Electroplating apparatus

A kind of electroplating equipment and plating technology, applied in the direction of plating tank, electrolytic process, electrolytic components, etc., can solve problems such as corrosion and not yet achieved remarkable results, achieve good plating and improve operating efficiency

Active Publication Date: 2013-04-03
KMW INC
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  • Abstract
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AI Technical Summary

Problems solved by technology

It is speculated that even when the pre-plating treatment such as stripping the black film and zincate treatment is carried out on the body of magnesium material, the solution and air during the treatment material and plating may pass through the tiny gaps left on the surface. Contact occurs, resulting in this corrosion
[0007] Therefore, in order to solve the corrosion problem and realize the safe adhesion of the coating when plating on the object to be plated made of magnesium, technical research in this area has been done all the time, but so far, no feasible results have been obtained. Notable achievements in solving the above problems

Method used

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  • Electroplating apparatus
  • Electroplating apparatus
  • Electroplating apparatus

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Embodiment Construction

[0020] The following will be combined with Figures 1 to 4 , to describe exemplary embodiments of the present invention in detail. In the following drawings, the same components are denoted by the same reference numerals as much as possible.

[0021] Such as figure 1 As shown, the electroplating device of the present invention, especially the object to be plated (1) of magnesium material (or magnesium alloy material), basically has a plating container containing an electrolyte containing metals such as copper or silver for plating (10). At this time, according to the characteristics of the present invention, there is an electrolyte injection part (20), which, after obtaining the electrolyte supply of the plating container (10), passes through multiple nozzles ( figure 2 22) to spray the electrolyte. In addition, there is also a circulation pump (40) for supplying electrolyte to the electrolyte injection part (20). ), the circulating pump (40) supplies the pressure of the...

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Abstract

The present invention relates to an electroplating apparatus comprising: a plating vessel for accommodating an electrolyte containing ions of the metal to be plated; an electrolyte spraying part for receiving the electrolyte and spraying same onto a predetermined area of the object to be plated using at least one spray nozzle; and a circulation pump for sucking the electrolyte in the plating vessel and supplying same to the electrolyte spraying part at a predetermined pressure, so that the electrolyte can be sprayed from the electrolyte spraying part.

Description

technical field [0001] The invention relates to an electroplating equipment, in particular to an electroplating equipment suitable for plating a conductive metal film on an object to be plated made of magnesium or magnesium alloy. Background technique [0002] Generally, the structure of electroplating equipment is that the object to be plated is connected to the cathode (negative terminal), the metal plate (plating body) for plating material is connected to the anode (positive terminal), and the object to be plated and the metal plate are immersed in the It is used in the electrolyte of the metal ions to be plated and an electric current is applied, so that the desired metal ions are deposited on the surface of the object to be plated, so as to complete the plating operation of the object to be plated. This electroplating method is a kind of wet plating method. [0003] The current level of electroplating technology has reached the level, and can be plated on all kinds of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D17/00C25D21/06C25D17/02C25D17/06
CPCC25D17/02C25D17/00C25D17/06C25D21/06C25D5/026C25D21/14
Inventor 金润龙
Owner KMW INC
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