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Chemical immersion tin plating solution and preparation method thereof

A technology of chemical immersion plating and tin liquid, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problems of poor process stability and short service life, and achieve the promotion of film formation and coating solderability. Good, easy wetting effect

Inactive Publication Date: 2018-12-21
CHONGQING LIDAO SURFACE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the chemical immersion tin plating solution has short service life and poor process stability needs to be solved

Method used

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  • Chemical immersion tin plating solution and preparation method thereof
  • Chemical immersion tin plating solution and preparation method thereof
  • Chemical immersion tin plating solution and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0027] The electroless tin plating solution of the present embodiment comprises the following components by concentration: 20g / L of tin salt, 80g / L of accelerator, 0.2g / L of wetting agent, 170g / L of stabilizer; Wherein: described tin salt is formazan Tin protosulfonate 20g / L; The accelerator is thiourea 80g / L, ammonium bifluoride 0.1g / L; The wetting agent is alkylphenol polyoxyethylene ether 0.2g / L, and the stabilizer is Methanesulfonic acid 150g / L, tartaric acid 20g / L.

[0028] The preparation method of the electroless tin-plating solution of the present embodiment, comprises the steps:

[0029] (1) Dissolve 150g of methanesulfonic acid and 20g of tartaric acid in 500ml of deionized water, and stir until dissolved;

[0030] (2) Add 80g of thiourea and 0.1g of ammonium bifluoride to the above solution, and stir until dissolved;

[0031] (3) Add 0.2g of alkylphenol polyoxyethylene ether and stir until dissolved;

[0032] (4) Chemical immersion tin plating liquid: use 200ml d...

Embodiment 2

[0045] The electroless tin plating solution of the present embodiment comprises the following components according to concentration: tin salt 10g / L, accelerator 80g / L, wetting agent 0.2g / L, stabilizer 170g / L;

[0046] Wherein: the tin salt is stannous sulfate 10g / L; the accelerator is methylthiourea 80g / L, sodium fluoride 0.1g / L; the wetting agent is polyethylene glycol (M=600) 0.2g / L, described stabilizing agent is methanesulfonic acid 150g / L, tartaric acid 20g / L; The preparation method of the chemical immersion tin plating solution of the present embodiment, comprises the steps:

[0047] (1) Use deionized water to dissolve a certain amount of methanesulfonic acid, and fully stir until dissolved;

[0048](2) Add quantitative methylthiourea and sodium fluoride to the above solution, fully stir until dissolved;

[0049] (3) Add quantitative polyethylene glycol again, fully stir until dissolving;

[0050] (4) Chemical immersion tin plating solution: finally add stannous sulfat...

Embodiment 3

[0063] The electroless tin plating solution of the present embodiment comprises the following components by concentration: tin salt 15g / L, accelerator 80g / L, wetting agent 0.2g / L, stabilizer 120g / L;

[0064] Wherein: the tin salt is stannous chloride 15g / L; the accelerator is thiourea 80g / L, ammonium bifluoride 0.1g / L. The wetting agent is 0.2g / L of alkylphenol polyoxyethylene ether, and the stabilizer is 100g / L of sulfuric acid and 20g / L of citric acid; the preparation method of the chemical immersion tin plating solution of the present embodiment comprises the following steps :

[0065] (1) Use deionized water to dissolve quantitative sulfuric acid, fully stir until dissolved;

[0066] (2) Add quantitative thiourea and ammonium bifluoride to the above solution, fully stir until dissolved;

[0067] (3) Add quantitative alkylphenol polyoxyethylene ether, fully stir until dissolved;

[0068] (4) Chemical immersion tin plating solution: add a certain amount of stannous chlori...

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Abstract

The invention relates to a chemical immersion tin plating solution and a preparation method thereof. The chemical immersion tin plating solution is composed of tin salt, an accelerant, a wetting agentand a stabilizer, wherein the mass concentration of the tin salt is 5-20 g / L, the mass concentration of the accelerant is 30-200 g / L, the mass concentration of the wetting agent is 0.1-0.5 g / L, the mass concentration of the stabilizer is 50-170 g / L. Under reasonable concentration proportioning and the synergistic effect of all the components, the chemical immersion tin plating solution is very stable, the plating layer is uniform, compact and semi-bright, moreover, the used working temperature is not high, the temperature is 35-45 DEG C, plating is carried out for 10-15 minutes, the thicknessof the plating layer can reach about 1.5-2 microns, and the plating layer is good in weldability.

Description

technical field [0001] The invention belongs to the field of surface treatment, and in particular relates to a chemical immersion tin plating solution and a preparation method thereof. Background technique [0002] In today's electronics industry, with the rapid development of SMD technology, more and more thinner and more complex circuits appear on the PCB board, all of which require the PCB board to be uniform, flat, and able to survive long-term storage and multiple It still has excellent solderability after several temperature cycles. Over the past few years, the PCB industry has been searching for an ideal final coating method. Although several alternative processes have been tested, a truly ideal final coating process has not yet emerged. In terms of final panel processing, hot air solder leveling is the most discussed process, but as far as the process itself is concerned, its process is complicated, the cost is high, and the processed panels are not satisfactory. ...

Claims

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Application Information

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IPC IPC(8): C23C18/52
CPCC23C18/52
Inventor 胡国辉肖春艳包海生李礼刘军
Owner CHONGQING LIDAO SURFACE TECH
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