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Cyanide-free electroplating bath for copper plating of iron and steel parts

An electroplating solution and copper plating technology, applied in the field of cyanide-free electroplating solution, can solve problems such as poor bonding force, and achieve the effects of good bonding force, simple plating solution composition, and reduced energy consumption

Inactive Publication Date: 2011-04-20
GUANGZHOU JINHUI CHEM SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing cyanide-free copper plating solutions mainly include pyrophosphate copper plating, sulfate copper plating, ethylenediamine copper plating, fluoroborate copper plating, citric acid-tartaric acid copper plating and sulfamic acid copper plating systems. When the plating solution is used for copper plating of steel parts, there is a problem of poor bonding force

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] The present invention is used for the cyanide-free electroplating solution of iron and steel substrate copper plating, contains following material:

[0021] Copper sulfate 35g / L

[0022] Potassium carbonate 20g / L

[0023] Amino trimethylene phosphonic acid 100g / L

[0024] Nitrilotriacetic acid 13g / L

[0025] Phytic acid 13g / L

[0026] Sodium citrate 200g / L

[0027] Preparation of electroplating solution: Accurately weigh 35g of copper sulfate and add 200ml of water to fully dissolve, dissolve 20g of potassium carbonate, 100g of aminotrimethylene phosphonic acid, 13g of nitrilotriacetic acid, 13g of phytic acid and 200g of sodium citrate in water, and stir continuously to dissolve the sulfuric acid Add the copper solution to the above solution, adjust the pH to 9 with KOH, and add water until the volume of the solution is 1 L.

[0028] The temperature of the electroplating solution during electroplating is 25°C, and the cathode current density of the electroplating ...

Embodiment 2

[0030] The composition of cyanide-free electroplating solution:

[0031] Copper sulfate 40g / L

[0032] Potassium carbonate 60g / L

[0033] Hydroxyethylene-1,1 phosphonic acid 200g / L

[0034] Nitrilotriacetic acid 20g / L

[0035] Phytic acid 20g / L

[0036] Potassium thiocyanate 10g / L

[0037] Preparation of electroplating solution: Accurately weigh 40g of copper sulfate and add 500ml of water to fully dissolve, dissolve 60g of potassium carbonate, 200g of hydroxyethylidene-1,1 phosphonic acid, 20g of nitrilotriacetic acid, 20g of phytic acid and 10g of potassium thiocyanate in water Add copper sulfate solution to the above solution with constant stirring, adjust the pH to 10 with KOH, and add water until the volume of the solution is 1 L.

[0038] The temperature of the electroplating solution during electroplating is 30°C, and the cathode current density of the electroplating copper solution is 1.5A / dm 2

Embodiment 3

[0040] The composition of cyanide-free electroplating solution:

[0041] Copper sulfate 60g / L

[0042] Potassium carbonate 60g / L

[0043] Ethylenediaminetetramethylenephosphonic acid 100g / L

[0044] Nitrilotriacetic acid 1g / L

[0045] Phytic acid 1g / L

[0046] Potassium thiocyanate 10g / L

[0047] Sodium Potassium Tartrate 20g / L

[0048] Preparation of electroplating solution: Accurately weigh 60g of copper sulfate and add 500ml of water to fully dissolve, mix 60g of potassium carbonate, 100g of ethylenediamine tetramethylene phosphonic acid, 1g of phytic acid, 1g of nitrilotriacetic acid, 10g of potassium thiocyanate and 20g of potassium tartrate Dissolve sodium in water, add copper sulfate solution to the above solution with constant stirring, adjust the pH to 10 with KOH, add water until the volume of the solution is 1L.

[0049] The use temperature of the electroplating solution during electroplating is 30°C, and the cathode current density of the electroplating coppe...

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PUM

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Abstract

The invention discloses a cyanide-free electroplating bath for the copper plating of iron and steel parts. The electroplating bath provided by the invention comprises copper sulphate, potassium carbonate, one or more than two of organic phosphate and phytic acid, and one or more than two of sodium citrate, seignette salt and potassium thiocyanate. The electroplating bath provided by the invention is applied to the copper plating of the iron and steel parts, and has the advantages of fine and compact coating crystals, dispersing power and covering power both superior to those of cyaniding copper-plating solution, simple components, stability, no decomposition products, no need of heating, reduction in energy consumption and a strong binding force between a coating and a substrate.

Description

technical field [0001] The invention relates to a cyanide-free electroplating solution, in particular to a cyanide-free electroplating solution for copper plating of iron and steel parts. Background technique [0002] Cyanide copper plating has been used for more than a century. Cyanide is an ideal complexing agent and a good activator. Therefore, cyanide copper plating has the advantage of combining well with steel substrates and can be used on steel substrates. Plating directly on the parts. However, the cyanide electroplating copper solution contains cyanide ions, which is highly toxic, difficult to handle waste water and liquid waste, seriously pollutes the environment, and endangers human health. In recent years, with the continuous promotion of cleaner production, some polluting processes in the electroplating industry will be eliminated. Therefore, people have been looking for a cyanide-free copper plating process that can replace cyanide electroplating copper. The ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38
Inventor 陈少慧
Owner GUANGZHOU JINHUI CHEM SCI TECH
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