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Full-automatic anti-residue automatic electroplating device

An electroplating device, fully automatic technology, applied in the direction of plating tank, electrolysis process, electrolysis components, etc., can solve the problems of affecting the quality of coating, reducing the quality of workpiece electroplating, lack of surface cleaning mechanism, etc., to optimize the working process, safe and convenient to use, The effect of improving the coating quality

Inactive Publication Date: 2020-08-07
刘理仁
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention provides a fully automatic anti-residue automatic electroplating device, which can effectively solve the problem that the electroplating device proposed in the above background technology lacks a surface cleaning mechanism in the electroplating process, causing the surface of the workpiece in the electroplating process to be damaged after one electroplating or cleaning. A large amount of electroplating solution or washing solution remains, which will affect the quality of the coating when the workpiece is electroplated for the next layer, thereby reducing the overall electroplating quality of the workpiece

Method used

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  • Full-automatic anti-residue automatic electroplating device
  • Full-automatic anti-residue automatic electroplating device
  • Full-automatic anti-residue automatic electroplating device

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Embodiment

[0058] Example: such as Figure 1-7 As shown, the present invention provides a technical solution, a fully automatic anti-residue automatic electroplating device, including an installation base plate 1, and the four corners of the top end of the installation base plate 1 are fixedly connected with support base columns 2, which are located at the position of the installation base plate 1. One side of the support bottom column 2 is fixedly connected with an electrical control cabinet 3, the top of the support bottom column 2 is fixedly connected with a support slide rail 4, and the top of the support slide rail 4 is movably connected with a driving slide 5, and the top side of the drive slide 5 is fixed Connected with a support vertical plate 6, the top of the support vertical plate 6 is fixedly connected with a lifting installation box 7, the middle part of the inner side of the lifting installation box 7 is rotatably connected with a lifting shaft 8, and the outer side of the l...

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Abstract

The invention discloses a full-automatic anti-residue automatic electroplating device. The full-automatic anti-residue automatic electroplating device comprises an installation bottom plate, wherein support bottom columns are fixedly connected to four corners of the top end of the installation bottom plate, support sliding rails are fixedly connected to the top ends of the support bottom columns,belt winding rollers are fixedly connected to the position, corresponding to the inner position of a lifting installation box, of the outer side of a lifting rotating shaft, and a surface cleaning mechanism is fixedly connected to the position, corresponding to the inner positions of support vertical plates, of the bottom end of a traction belt. A rotating motor drives a transmission rotating shaft and transmission bevel gears to rotate, the transmission bevel gears drive rotating vertical shafts and rotating bevel gears to rotate, then workpieces are driven to rotate through material hangingmechanisms, and in the rotating process of the workpieces, electroplate liquid and washing liquid left on the surfaces of the workpieces are separated from the workpieces under the action of centrifugal force, so that residual electroplate liquid and washing liquid are effectively prevented from being left on the workpieces and affecting next layer of electroplating of the workpieces, and the coating quality of the workpieces is improved.

Description

technical field [0001] The invention relates to the technical field of electroplating equipment, in particular to a fully automatic anti-residue automatic electroplating device. Background technique [0002] Electroplating is the process of plating a thin layer of other metals or alloys on the surface of certain metals using the principle of electrolysis. It is a process of using electrolysis to attach a layer of metal film to the surface of metal or other material parts to prevent metal oxidation. To improve wear resistance, conductivity, reflectivity, corrosion resistance and enhance the appearance, etc., the electroplating device needs to be used in the process of electroplating the workpiece; [0003] However, due to the lack of surface cleaning mechanism in the electroplating process, the electroplating devices currently on the market will cause a large amount of electroplating solution or cleaning solution to remain on the surface of the workpiece in the electroplating...

Claims

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Application Information

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IPC IPC(8): C25D21/10C25D17/08C25D5/48C25D21/04C25D21/06C25D21/18C25D17/02C25D19/00
CPCC25D5/48C25D17/02C25D17/06C25D21/04C25D21/06C25D21/10C25D21/18
Inventor 刘理仁
Owner 刘理仁
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