51results about How to "Low moisture resistance" patented technology

A thermosetting resin composition comprising (1) a copolymer resin comprising (a) a monomer unit and (b) a monomer unit respectively represented by the following general formulae (I) and (II): <CHEM> wherein R<1> represents hydrogen, a halogen, or a C1-C5 hydrocarbon group; R<2> represents a halogen or a C1-C5 hydrocarbon group; x is 0 to 3; and each of m and n is a natural number, and (2) a cyanate resin having at least two cyanate groups per molecule. To provide a printed wiring board material and a printed wiring board for electronic appliance, having a low dielectric constant and a low dielectric dissipation factor as well as improved heat resistance.

A curable coating composition comprising: (a) a silicate, such as sodium silicate, potassium silicate or lithium silicate; (b) a phosphate, such calcium phosphate, magnesium phosphate or sodium phosphate; and (c) a metal oxide, such as magnesium oxide, aluminum (III) oxide, scandium (III) oxide, yttrium (III) oxide, or zirconium oxide. Such curable coating compositions may be used as non-thermochromic (tailored based on expected operating environment) thermal control coating compositions for application to spacecraft and components thereof. As an alternative metal oxide component, for use in lower temperature applications, or in applications for which thermochromism at elevated temperatures is not a concern, the metal oxide may comprise zinc oxide. Also provided is a curable coating composition comprising: (a) a silicate (e.g. as above); (b) a phosphate (e.g. as above); and (c) a metal sulphate, such as a barium sulphate. Cured coatings are also provided, as are thermal control coatings, thermal control paints, and processes for making coated substrates.