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Reduced-form composite complexing non-cyanide chemical gold plating liquid and method

A cyanide chemical and reduction-based technology, which is applied in liquid chemical plating, metal material coating process, coating, etc., can solve the problems of limited cyanide-free chemical gold plating, difficult plating solution stability, and low service life of the plating solution. , to achieve the effect of wide application range, improved stability, dense and smooth coating

Inactive Publication Date: 2016-02-24
广东致卓环保科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the existing chemical gold plating process, it is difficult to solve the stability problem of the plating solution, the plating solution is sensitive to impurity ions such as iron, nickel, cobalt, and the service life of the plating solution is low, which limits the development of cyanide-free chemical gold plating

Method used

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  • Reduced-form composite complexing non-cyanide chemical gold plating liquid and method
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  • Reduced-form composite complexing non-cyanide chemical gold plating liquid and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Plating solution composition:

[0027]

[0028] Pretreatment solution:

[0029]

[0030] Conditional control:

[0031] Pretreatment temperature 40°C, pH 8.5, time 2 minutes;

[0032] Plating temperature 65°C, pH 8.5, time 10 minutes;

[0033] Sample effect: dense coating, bright color.

Embodiment 2

[0035] Plating solution composition:

[0036]

[0037] Pretreatment solution:

[0038]

[0039] Conditional control:

[0040] Pretreatment temperature 50°C, pH 7, time 1 minute;

[0041] The plating temperature is 70° C., pH 7, and the time is 10 minutes.

Embodiment 3

[0043] Plating solution composition:

[0044]

[0045] Pretreatment solution:

[0046]

[0047] Conditional control:

[0048] The pretreatment temperature is 30°C, pH 6.5, and the time is 3 minutes.

[0049] The plating temperature is 60°C, the pH is 6.5, and the time is 10 minutes.

[0050] Compared with the prior art, the present invention adopts the composite complexing agent, which can improve the stability of gold ions, and the coating is dense and smooth; it uses two steps to carry out the chemical gold plating method: 1. pretreatment of the substrate → 2. chemical gold plating, which can make The stability of the plating solution is higher, and it is suitable for the gold plating treatment of metal surfaces such as copper, nickel, cobalt, palladium, gold and their alloys. It has good process stability, long continuous production cycle, bright coating color, good corrosion resistance and weather resistance, etc. features.

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PUM

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Abstract

The invention discloses reduced-form composite complexing non-cyanide chemical gold plating liquid and a method. The reduced-form composite complexing non-cyanide chemical gold plating liquid is characterized by being preparing from 0.2-10 g / L of non-cyanide gold salt, 10-100 g / L of composition complexing agent, 5-30 g / L of reducing agent, 5-30 g / L of buffering agent and 0.01-10 g / L of stabilizing agent. The composition complexing agent used in the liquid can improve the stability of gold ions and enables a plated layer to be compact and smooth; and the reduced-form composite complexing non-cyanide chemical gold plating liquid has the beneficial effects that process stability is good, a long continuous production cycle is achieved, and the plated layer is bright in color, good in corrosion resistance and weather resistance and the like.

Description

technical field [0001] The invention belongs to the technical field of gold-plating processing, and more specifically relates to a reducing compound coordination non-cyanide chemical gold-plating process technology. Background technique [0002] Gold has good decoration, solderability, corrosion and wear resistance, oxidation resistance and other properties, so gold processing technology is widely used in daily decoration, packaging, semiconductor, PCB, IC packaging technology and other fields. In order to save costs, gold plating technology is generally used to meet application requirements. There are usually two methods to obtain gold plating: electroplating and electroless plating. In recent years, in order to adapt to the development of miniaturization and high performance of electronic components and high-density interconnection (HDI) technology, the demand for electroless gold plating technology has been increasing. [0003] The early electroless gold plating technolo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/44
Inventor 谢金平李冰范小玲李宁宗高亮
Owner 广东致卓环保科技有限公司
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