Then, while forming the target film (or film layer) in the furnace tube reaction chamber, the influence of the residual reaction gas in the furnace tube reaction chamber on the film thickness and element doping concentration formed in this process is automatically eliminated.

Embodiments of the present application provide a process compensation method for a semiconductor process equipment and the semiconductor process equipment, the method comprising: obtaining a set process time of a current process; obtaining a target life of a target material used by the current process and a wafer quantity of processes completed in a cleaning period, in a case that a process compensation function is turned on; determining a compensated process time according to the set process time, the target life and the wafer quantity of processes completed in the cleaning period, and performing the process according to the compensated process time. The present application introduces a dimension of the wafer quantity of processes completed in the cleaning period, which can effectively cover the case that the wafer coating condition changes after the periodical cleaning of the process chamber, and through the process time compensation based on the target life and the wafer quantity of processes completed in the cleaning period, the physical vapor deposition system can keep a high uniformity of the wafer coating in the continuous process.

This invention relates to the fields of digital twin, chemical process control, and industrial intelligent management, specifically to a digital twin-based MOC intelligent identification and process analysis management system. The system includes a data acquisition module, an intent parsing and injection module, a topology map construction module, a spatiotemporal transmission simulation module, and a health assessment and feedback module. It acquires change intent data, digital twin base data, and real-time operational data; extracts the change content as parameterized features and generates micro-perturbation vectors, injects them into target topology nodes, constructs a cross-domain process topology map, iteratively generates predicted values ​​for each process parameter according to a preset time step, compares these values ​​with safety critical thresholds, and outputs a global health assessment result. When there is a risk of exceeding limits, it calculates the adjustment amount in reverse and generates a process compensation scheme; when safe, it outputs normal operation confirmation information, achieving early identification and compensation guidance for future risks of local changes.

The application relates to the field of steel metallurgy automatic control, and discloses a steel production equipment self-adaptive regulation and control method and system based on instantaneous energy efficiency characteristic feedback. The method synchronously collects equipment operation states and material flow data in a millisecond level period, and solves an instantaneous characteristic value representing unit effective output energy consumption intensity by using an energy consumption-material coupling model; under the limitation of a process stability constraint model, based on the comparison result of the instantaneous characteristic value and a dynamic reference threshold value, a physical correction instruction is automatically generated to drive an actuator to execute closed-loop regulation. The application converts the energy efficiency index into a real-time process control variable, realizes dynamic balance of energy efficiency optimization and process stability, and deals with irreversible material loss through cross-process compensation.

This invention relates to the field of electronic device packaging technology, and more particularly to a diode and packaging method for packaging negative ion generators and igniters. The method uses an image recognition system to detect the assembled die after dispensing, generating die defect data including overall offset, relative misalignment, and height deviation. Based on the comparison of the defect data with corresponding preset thresholds, the compensability of the defect is determined, and if compensability is achieved, the corresponding stress defect type and stress defect factor are further determined. Then, differentiated compensation instructions are generated according to different stress defect types, thereby dynamically adjusting the injection molding parameters according to the compensation instructions and stress defect factor to complete the packaging and obtain the diode. This invention achieves accurate diagnosis and proactive process compensation for dual-chip-specific packaging defects, effectively improving packaging yield and product reliability.

This application relates to the field of semiconductor technology and discloses a temperature control method, apparatus, readable medium, and electronic device for a machine tool heating system. The temperature control method for the machine tool heating system of this application includes: acquiring relevant data of the heater; determining a feedforward gain and a disturbance amount based on the relevant data of the heater, wherein the feedforward gain is used to determine the feedforward compensation power of the heater in conjunction with the disturbance amount when a sudden increase in the disturbance amount is detected; determining a dissipation model of the heater based on the relevant data of the heater, and determining the dissipation compensation power of the heater based on the dissipation model; determining the process compensation power of the heater if the set process compensation conditions are met under the machine tool liquid spraying condition; and determining the target heating power of the heater based on the feedforward compensation power, the dissipation compensation power, and the process compensation power. This application has the advantages of improving temperature control response speed, realizing multi-dimensional power compensation synergy, and improving temperature stability in semiconductor manufacturing processes.

The invention relates to the field of material preparation, in particular to a continuous preparation method of a UTG finished product. The method comprises the following steps of: executing related procedures such as a carrier tape 1 treatment procedure, a double-sided coating procedure, a laser processing procedure and a post-treatment procedure in sequence, and further setting quality interlocking control, production system cooperative control, a process compensation mechanism and the like, so that parameters of each procedure are optimized and subjected to related control; the parameters include carrier tape binding force, coating speed and thickness, laser processing parameters, hydrofluoric acid processing parameters and the like. The continuous preparation device achieves the technical effects that continuous preparation of the UTG finished product is achieved, the stability and consistency of the product quality are guaranteed, and the production efficiency and the product performance are improved.

The present invention discloses a batch analysis and compensation processing method and apparatus for differential housings, relating to the field of differential housing processing. The method comprises: obtaining a target size and target tolerance of the differential housing to be tested, wherein the target tolerance includes at least one of the following: a standard tolerance interval and a desired tolerance interval, wherein the standard tolerance interval includes the desired tolerance interval; obtaining a set of measured dimension values ​​of the differential housing to be tested; determining a set of deviation values ​​of the differential housing to be tested based on the target size and the measured dimension value set of the differential housing to be tested, wherein the deviation value set is a set of differences between each value in the measured dimension value set and the target size; and determining a compensation result based on the deviation value set and the target tolerance, wherein the compensation result includes performing processing compensation on the differential housing to be tested and not performing processing compensation on the differential housing to be tested. The present invention solves the technical problems of low measurement efficiency and low accuracy of differential housings.

The invention discloses an arc fuse additive manufacturing method and system based on an array type and a layer height compensation strategy, and the method comprises the steps: carrying out the part array of a to-be-machined part, and obtaining an array model; performing array type path planning on the array model to obtain an additive manufacturing path and a processing pause layer number; then, processing code conversion is conducted on the additive manufacturing path, and additive layer-by-layer processing is started; in the machining process, every time N layers are machined, forming height measurement is conducted on the machined area, the machined height is obtained, the machined height is input into a process compensation strategy to adjust machining parameters, and the N layers continue to be machined till part machining is completed; according to the method, multiple parts are alternately and synchronously machined in the material adding process, the problems of high heat accumulation of the arc fuse layer and poor forming precision are systematically solved, the printing efficiency is guaranteed, and the printing quality is not affected.

The invention discloses a time hopping signal merging method and system suitable for high-dynamic satellite communication, and belongs to the field of spatial information transmission. The device comprises a frequency offset pre-compensation unit, a time hopping pattern-frequency offset-phase offset parameter coding unit, a genetic population initialization and updating unit, a frequency offset compensation and time hopping solving unit, a phase offset compensation and signal merging unit and a fitness calculation and convergence judgment unit. A genetic algorithm and Doppler parameter compensation are fused, joint coding is carried out on time hopping patterns, frequency offset and phase offset parameters, optimal selection is achieved through global search of the genetic algorithm, and efficient compensation and coherent combination of signals under the condition of a low signal-to-noise ratio are achieved. Time hopping parameter coding, crossing, variation and fitness calculation are carried out by adopting a genetic algorithm, a time hopping signal combination method is assisted by the genetic algorithm, and full-flow compensation of signal parameters is realized through frequency offset pre-compensation, phase alignment and multi-hop signal combination processing. Through frequency offset pre-compensation and multi-hop phase alignment, the signal-to-noise ratio of the combined signals is significantly improved, and the bit error rate is reduced.

This invention discloses a method and system for flexible voltage regulation of low-voltage distribution networks based on multi-compensation mode determination, belonging to the field of voltage regulation technology. By real-time acquisition of voltage signals from the low-voltage distribution network and extraction of voltage amplitude, phase, and harmonic component information, long-process compensation gap characteristics are extracted based on a sliding time window. The system determines whether to enter a compensation mode and identifies the compensation type. When compensation is required, a dynamic phase compensation signal or an adaptive harmonic injection signal is generated based on the compensation type, and a composite control command is fused to drive the AC / DC / AC converter unit to output a compensation voltage to the grid. This solution overcomes the limitations of traditional single-amplitude compensation, achieving three-dimensional coordinated flexible regulation of the amplitude, phase, and harmonic components of the low-voltage distribution network voltage, and possesses intelligent sensing and precise compensation capabilities for long-process, complex power quality problems.

An embodiment of the present invention provides a coating control method for semiconductor process equipment and semiconductor process equipment, the method comprising: obtaining abnormal discharge information within a target time; adding an increment corresponding to the abnormal discharge information to the compensation process time; comparing the executed process time plus the target time with the process setting time, and continuing the process stage and executing the next target time process, or updating the process time according to the updated compensation process time, performing the compensation process stage, executing the next target time process, or terminating the process, based on whether the process compensation stage has been reached and / or whether the abnormal discharge information meets preset requirements. The impact of abnormal discharge on coating is automatically incorporated into the entire process through an automated algorithm, and the impact of abnormal discharge on coating film thickness or quality can be automatically compensated, thereby improving the automation level of the machine, avoiding the problem of reduced production capacity due to abnormal discharge, and saving production costs.

The application provides a kind of semiconductor pipeline weld intelligent detection and compensation method based on spatial attention, wherein, the method includes based on the 2D image and 3D point cloud of the collected welded special gas pipeline, the internal fusion zone image, the external fusion zone image, the internal heat affected zone image and the external heat affected zone image of the welded special gas pipeline are identified;The internal fusion zone image, the external fusion zone image, the internal heat affected zone image and the external heat affected zone image of the welded special gas pipeline are respectively input into the pre-trained welding defect identification model to obtain the defect identification result output by the welding defect identification model, and the defect identification result is used to indicate the welding defect type and defect quantization out-of-tolerance degree value existing in the welded special gas pipeline;Based on the defect identification result, the corresponding process compensation scheme is matched in the process parameter association library to adjust the welding process parameters of the tungsten rail welding equipment for subsequent welding special gas pipeline.

This invention discloses an efficient method for fabricating and debugging a DFB laser grating, comprising: acquiring the width and depth of the grating lines through electron microscopy to form an initial parameter set; identifying abnormal regions by comparing design parameters; analyzing the spatial distribution pattern of parameters in abnormal regions and classifying process fluctuation types; selectively filtering the geometric parameter sequence according to the fluctuation type to obtain correction parameters; evaluating the impact on the output wavelength based on the correction parameters and generating process compensation coefficients when deviations are predicted; optimizing structural parameters through process simulation; and finally generating control commands to drive the etching equipment to adjust the process in real time, and confirming performance compliance through monitoring. This invention can intelligently diagnose the root cause of fluctuations, accurately correct parameters, and achieve closed-loop control, effectively improving the anti-interference capability, control accuracy, and efficiency of the fabrication process.

This invention relates to the field of automated detection technology and discloses a detection method for a multi-sensor controller based on a host computer. The method includes: loading configuration on the host computer and establishing a communication connection; issuing an asymmetric test sequence, acquiring multi-channel signals, and performing interpolation alignment based on hardware timestamps to obtain synchronization data; extracting synchronization data features, executing a cross-modal correlation discrimination algorithm, and determining whether baseline drift exceeding limits is attributed to system crosstalk pseudo-anomalies or hardware functional faults by calculating correlation coefficients; performing classification closed-loop processing based on the determination results; resetting the system and establishing a detection file. This invention achieves time-domain synchronization alignment of heterogeneous signals, accurately decouples pseudo-anomalies caused by underlying physical faults and electromagnetic crosstalk, and pre-processes compensation operations to reduce the computational overhead of the terminal controller. Simultaneously, it utilizes underlying hardware verification to prevent illegal transfer of compensation data.