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Thermosetting resin composition, as well as prepreg and laminated board manufactured by using same

The invention discloses a thermosetting resin composition. The thermosetting resin composition comprises the following components in parts by solid weight: (a) 5-80 parts of modified epoxy resin; (b) 5-80 parts of cyanate ester resin; (c) 0-50 parts of fire retardant; (d) 0-100 parts of inorganic filler; and (e) 0-5 parts of curing accelerator. A preparation method of the modified epoxy resin comprises the following steps of: adding one or more of unsaturated monomers which have double bonds and in which an initiator is dissolved into the epoxy resin; heating to 30-60 DEG C and stirring uniformly; and then, heating to 60-150 DEG C, and performing a reaction for 2-8 hours. According to the thermosetting resin composition disclosed by the invention, the unsaturated monomers with double bonds are added into the epoxy resin for modification, therefore, compared with the traditional epoxy resin composition prepared by simple blending, the thermosetting resin composition disclosed by the invention has more excellent cohesiveness, thermal stability and wet and heat resistance; and a laminated board manufactured by using cyanate ester as a curing agent has low dielectric constant, low dielectric loss, high heat resistance and good wet and heat resistance.
Owner:SHENGYI TECH SUZHOU
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