Thermosetting cyanate resin composition and application of thermosetting cyanate resin composition
A cyanate ester, thermosetting technology, applied in layered products, synthetic resin layered products, chemical instruments and methods, etc., can solve the problem of low crosslinking density of phenolic cyanate esters
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Embodiment 1
[0090] Add 10 parts of composition 1, 15 parts of biphenyl-containing epoxy resin NC3000H, 60 parts of SC2050, 15 parts of brominated styrene, and an appropriate amount of catalyst zinc octoate and 2-PI into a beaker, and dissolve with 70 parts of MEK. And formulated into a glue of suitable viscosity. Use 7628 electronic grade glass cloth to soak the glue, and remove the solvent in an oven at 155°C to obtain a B-stage prepreg sample.
[0091] Use 8 sheets of 7628 prepreg stacks, and a 1-ounce electrolytic copper foil on the top and bottom, and laminate them through a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are as follows: (1) When the material temperature is 80-120°C, the heating rate is controlled at 1.0-3.0°C / min; (2) The pressure is set at 20kg / cm 2; (3) curing temperature at 220 ℃, and maintain this temperature for 90 minutes. The corresponding properties are shown in Table 1.
Embodiment 2
[0093] Add 20 parts of Synthesis 1, 20 parts of epoxy resin EXA9900 containing naphthalene structure, 40 parts of SC2050, 20 parts of SAYTEX8010 and an appropriate amount of catalyst zinc octanoate and 2-PI into a beaker, dissolve with 70 parts of toluene, and prepare a suitable Viscosity glue. Use 7628 electronic grade glass cloth to soak the glue, and remove the solvent in an oven at 155°C to obtain a B-stage prepreg sample.
[0094] Laminate 8 pieces of 7628 prepregs, with a 1-ounce electrolytic copper foil on the upper and lower sides, and laminate through a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are as follows: (1) When the material temperature is 80-120°C, the heating rate is controlled at 1.0-3.0°C / min; (2) The pressure is set at 20kg / cm 2 ; (3) curing temperature at 220 ℃, and maintain this temperature for 90 minutes. The corresponding properties are shown in Table 1.
Embodiment 3
[0096] Add 30 parts of composition 1, 40 parts of brominated novolac-containing epoxy resin BREN-S, 25 parts of SC2050, 5 parts of SAYTEX8010 and an appropriate amount of catalyst zinc octoate and 2-PI into a beaker, dissolve with 70 parts of DMF, and Prepare glue of suitable viscosity. Use 7628 electronic grade glass cloth to soak the glue, and remove the solvent in an oven at 155°C to obtain a B-stage prepreg sample.
[0097] Laminate 8 pieces of 7628 prepregs, with a 1-ounce electrolytic copper foil on the upper and lower sides, and laminate through a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are as follows: (1) When the material temperature is 80-120°C, the heating rate is controlled at 1.0-3.0°C / min; (2) The pressure is set at 20kg / cm 2 ; (3) curing temperature at 220 ℃, and maintain this temperature for 90 minutes. The corresponding properties are shown in Table 1.
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