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Thermosetting cyanate resin composition and application of thermosetting cyanate resin composition

A cyanate ester, thermosetting technology, applied in layered products, synthetic resin layered products, chemical instruments and methods, etc., can solve the problem of low crosslinking density of phenolic cyanate esters

Active Publication Date: 2013-02-27
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the crosslinking density of described dicyclopentadiene structure-containing phenolic cyanate ester is low, so water absorption, coefficient of thermal expansion, heat resistance and heat and humidity resistance all need to be further improved

Method used

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  • Thermosetting cyanate resin composition and application of thermosetting cyanate resin composition
  • Thermosetting cyanate resin composition and application of thermosetting cyanate resin composition
  • Thermosetting cyanate resin composition and application of thermosetting cyanate resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0090] Add 10 parts of composition 1, 15 parts of biphenyl-containing epoxy resin NC3000H, 60 parts of SC2050, 15 parts of brominated styrene, and an appropriate amount of catalyst zinc octoate and 2-PI into a beaker, and dissolve with 70 parts of MEK. And formulated into a glue of suitable viscosity. Use 7628 electronic grade glass cloth to soak the glue, and remove the solvent in an oven at 155°C to obtain a B-stage prepreg sample.

[0091] Use 8 sheets of 7628 prepreg stacks, and a 1-ounce electrolytic copper foil on the top and bottom, and laminate them through a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are as follows: (1) When the material temperature is 80-120°C, the heating rate is controlled at 1.0-3.0°C / min; (2) The pressure is set at 20kg / cm 2; (3) curing temperature at 220 ℃, and maintain this temperature for 90 minutes. The corresponding properties are shown in Table 1.

Embodiment 2

[0093] Add 20 parts of Synthesis 1, 20 parts of epoxy resin EXA9900 containing naphthalene structure, 40 parts of SC2050, 20 parts of SAYTEX8010 and an appropriate amount of catalyst zinc octanoate and 2-PI into a beaker, dissolve with 70 parts of toluene, and prepare a suitable Viscosity glue. Use 7628 electronic grade glass cloth to soak the glue, and remove the solvent in an oven at 155°C to obtain a B-stage prepreg sample.

[0094] Laminate 8 pieces of 7628 prepregs, with a 1-ounce electrolytic copper foil on the upper and lower sides, and laminate through a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are as follows: (1) When the material temperature is 80-120°C, the heating rate is controlled at 1.0-3.0°C / min; (2) The pressure is set at 20kg / cm 2 ; (3) curing temperature at 220 ℃, and maintain this temperature for 90 minutes. The corresponding properties are shown in Table 1.

Embodiment 3

[0096] Add 30 parts of composition 1, 40 parts of brominated novolac-containing epoxy resin BREN-S, 25 parts of SC2050, 5 parts of SAYTEX8010 and an appropriate amount of catalyst zinc octoate and 2-PI into a beaker, dissolve with 70 parts of DMF, and Prepare glue of suitable viscosity. Use 7628 electronic grade glass cloth to soak the glue, and remove the solvent in an oven at 155°C to obtain a B-stage prepreg sample.

[0097] Laminate 8 pieces of 7628 prepregs, with a 1-ounce electrolytic copper foil on the upper and lower sides, and laminate through a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are as follows: (1) When the material temperature is 80-120°C, the heating rate is controlled at 1.0-3.0°C / min; (2) The pressure is set at 20kg / cm 2 ; (3) curing temperature at 220 ℃, and maintain this temperature for 90 minutes. The corresponding properties are shown in Table 1.

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Abstract

The invention relates to a thermosetting cyanate resin composition, which comprises the following components: polyfunctional cyanate, epoxy resin, flame retardant agent and inorganic filler. The thermosetting cyanate resin composition is used for preparing resin substrates, resin compound metal copper foils, prepregs, laminating plates, copper-coating plate laminating plates, printed circuit boards and the like. The thermosetting cyanate resin composition has good heat resistant property, humidity resistant property and flame retardant property and low heat expansion coefficient.

Description

technical field [0001] The invention relates to the technical field of polymer resins, in particular, the invention relates to a thermosetting cyanate resin composition and its application in resin sheets, resin composite metal foils, prepregs, laminates, metal foil-clad laminates and printing application in printed circuit boards. Background technique [0002] With the rapid development of electronic and electrical products in the world, the environmental hazards of electronic and electrical product waste and toxic substances in electronic and electrical products are becoming more and more serious. Faced with pressure to protect the environment, the industry has switched from using lead-containing solders to lead-free solders. The temperature of lead-free solder is 20-30°C higher than that of lead-based solder. For some harsh process conditions, the lead-free solder temperature has reached 260°C or even 270°C. This directly leads to more stringent reliability tests for ci...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G61/02C08L65/00C08L63/00C08K3/36C08K3/34C08K3/22B32B27/06B32B27/28B32B27/38
Inventor 陈勇刘潜发曾宪平任娜娜张江陵
Owner GUANGDONG SHENGYI SCI TECH
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